PCB I-resin chemistry kunye nefilimu

1, ABS resin

It is a ternary mixture of Acrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), in which the rubber part of the butadiene can be corroded by chromic acid to form holes, and can be used as a landing point for chemical copper or nickel for further plating. Many parts on the circuit board are assembled by ABS plating.

2, inqanaba A

Varnish refers to the glass fiber cloth or cotton paper that is used to reinforce the Prepreg during its manufacturing process. The Varnish (also translates as Varnish water) of the resin is still in its monomer and diluted by the solvent, known as the A-stage. Xa ilaphu lefayibha yeglasi okanye iphepha lomqhaphu elifunxa iglu, nasemva komoya oshushu kunye nokomiswa kwe-infrared, ubunzima bemolekyuli yomnwe womthi buya kunyuka bungene kwi-complex okanye i-Oligomer, emva koko bunamathele kwinto eyomeleza ukwenza ifilimu. I-resin state ibizwa ngokuba yi-b-isigaba. When it is further softened by heat and further polymerized into the final polymer resin, it is called C-stage.

3. Iphepha lokuBopha (umaleko) Iphepha lokuBopha, emva koko umaleko

Khomba kwibhodi ye-multilayer engqongqo ukuze ulaminishe umanyano “wefilimu”, okanye ibhodi ethambileyo “itafile yokukhusela itafile” umaleko olandelayo phakathi kobuso bayo bebhodi

B) Stage B) Stage

Ibhekisa kwisimo se-polymerization kunye ne-semi-hardening state ye-thermosetting resin, enjenge-resin eqhotyoshelwe kwifilimu yeglasi yefayibha yelaphu emva kweprojekthi yokuntywila kwinqanaba le-epoxy resin, enokuthanjiswa ngokuqhubeka kushushu.

5, iCopolymer

Uluhlu lobhedu olucinezelweyo kumphezulu we-CCL substrate yobhedu. Ifoyile yobhedu efunwa ngumzi-mveliso we-PCB inokufunyanwa ngokuqengqeleka okanye ukuqengqeleka, eyokuqala yeebhodi zesekethe eziqinileyo, okanye eyokugqibela kwiibhodi eziguqukayo.

6, Ummeli wokuhlangana

Circuit board industry refers to the surface of the glass fiber cloth coated by a layer of “silane compound class”, make between epoxy resin and glass fiber combination, more a “bypass hooked” layer of chemical bonds between them have more powerful telescopic elastic and combined with the robustness, once the plate caused by strong heat and the expansion of the difference is very big, coupling agent will be able to avoid the separation of the two.

Ukuqhagamshela, ukunxibelelana, ukunxibelelana, ukudibanisa

ThermosetTIng Polymer is formed by the bonding of many monomers through their molecular bonds. The bonding process is called “crosslinking”.

8, Inqanaba leC

In general substrate board, the resin can be divided into A,B,C and other three hardening (also known as polymerization or curing) stage. Thatha i-epoxy resin esetyenzisiweyo njengomzekelo. IVarnish yayo ibizwa ngokuba liqonga; i-Prepreq yayo ibizwa ngokuba yi-B-stage; Iifilimu ezininzi eziphilisiweyo kunye namashiti obhedu alaminishwe kwaye acinezelwa kwakhona kubushushu obuphezulu ukwenza i-substrate. This irreversible fully hardened resin state is called C-stage.

9, iglasi ye-D yeglasi D

Ibhekisa kwi-substrate eyenziwe ngefayibha yeglasi enomxholo ophezulu kakhulu we-boron, ukuze ukuhlala kwayo okuphakathi kulawulwe ezantsi.

10. Dicyandiamide(Dicy)

Ngaba uhlobo lwe-epoxy resin polymerization lukhuni olufunekayo lokuvala ibhulorho, ngenxa yefomula yayo ye-molekyuli ene-amine ephambili (-NH2), i-amine yesibini (= NH), kunye ne-amine ephezulu (≡NH) isiseko esineempendulo ezomeleleyo, yinto enqabileyo enqabileyo , ekwabizwa ngokuba yiCyano-guanidine cyanide Guanidine. Kodwa ngenxa yokufunxwa kwamanzi okuqinileyo, kukho ingxaki kwipleyiti yokuqokelela “ukuphinda kwenziwe kwakhona”, ke kufuneka kucolwe umhlaba ukuba uxutywe kwintlaka enamanzi.

11, DifferenTIal Scanning Calorimetry(DSC) micro Scanning thermal card analysis

Ukubeka nje, xa into ishushu, iqondo lobushushu elingena “into” (MCAL / SEC) liyahluka kubushushu obahlukeneyo. I-DSC kukulinganisa eli “zinga lokuhamba kobushushu” (okanye inqanaba lotshintsho kubushushu) kumaqondo obushushu ahlukeneyo. Umzekelo xa i-resin epoxy resin ifudunyezwa, izinga lokuhamba kobushushu kumaqondo obushushu ahlukeneyo kwaye yahlukile, kodwa malunga nokufikelela “kubushushu beglasi yotshintsho, inqanaba lokuhamba kobushushu phakathi kwe” ℃ ngalinye linokubonakala luluhle kakhulu, igophe lokujika Inqaku elihambelana nobushushu bendlela enqamlezileyo yokuhlangana, oko kukuthi, i-TG yentlaka, ke i-TG DSC ukufumanisa ukufumaneka. Indlela ye-DSC kukusampula (S) kunye nesalathiso (R) ngaxeshanye ukufudumeza, kuba “amandla obushushu” amabini ahlukile, ke ubushushu bohlukile, kodwa umsantsa ophakathi kwe-T ungagcinwa ungatshintshanga. Nangona kunjalo, xa ikufutshane ne-Tg, △ T phakathi kwabo iya kutshintsha kakhulu, kwaye i-DSC inokulinganisa umda wokutshintsha kobushushu. It is a modified “thermal differential analysis” (DTA). In addition to the DETERMINATION of polymer Tg, DSC can also be used to measure the specific heat of plastics, crystallinity, hardening crosslinking, and purity, is an important “thermal analysis” instrument.

12. Dip CoaTIng

Yindlela elula kwaye engabizi kakhulu yokunxiba (ubukhulu befilimu yesikhumba buhambelana ne-viscosity kunye nesantya sedyasi). I-Prepreg (eprintiweyo yempahla yebhodi yesekethe) ihlala isetyenziswa ngale ndlela. Inokugutyungelwa ngaphandle, kwaye iphinde ingene kwisithuba seglasi yefayibha yelaphu (yiyo loo nto ikwabizwa ngokuba yinto efakwe emanzini).

E-iglasi grade yeglasi elektroniki

E-glass was originally owned by OWens-Corning Fiberglass Co. As a result of the circuit board industry has been used for a long time, it has become an academic noun. Ukongeza kwi-silicon esisiseko kunye ne-calcium, iqulethe i-potassium encinci kunye nesodiyam, kodwa uninzi lwe-boron kunye ne-aluminium. Its insulation and processability are good, has been widely used in circuit board substrate reinforcement purposes. Ukubunjwa kwayo zilandelayo: Boron oxide B2O3 5~10% Sodium oxide/potassium Na2O/K2O 0~2% Calcium oxide CaO 16~25% Titanium dioxide TiO2 0~0.8% Aluminum oxide A12O3 12~16% Iron oxide Fe2O3 0.05~0.4% silica SiO2 I-52 ~ 56% fluorin F2 0 ~ 1.0%

14. Epoxy Resin

It is a polymer Thermosetting ubhetyebhetye kakhulu, enokusetyenziselwa ekubumbeni, ukupakisha, ukutyabeka, adhesion kunye nezinye iinjongo. Kwishishini lebhodi yesekethe, yeyona nto inkulu yokusetyenziswa kwe-insulation kunye ne-resin bonding, kunye neglasi yefayibha yelaphu, iglasi yefayibha, kunye nebhodi emhlophe yebhodi edityanisiweyo, kwaye inokulungiselela zonke iintlobo zezongezo, ukufezekisa injongo yokungatshi kunye nokusebenza okuphezulu, njengezinto ezisisiseko kuwo onke amanqanaba ebhodi yesekethe.

Uvavanyo (ijika)

Ngexesha lokumodareyitha kunye nokuqina kwentlaka eyahlukeneyo, eli gama libhekisa kwigophe lokukhutshwa kobushushu ngokuhamba kwexesha. Ixesha lokukhutshwa kobushushu obuninzi lelona zinga liphezulu lekhephu lobushushu. Kunye neRegency Exactionmic Reaction- yinto yeRexmical Reaction.

16. Intambo

It refers to the most basic unit of various fabrics, usually consisting of a single Yarn that is twisted into a single Strand or a multi-strand Yarn, and then woven into the required cloth by “warp” and “weft”. I-Filament ibhekisa kwi-Filament eqhubekayo okanye ukutya okuQhelekileyo.

17. Fill in weft direction

I-fiberglass okanye i-mesh yoshicilelo, apho icala le-weft lihlala lingaphantsi kwenani le-weft kubude beyunithi, ke amandla amancinci. This word has a synonym Weft.

18, Flame Resistant

Ibhekisa kwibhodi yesekethe kwi-resin yeplate yokugquma, ukuze kufezekiswe inqanaba elithile lokumelana nelangatye (kwi-UL94 HB, VO, V1 kunye neV2 inqanaba 4), ukongeza ezinye iikhemikhali kufuneka zenziwe ngabom kwifomula ye-resin, njenge-bromine, I-silica, i-alumina, efana ne-FR-4 apho ngaphezulu kwe-20% ye-bromide), yenza iplanga lokusebenza lingafezekisa ukuxhathisa kwelangatye. Generally fire-resistant FR-4 will be marked with the manufacturer’s UL “red mark” watermark on the Warp of its substrate (double panel) surface to indicate that it is fire-resistant. I-G-10 engenakho ukudodobalisa ilangatye inokuprintwa kuphela ngewatching “eluhlaza” kwicala le-warp. Kukho isithetha ntonye seLangatye elidodobalisayo, kodwa igama elichanekileyo lebhodi yesekethe nguMlilo oMelana noMlilo, ongakhathaliyo kwaye akufuneki uthethwe kakubi ngabantu nje.

19, Gel Time

It refers to the tree finger in b-stage. After receiving external heat, the tree finger changes from solid to fluid, and then slowly polymerizes and becomes solid again. During the process, the total “number of seconds” experienced by the softening “to appear colloidality” is called “colloidization time”. Oko kukuthi, kwinkqubo yokucinezela iipleyiti ezininzi, iglu yokuhamba inokugxotha umoya kwaye igcwalise amahla ndinyuka omgca wangaphakathi. Inani lemizuzwana elinokusetyenziswa kukubaluleka kokusebenza kwexesha leglu. Eli luphawu olubalulekileyo lwefilimu enganyangekiyo.

20, Gelation Particle

Ubukho bebala elicociweyo, eliphambi kwepolymerized wax kumnwe womthi wefilimu ye-b.