PCB resin kemistri na ihe nkiri

1, ABS resin

It is a ternary mixture of Acrylonitrile-Butadine-Styrane (Acrylonitrile-Butadine-Styrane), in which the rubber part of the butadiene can be corroded by chromic acid to form holes, and can be used as a landing point for chemical copper or nickel for further plating. Many parts on the circuit board are assembled by ABS plating.

2, a-ogbo A.

Varnish refers to the glass fiber cloth or cotton paper that is used to reinforce the Prepreg during its manufacturing process. The Varnish (also translates as Varnish water) of the resin is still in its monomer and diluted by the solvent, known as the A-stage. Mgbe akwa eriri iko ma ọ bụ gluu na -amị mmiri akwụkwọ, na mgbe ikuku na -ekpo ọkụ na ihicha infrared, ịdị arọ molekul nke mkpịsị aka osisi ahụ ga -abawanye na mgbagwoju anya ma ọ bụ Oligomer, wee tinye ya na ihe na -eme ka ọ bụrụ ihe nkiri. A na-akpọ steeti resin b-stage. When it is further softened by heat and further polymerized into the final polymer resin, it is called C-stage.

3. Mpempe akwụkwọ agbụ (oyi akwa) Mpempe akwụkwọ, mgbe ahụ akwa

Tụọ aka na bọọdụ multilayer siri ike iji mechie “ihe nkiri”, ma ọ bụ bọọdụ dị larịị “tebụl na -echebe oyi akwa” akwa na -esote n’etiti ihu bọọdụ ya

B) Stage B) Stage

Ọ na-ezo aka na ọkara polymerization na ọkara nke na-esi ike nke resin thermosetting, dị ka resin nke ejikọtara na akwa iko ihe nkiri mgbe ọrụ imikpu a-ogbo nke resin epoxy, nke nwere ike ime ka ọ dị nro site na ikpo ọkụ ọzọ.

5, Onye na -eme mkpọtụ

Ọ bụ akwa ọla kọpa etinyere n’elu mkpụrụ osisi foil ọla kọpa CCL. Enwere ike nweta foil ọla kọpa nke ụlọ ọrụ PCB chọrọ site na electroplating ma ọ bụ tụgharịa, nke mbụ maka bọọdụ sekit siri ike, ma ọ bụ nke ikpeazụ maka bọọdụ na -agbanwe agbanwe.

6, Onye nnọchi anya njikọ

Circuit board industry refers to the surface of the glass fiber cloth coated by a layer of “silane compound class”, make between epoxy resin and glass fiber combination, more a “bypass hooked” layer of chemical bonds between them have more powerful telescopic elastic and combined with the robustness, once the plate caused by strong heat and the expansion of the difference is very big, coupling agent will be able to avoid the separation of the two.

Njikọ, Crosslinking, njikọ, njikọ

ThermosetTIng Polymer is formed by the bonding of many monomers through their molecular bonds. The bonding process is called “crosslinking”.

8, ọkwa C

In general substrate board, the resin can be divided into A,B,C and other three hardening (also known as polymerization or curing) stage. Were resin epoxy kacha eji mee ihe atụ. A na-akpọ Varnish ya a-ogbo; a na-akpọ Prepreq ya B-ogbo; Akwadoro ọtụtụ ihe nkiri a gwọrọ nke ọma na akwụkwọ ọla kọpa ma pịa ya ọzọ na oke okpomọkụ iji mepụta mkpụrụ. Ọnọdụ resin a siri ike nke a na-apụghị ịgbagha agbagha ka a na-akpọ C-stage.

9, D-iko D iko

Ọ na -ezo aka na mkpụrụ osisi ejiri eriri nwere ọdịnaya boron dị elu nke ukwuu, nke mere na enwere ike ịchịkwa ọkara ya mgbe niile.

10. Dicyandiamide(Dicy)

Ọ bụ ụdị ihe nrụpụta polymerization epoxy resin chọrọ onye na-ahụ maka njikọ, n’ihi usoro molekụla ya na amine bụ isi (-NH2), amine nke abụọ (= NH), na amine tertiary (≡NH) ike mmeghachi omume siri ike atọ, bụ ihe na-adịghị ahụkebe nke ukwuu. , makwaara dị ka cyano-guanidine cyanide Guanidine. Mana n’ihi mmịkọ mmiri siri ike nke ihe ahụ, enwere nsogbu na efere iji kpokọta ” recrystallization ”, yabụ na ọ ga -abụrịrị nke ọma ka agwakọta ya na resin nke nwere imikpu.

11, DifferenTIal Scanning Calorimetry(DSC) micro Scanning thermal card analysis

N’ikwu ya n’ụzọ dị mfe, mgbe a na -eme ka ihe dị ọkụ, ọnụego “ọkụ” na -abanye n’ime ihe (MCAL/SEC) na -adịgasị iche na oke okpomọkụ. DSC bụ tụọ ” ọnụego ọkụ ọkụ ” (ma ọ bụ ọnụego mgbanwe ọkụ) na ọnọdụ okpomọkụ dị iche iche. Dịka ọmụmaatụ mgbe ejiri mmanụ resin epoxy na -ere ọkụ, ọnụego ya na -agba ọkụ na oke okpomọkụ dị iche iche, mana ọ na -achọ iru “ọnọdụ mgbanwe iko, ọnụego ọkụ na -agba n’etiti each ọ bụla nwere ike ịpụta nnukwu mgbanwe, usoro ntụgharị. ntụpọ kwekọrọ na ọnọdụ okpomọkụ nke nrute mkpọda transverse, ya bụ Tg maka resin, yabụ Tg DSC iji chọpụta dị. Usoro DSC bụ ịlele (S) na ntụnyere (R) n’otu oge kpo oku, n’ihi na “ike okpomọkụ” abụọ dị iche, yabụ na ọnọdụ okpomọkụ dị iche, mana enwere ike idobe oghere dị n’etiti △ T agbanweghi agbanwe. Agbanyeghị, mgbe ọ dị nso Tg, △ T n’etiti ha ga -agbanwe nke ukwuu, na DSC nwere ike tụọ mgbanwe nke ọdịiche okpomọkụ. It is a modified “thermal differential analysis” (DTA). In addition to the DETERMINATION of polymer Tg, DSC can also be used to measure the specific heat of plastics, crystallinity, hardening crosslinking, and purity, is an important “thermal analysis” instrument.

12. Itinye Azụkọ

Ọ bụ ụzọ dị mfe ma dịkwa ọnụ ala iji kpuchie (ọkpụrụkpụ nke ihe nkiri akpụkpọ anụ metụtara viscosity na ọsọ nke mkpuchi). A na -eji prepreg (ihe mbadamba sekit ebipụta) n’ụzọ dị otú a. Enwere ike kpuchie ya na mpụga, ma na -abanyekwa n’ime oghere akwa akwa iko (ya mere a makwaara ya dị ka ihe a na -etinye mmiri).

E-iko electronic ọkwa iko

E-glass was originally owned by OWens-Corning Fiberglass Co. As a result of the circuit board industry has been used for a long time, it has become an academic noun. Na mgbakwunye na silicon na calcium, ọ nwere obere potassium na sodium, mana ọtụtụ boron na aluminom. Its insulation and processability are good, has been widely used in circuit board substrate reinforcement purposes. Ihe mejupụtara ya bụ nke a: Boron oxide B2O3 5~10% Sodium oxide/potassium Na2O/K2O 0~2% Calcium oxide CaO 16~25% Titanium dioxide TiO2 0~0.8% Aluminum oxide A12O3 12~16% Iron oxide Fe2O3 0.05~0.4% silica SiO2 52 ~ 56% Fluorin F2 0 ~ 1.0%

14. Epoxy Resin

Ọ bụ polymer thermosetting nke ukwuu, nke enwere ike iji ya kpụzie, nkwakọ ngwaahịa, mkpuchi, nrapado na ebumnuche ndị ọzọ. N’ime ụlọ ọrụ sekit sekit, bụ ihe oriri kachasị nke mkpuchi mkpuchi na resin na-ejikọ ọnụ, na akwa eriri iko, teepu eriri iko, na bọọdụ mejupụtara mkpụrụedemede kraft, ma nwee ike ịnabata ụdị ihe mgbakwunye niile, iji nweta ebumnuche nke anaghị ere ọkụ. na ọrụ dị elu, dị ka ihe ndabere nke ọkwa ọkwa bọọdụ niile.

15. Mkpuchi ọkụ (usoro)

N’oge polymerization na hardening nke resins dị iche iche, okwu ahụ na -ezo aka na usoro nke iwepụta okpomọkụ ka oge na -aga. Oge a na -ewepụta oke ọkụ bụ ebe kachasị elu na ngụ okpomọkụ. Na mmeghachi omume exothermic- ọ bụ mmeghachi omume kemịkalụ exothermic.

16. Ndozi

It refers to the most basic unit of various fabrics, usually consisting of a single Yarn that is twisted into a single Strand or a multi-strand Yarn, and then woven into the required cloth by “warp” and “weft”. Filament na -ezo aka Filament na -aga n’ihu ma ọ bụ Staple.

17. Fill in weft direction

Faiba glaasi ma ọ bụ mesh na -ebi akwụkwọ, nke ntụzịaka weft na -abụkarị obere ọnụ ọgụgụ weft n’ogologo otu, yabụ ike adịghị obere. This word has a synonym Weft.

18, Onye na -eguzogide ire ọkụ

Na -ezo aka na bọọdụ sekit na resin efere mkpuchi, iji nweta ọkwa ụfọdụ nke nkwụsi ike (na UL94 HB, VO, V1 na V2 ọkwa 4), na -agbakwunye kemịkal ụfọdụ ga -ama ụma na usoro resin, dị ka bromine, silica, alumina, dị ka FR – 4 nke ihe karịrị 20% nke bromide), na -eme atụmatụ nke arụmọrụ nwere ike nweta ụfọdụ nguzogide ọkụ. Generally fire-resistant FR-4 will be marked with the manufacturer’s UL “red mark” watermark on the Warp of its substrate (double panel) surface to indicate that it is fire-resistant. G-10 na-enweghị onye na-egbochi ire ọkụ nwere ike ibipụta ya na akara mmiri “akwụkwọ ndụ akwụkwọ ndụ” na ntụpọ. Enwere okwu maka Flame Retardent, mana okwu ziri ezi maka bọọdụ sekit bụ Fire Resist, nke na -enweghị isi na ndị nkịtị ekwesịghị ịkọwa ya.

19, Gel Time

Ọ na-ezo aka mkpịsị aka osisi na b-ogbo. Mgbe ọ nwetasịrị okpomoku dị na mpụga, mkpịsị aka osisi ahụ na -agbanwe site na ihe siri ike ruo mmiri mmiri, wee jiri nwayọ na -eme polymerizes wee sie ike ọzọ. N’oge usoro a, a na -akpọ ngụkọta “ọnụọgụ nke sekọnd” nke ịdị nro “pụtara colloidality” “oge mkpokọta”. Nke ahụ bụ, na usoro ịpị efere efere ọtụtụ, gluu na-asọba nwere ike ịchụpụ ikuku wee jupụta elu na mgbada nke eriri dị n’ime. Ọnụ ọgụgụ nke sekọnd nke enwere ike iji mee ihe bụ ihe bara uru oge gluu. Nke a bụ akụkụ dị mkpa nke ihe nkiri Prepreg nwere ọkara gwọrọ.

20, Akụkụ Gelation

Ọnụnọ nke irighiri ihe na-ebu ụzọ mee polymerized na mkpịsị aka osisi nke ihe nkiri b-stage.