Nā pilikia maʻamau a me nā countermeasures i FPC a PCB kaʻina hana

Me ka loli o ka hoʻopili kuʻina i ke ʻano kēpau kēpau, pono i ka papa kaapuni PCB e halihali i ke ana wela wela kiʻekiʻe loa, a ʻo ke koi no ke kūpale kūwaho kūwaho hoʻi o ka pale kūwaho kūwaho kūwaho ʻoi aku ke kiʻekiʻe a kiʻekiʻe. ʻO ke koi no ka mālama ʻana i ka papa, ka ikaika ʻili o ka solder resist layer (ink, masking film) a me ka adhesion me ke keleawe kumu i ʻoi aku ke kiʻekiʻe. Pono mākou i kahi ʻenehana hoʻomaʻemaʻe ʻoi aku ka maikaʻi e hōʻoia. Ma ka hoʻomaikaʻi ʻana i kā mākou ʻenehana, hiki iā mākou ke hoʻomaikaʻi i ka hua o nā huahana a loaʻa ka ulu waiwai. Hiki ke kānalua ke kōkua ʻana o ka potion ma mua o ka mālama ʻana iā mākou ma ke kumu kūʻai haʻahaʻa.

Hoʻolauna pinepine kēia ʻatikala i nā nīnau a me nā Countermeasures i ʻike pinepine ʻia i ke kaʻina hana o PCB a me FPB papa kaapuni palupalu: ʻo ka mea mua, hōʻike ka ʻāpana o ka laina i ka hemo ʻana o ka ʻaoʻao a me ka helehelena concave ke kāʻei ʻana i ka laina ma hope o ke kiʻi ʻoniʻoni a me ka hoʻomaʻemaʻe kiʻi ʻoniʻoni, e hopena ana i ka ʻole o ka laina. laina laula a kaulike ʻole paha. ʻO ke kumu he mea ʻē aʻe ma mua o ke koho pono ʻole ʻana o ka ʻikepili kiʻi maloʻo a pulu hoʻi, nā palena kūpono ʻole a me nā hana maikaʻi ʻole o ka mīkini hōʻike. Hoʻomohala, ʻae ʻana i ka ʻāpana nozel conduction, kūpono kūpono ʻole o nā palena e pili ana, ka noʻonoʻo pono ʻole a me ka pālākiō o ka lāʻau wai, ka wikiwiki o ka lawe pono ʻole ʻana a me nā moʻo ʻē aʻe i nā nīnau. Eia nō naʻe, ʻike pinepine mākou ʻaʻohe mea kūpono ʻole ma ka nānā ʻana i nā palena ma luna a me nā hana pono e pili ana, akā aia nō kekahi mau nīnau e like me ka ʻaʻai a me ka popopo o ka papa kaapuni ke hana ana i ka papa. He aha ke kumu ma hope o nā mea āpau?

2, Ke hana nei i ke ʻano electroplating PCB a me ka mālama ʻana o PCB a me FPC terminals, e like me ka waiho gula, uila gula, uila piuta, piuta ʻino a me nā hana ʻenehana ʻē aʻe, ʻike pinepine mākou i nā papa i hana ʻia e hōʻike i ka helehelena o ke kuʻi infiltration ma ka lihi o ke kiʻi ʻoniʻoni a mākū a i ʻole pale pale pale, a i ʻole ka hapa nui o nā papa a i ʻole kekahi o nā papa kūloko. , ʻo ia hoʻi ka mea hōʻeha puʻuwai! ʻO ke kumu e noʻonoʻo mau ai mākou i nā palena kiʻi ʻoniʻoni maloʻo a pulu hoʻi, a kānalua ka hana ʻikepili; Aia nā nīnau e pili ana i ka pale solder, e like me ka inika no ka papa paʻakikī, masking film no ka papa palupalu, a i ʻole nā ​​nīnau i ka paʻi ʻana, kaomi ʻana, ka hoʻōla ʻana a me nā ʻāpana ʻē aʻe. ʻOiaʻiʻo, hiki i kēlā me kēia o kēia mau wahi ke kānalua. A laila kānalua nō hoʻi mākou ʻaʻohe kānalua a kānalua paha i ka ʻāpana o luna i luna, akā e hōʻike nō ia i ke ʻano o ka hoʻopili infiltration. Ma hope o nā mea āpau, he aha ke kumu o ka ʻike ʻole?

3, E hoʻāʻo ʻia nā papa PCB me ka piʻina ma mua o ka hoʻouna ʻana. ʻOiaʻiʻo, e hoʻohana nā mea kūʻai aku i nā ʻāpana welded tin. Aia kahi kānalua he hiki ke ʻili loa ʻia ka inika a i ʻole ka ikaika o ka ʻili ʻana o ke kiʻi masking o ka pā palupalu a hemahema paha. Ke hōʻike ke pale solder i ka hiʻohiʻona o ka peeling kukui i ka wā o ke kuʻi, ʻaʻole hiki ke hoʻopaʻa pono i ke kumu, a laila e lilo ana ka nui o nā mea a me nā lohi hana a nā mea kūʻai aku. E kū ana ka hale hana kaapuni i nā pohō nui e like me ka hoʻoliʻiliʻi, mea hoʻonui waiwai, a me ka nalo ʻana o nā mea kūʻai aku. No laila, he aha nā hiʻohiʻona a mākou e hoʻomaka ai e hoʻomaka i nā nīnau? Mākou maʻamau kālailai inā he solder resist (ink, masking film) ʻikepili; Aia paha kekahi kānalua i ka paʻi paʻi silika, lamination a me ka hoʻōla ʻana; Aia kekahi kānalua e pili ana i ka potion electroplating? kali … No laila, kauoha maʻamau mākou i nā ʻenekini e ʻike i ke kumu a hoʻomaikaʻi mai kēia mau ʻāpana. Mahalo pū mākou inā ʻo ke aniau ia? ʻAno pulu kēia mau manawa, a komo ka papa i ka pulu? (Maʻalahi ka lawe ʻana o ka substrate PCB a me ka ālai i ka waiū) ma o ka hana nui ʻana, hiki iā lākou ke ʻohi i nā hopena. He kanalua ia e mālama ʻia lākou i waho no kēia manawa.