PCB kēpau kēpau a me ke kiʻi ʻoniʻoni

1, kēpau ABS

He huikau ternary o Acrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), kahi e hiki ai ke hoʻopili ʻia ka ʻāpana kapili o ka butadiene e ka waikawa chromic e hana i nā lua, a hiki ke hoʻohana ʻia i wahi pae no ka keleawe kime a nickel paha. no ka plating hou. Hoʻohui ʻia nā ʻāpana he nui ma ka papa kaapuni e ka plating ABS.

2, a-kahua A

ʻO Varnish e pili ana i ka lole aniani aniani a i ʻole ka pepa pulupulu i hoʻohana ʻia e hoʻoikaika i ka prepreg i kāna hana hana. ʻO ka Varnish (unuhi ʻia hoʻi he wai Varnish) o ka kēpau aia nō i kāna monomer a hoʻoheheʻe ʻia e ka mea hoʻoheheʻe, i ʻike ʻia ʻo ka pae A. Ke hoʻopili ʻia ka lole aniani a i ʻole ka pepa pulupulu, a ma hope o ka ea wela a me ka maloʻo infrared, e hoʻonui ana ke kaupaona o ka manamana lima i ka paʻakikī a i ʻole Oligomer, a laila hoʻopili ʻia i nā mea hoʻoikaika e hana i ke kiʻi ʻoniʻoni. Kapa ʻia ka moku kēpau Ke palupalu hou ia e ka wela a hoʻonui hou i ka polymer resin, kapa ʻia ia ʻo C-stage.

3. Pepa Hoʻopaʻa (ʻāpana) Pepa Hoʻopaʻa, a laila papa

Kuhi i ka papa multilayer ʻoʻoleʻa i mea e laminate ai i ka “ʻoniʻoni” hui, a i ʻole ka papa palupalu “papa pale pale” i ka papa aʻe ma waena o ka maka o ka papa.

B) kahua B) kahua

Pili ia i ka semi-polymerization a me ka semi-hardening state of thermosetting resin, e like me ka resin i hoʻopili ʻia i ka lole aniani fiber aniani ma hope o ka papahana immersion epoxy resin, kahi hiki ke palupalu e ka hoʻomehana hou.

5, Copolymer

He papa keleawe ia e kaomi ʻia ma ka ʻili o ka paukū foil keleawe CCL. Hiki ke kiʻi ʻia ka pepa keleawe e makemake ʻia e ka ʻoihana PCB e ka electroplating a i ʻole ke ʻoka ʻana, ka mea mua no nā papa kaapuni ʻoʻoleʻa, a i ʻole nā ​​hope no nā papa maʻalahi.

6, Agena hoʻopili

ʻO ka ʻoihana kaapuni e pili ana i ka papa o ka lole aniani puluniu i uhi ʻia e ka papa o ka “silane compound class”, e hana ma waena o ka epoxy resin a me ka hui aniani puluniu, ʻoi aku kahi papa “bypass hooked” o nā paʻa kemika ma waena o lākou iʻoi aku ka ikaika o ka telescopic elastis a hui ʻia me ka ikaika, i ka manawa o ka pā i hoʻokumu ʻia e ka wela ikaika a me ka hoʻonui ʻana o ka ʻokoʻa he nui loa, hiki i nā mea hoʻopili ke hōʻalo i ka hoʻokaʻawale ʻana i nā mea ʻelua.

Loulou, Kāwili ʻia, hoʻokuʻi, hoʻokuʻi

Hoʻokumu ʻia ʻo ThermosetTIng Polymer e ka hoʻopili ʻana o nā monomers he nui ma o kā lākou mole mole. Kapa ʻia ke kaʻina hana hoʻopaʻa “crosslinking”.

8, Ke kahua C

I ka papa substrate ākea, hiki ke hoʻokaʻawale ʻia ka kēpau i A, B, C a me ʻekolu mau paʻakikī paʻakikī ʻē aʻe (ʻo ia hoʻi ʻo polymerization a i ʻole hoʻōla ʻana) pae. Lawe i ka resin epoxy i hoʻohana nui ʻia ma ke ʻano he laʻana. Kāhea ʻia kāna Varnish a-pae; kapa ʻia kāna prepreq ʻo B-kahua; Ua lamineka ʻia kekahi mau kiʻi ʻoniʻoni hoʻōla ʻia a me nā pale keleawe a kaomi hou ʻia i ke ana wela e hana i ka substrate. Kapa ʻia kēia mokuʻāina resin paʻakikī paʻakikī loa ʻo C-stage.

9, aniani D aniani

Kuhikuhi ia i ka substrate i hana ʻia me ka puluniu aniani me nā ʻike boron kiʻekiʻe loa, i hiki ai ke kaohi ʻia kāna mea waena ma lalo.

10. ʻO Dicyandiamide (Dicy)

He ʻano epoxy kēpau polymerization paakiki koi ʻia bridging konohiki, no ka mea o kona mole mole me ka amine mua (-NH2), amine lua (= NH), a me tertiary amine (≡NH) ʻekolu ikaika hopena hopena kumu, kahi paʻakikī paʻakikī maikaʻi loa. , ʻo Cyano-guanidine cyanide Guanidine. Akā ma muli o ke kahe ʻana o ka wai ikaika o nā mea, aia ka pilikia i ka pā e ʻohiʻohi i ka “recrystallization”, no laila pono ia e lepo maikaʻi loa e kāwili ʻia i ka kēpau i komo i loko o ka wai.

11, DifferenTIal Scanning Calorimetry (DSC) anakahi iki Ke nānā ʻana i nā kāleka pumehana

Mālama wale, ke hoʻomehana ʻia kahi mea, hoʻololi ke ana o ka “wela” e kahe ana i ka mea (MCAL / SEC) i nā mahana like ʻole. E ana ʻo DSC i kēia “kaʻina kahe o ka wela” (a i ʻole ke ana o ka loli i ka wela) i nā mahana like ʻole. ʻO kahi laʻana ke wela ʻia kahi resin epoxy kalepa, ʻo ia ka nui o ka wela i nā mahana like ʻole a me nā mea ʻokoʻa, akā e kokoke ana i “ka aniani hoʻololi aniani, ke ana o ka wela i waena o kēlā me kēia ℃ hiki ke hoʻololi nui loa, ke pihi o ka huli kiko e kūlike i ke ana wela o ka intersect slope intersection, ʻo ia ʻo Tg no ke kēpau, no laila e hoʻoholo ka Tg DSC. Hoʻomaʻamaʻa ʻo DSC i kahi laʻana (S) a kuhikuhi (R) i ka manawa like me ka hoʻomehana, no ka mea ʻokoʻa ʻelua ʻāpana wela, no laila ʻokoʻa ka wela, akā hiki ke mālama mau ʻia ka hakahaka ma waena o ka △ T. Eia nō naʻe, aia ia kokoke i Tg, △ T ma waena o lākou e loli nui, a hiki i DSC ke ana i ka hoʻololi o ka ʻokoʻa o ka mahana. Hoʻololi ʻia ia he “ʻokoʻa ʻokoʻa hoʻomehana” (DTA). Ma waho aʻe o ka DETERMINATION o polymer Tg, hiki ke hoʻohana ʻia ʻo DSC e ana i ka wela kikoʻī o nā plastics, crystallinity, paʻakikī crosslinking, a me ka maʻemaʻe, kahi mea hana “anal analysis” nui.

12. Dip CoaTIng

He ala maʻalahi a kumukūʻai hoʻi ia e uhi lole (ʻo ka mānoanoa o ke kiʻi ʻili e pili ana i ka viscosity a me ka wikiwiki o ka pale). Hoʻohana mau ʻia ʻo prepreg (paʻi papa pōʻai puni) i kēia ala. Hiki ke uhi iā ia ma waho, a hemo pū i loko o ke ākea o ka lole aniani puluniu (no laila ʻike ʻia ia me he mea waiū i hoʻopulu ʻia).

Aniani uila uila uila

ʻO ʻOW-Corning Fiberglass Co. Ma muli o ka hopena o ka hoʻohana ʻia o ka ʻoihana kaapuni no ka manawa lōʻihi, ua lilo ia i inoa noʻepekema. Ma waho aʻe o ka silikona maʻamau a me ka calcium, he hapa potassium a me sodium ka mea i loko, akā nui ka boron a me ka alumini. Maikaʻi kona ʻano pilikino a me ka hana ʻana, ua hoʻohana ākea ʻia i nā kumu hoʻoikaika substrate kaapuni. ʻO kāna ʻano penei: Boron oxide B2O3 5 ~ 10% Sodium oxide / potassium Na2O / K2O 0 ~ 2% Calcium oxide CaO 16 ~ 25% Titanium dioxide TiO2 0 ~ 0.8% Aluminium oxide A12O3 12 ~ 16% Iron oxide Fe2O3 0.05 ~ 0.4% silica SiO2 52 ~ 56% fluorin F2 0 ~ 1.0%

14. Epoxy Resin

He polymer Thermosetting nui loa ia, hiki ke hoʻohana ʻia no ka hoʻoheheʻe ʻana, ka hoʻopili ʻana, ka uhi ʻana, ka hoʻopili ʻana a me nā kumu ʻē aʻe. I ka papa kaapuni ʻoihana, ʻo ia ka ʻai nui o ka insulate a me ka resin bonding, a me nā lole aniani aniani, moena pulupulu aniani, a me kahi papa keʻokeʻo pepa kraft keʻokeʻo, a hiki ke hoʻokipa i nā ʻano mea hoʻohui āpau, i mea e hoʻokō ai i ke kumu o ka wela ʻole. a me ka hana kiʻekiʻe, ma ke ʻano he kumuwaiwai o nā pae āpau o ka papa kaapuni.

15. Exotherm (hālau)

I ka wā o ka polymerization a me ka paʻakikī o nā kēpau like ʻole, pili ka huaʻōlelo i ka piʻo o ka hoʻokuʻu wela ma luna o ka manawa. ʻO ka manawa ke hoʻokuʻu ʻia ka wela nui ke kiko kiʻekiʻe loa o ka pā mahana. A ʻo Exothermic Reaction- he hopena Exothermic kemika.

16. Filament

Pili ia i ka anakahi kumu o nā lole like ʻole, i maʻa mau ʻia me kahi wili hoʻokahi i wili ʻia i hoʻokahi Strand a i ʻole ka wili multi-strand, a laila ulana ʻia i ka lole i koi ʻia e “maʻawe” a me “weft”. Pili ʻo filament i kahi filament a Staple mau paha.

17. Hoʻopiha i ka kuhikuhi ulana

Fiberglass a i ʻole ka pai paʻi, kahi i ʻoi ai ka ʻaoʻao o ka ulana ma mua o ka helu o ka ulana i ka lōʻihi o ke anakahi, no laila ua emi ka ikaika. Loaʻa ka huaʻōlelo manaʻo like iā Weft.

18, Kūpaʻa ahi

E pili ana i ka papa kaapuni i ka kēpau papa hoʻolauna, i mea e hoʻokō ai i kahi pae o ka pale ʻana o ka lapalapa (i ka UL94 HB, VO, V1 a me V2 pae 4), e hoʻohui pono i kekahi mau kemika i ke ʻano resin, e like me ka bromine, ʻO silica, alumina, e like me FR – 4 i ʻoi aku ma mua o 20% o ka bromide) E hōʻailona ʻia ka FR-4 kūpaʻa ahi me ka watermark UL “ʻulaʻula” o ka mea hana ma ka Warp o kāna substrate (pālua pā) e hōʻike i ka pale ahi. ʻO ka G-10 me ka pale ʻole o ka lapalapa hiki ke paʻi ʻia me ka wai ʻōmaʻomaʻo “ʻōmaʻomaʻo” i ka ʻaoʻao maʻawe loloa. Aia kekahi manaʻo like no Flame Retardent, akā ʻo ka huaʻōlelo kūpono no ka papa kaapuni ʻo Fire Resist, ka mea kuleana ʻole a ʻaʻole pono e kuhi hewa ʻia e ka poʻe leʻaleʻa.

19, Manawa Gel

E kuhikuhi i ka manamana o ka lāʻau i ka pae b. Ma hope o ka loaʻa ʻana o ka wela o waho, hoʻololi ka manamana o ka lāʻau mai paʻa i ka wai, a laila lohi polymerize a paʻa hou. I loko o ke kaʻina hana, ka huina “helu kekona” i ʻike ʻia e ka palupalu “e ʻike ʻia colloidality” i kapa ʻia “colloidization time”. ʻO ia, i ke kaʻina o ka pā papa multi-layer kaomi, hiki i ke kahe kahe ke kipaku aku i ka ea a hoʻopiha i nā piʻi a me lalo o ka laina o loko. ʻO ka helu o kekona i hiki ke hoʻohana ʻia ke ʻano kūpono o ka manawa glue. He hiʻohiʻona nui kēia o ka moʻoniʻoni hoʻoiho semi-ho’ōla iā prepreg.

20, Paukū Gelation

ʻO ke kū ʻana o ka aniani moakaka, nā ʻāpana wax wax polymerized mua i ka manamana o ke kiʻi b-stage.