kulesi PCBIndlela eyindilinga yokuklama, ama-PCB, amaketanga kanye namathimba wokunikezela asebenza ngokuzimela kuze kube yisigaba sokuqhakambisa ukuhlanganisa umsebenzi ndawonye, ​​okwenza kubize ukuphinda usebenze uma okuthile kungalingani noma kungahlangabezani nezidingo zezindleko.

Lokhu kusebenze kahle iminyaka eminingi. Kepha ukuxubana komkhiqizo kuyashintsha, lapho u-2014 ebona ushintsho olukhulu lubheka izindlela zomklamo we-PCB, futhi u-2015 kulindeleke ukuthi abone ukusetshenziswa kwale ndlela.

Ake sicabangele i-system-level chip (SoC) ecosystem kanye nokupakishwa komkhiqizo. Ama-Socs abe nomthelela omkhulu enqubweni yokwakhiwa kwehadiwe.

Ngokusebenza okungaka okuhlanganiswe ku-chip eyodwa ye-SoC, kuhlanganiswe nezici eziqondene nohlelo, onjiniyela bangasebenzisa ukwakheka kwezethenjwa ukwenza ucwaningo nentuthuko. Imikhiqizo eminingi njengamanje isebenzisa ukwakheka kwezethenjwa kweSoC kanye nemiklamo yokuhlukanisa ngokuya ngayo.

Ngakolunye uhlangothi, ukupakishwa komkhiqizo noma ukwakheka kokubukeka sekuyinto ebalulekile yokuncintisana futhi futhi sibona ukwakheka nama-engeli ayinkimbinkimbi ngokwengeziwe.

Abathengi bafuna imikhiqizo emincane, ebukeka ipholile. Lokho kusho ukufaka ama-PCBS amancane emabhokisini amancane anethuba elincane lokwehluleka.

Ngakolunye uhlangothi, ukwakheka okuyizithenjwa okususelwa enhlalweni kwenza inqubo yokwakhiwa kwehardware ibe lula, kepha le miklamo isadinga ukulingana negobolondo lokudala kakhulu, elidinga ukusebenzisana okusondele nokubambisana phakathi kwezinqubo-mbono zokwakha ezahlukahlukene.

Isibonelo, icala lingathatha isinqumo sokusebenzisa ama-PCBS amabili esikhundleni sedizayini eyodwa yebhodi, lapho ukuhlela kwe-PCB kuba yingxenye yomklamo we-product-centric.

Lokhu kuletha inselelo enkulu kumathuluzi wokuklama e-PCB 2D amanje. Ukulinganiselwa kwesizukulwane samanje samathuluzi e-PCB yilawa: ukuntuleka kokubonwa kokuklanywa kwezinga lomkhiqizo, ukuntuleka kokusekelwa kwamabhodi amaningi, ukukwazi ukuklama okukhawulelwe noma okungekho kwe-MCAD, akukho ukusekelwa komklamo ofanayo, noma ukungakwazi ukukhomba izindleko nokuhlaziywa kwesisindo.

Lesi siyalo semiklamo eminingi kanye nenqubo yokubambisana yomkhiqizo oyisisekelo kuyindlela ehluke ngokuphelele. Ukuvela kwezici zokuncintisana kanye nokwehluleka kwezindlela ze-PCB-centric ukuhambisana nentuthuko kuqhubekisele phambili indlela, okudinga inqubo yokubambisana futhi ephendulayo.

Isici esiyinhloko somklamo we-centric yomkhiqizo ukuthi ukuqinisekiswa kwawo kwezakhiwo kuvumela izinkampani ukuthi ziphendule ngokushesha kakhulu kuzidingo zomkhiqizo ezintsha, eziyinkimbinkimbi ngokwengeziwe. Ukwakhiwa kwezakhiwo yibhuloho phakathi kwezidingo zomkhiqizo nokuklanywa okuningiliziwe – futhi yilokhu okunika imikhiqizo inzuzo yokuncintisana uma yakha kahle.

Ngaphambi kokuklanywa okuningiliziwe, ukwakhiwa komkhiqizo okuhlongozwayo kuqala kuhlaziywa ngaphansi kwezinqubo zokuklama eziningi ukuthola ukuthi ziyahlangabezana yini nezidingo.

Izici ezidinga ukubuyekezwa zifaka usayizi, isisindo, izindleko, ukwakheka nokusebenza komkhiqizo omusha, mangaki ama-PCBS adingekayo nokuthi angafakwa yini ezindlini ezakhiwe.

Izizathu ezingeziwe abakhiqizi bangafeza ukonga izindleko nezikhathi ngokusebenzisa indlela yokwakhiwa komkhiqizo-i-centric ifaka phakathi:

Ukuhlelwa kokuqanjwa kwamabhodi ama-2D / 3D ngasikhathi sinye;

Ukungenisa / ukuthekelisa amamodeli WESINYATHELO ahlolwe ukuthi awasasebenzi futhi awahambisani;

Umklamo we-Modular (ukusetshenziswa kabusha komklamo);

Thuthukisa ukuxhumana phakathi kwamaketanga okuhlinzeka.

Lawa makghono enza izinkampani zikwazi ukucabanga ezingeni lomkhiqizo futhi zikhulise inzuzo yazo yokuncintisana.