Unyango lomphezulu jikelele we PCB Iquka ukutshiza ngetoti, i-OSP, ukuntywiliselwa kwegolide, njl. njl Okanye indawo yoqhagamshelwano. I-solderability yobhedu olungenanto ngokwayo ilungile kakhulu, kodwa ilula i-oxidize xa ibonakaliswe emoyeni, kwaye kulula ukungcoliswa. Kungenxa yoko le nto iPCB kufuneka inyangwe phezulu.

1. Tfutha itoti (HASL)

Apho izixhobo ezinemingxuma zilawulayo, i-wave soldering yeyona ndlela ibalaseleyo yokuthambisa. Ukusetyenziswa komgangatho we-solder yomoya oshushu (i-HASL, i-Hot-air solder leveling) iteknoloji yonyango lomphezulu yanele ukuhlangabezana neemfuno zenkqubo yokuthengiswa kwamaza. Ngokuqinisekileyo, kwiimeko ezifuna amandla aphezulu e-junction (ingakumbi uxhumano loqhagamshelwano), i-electroplating ye-nickel / igolide isetyenziswa rhoqo. . I-HASL yeyona teknoloji iphambili yonyango esetyenziswa kwihlabathi liphela, kodwa kukho izinto ezintathu eziphambili zokuqhuba eziqhuba ishishini lombane ukuba liqwalasele obunye ubuchwephesha be-HASL: iindleko, iimfuno zenkqubo entsha kunye neemfuno ezingenalo i-lead.

Ukusuka kumbono weendleko, uninzi lwamacandelo e-elektroniki anjengonxibelelwano oluphathwayo kunye neekhompyuter zobuqu ziba yimpahla yabathengi edumileyo. Kuphela ngokuthengisa ngexabiso okanye amaxabiso aphantsi sinokuthi singoyiswa kwimeko yokhuphiswano oluqatha. Emva kokuphuhliswa kobuchwepheshe bendibano kwi-SMT, iipads zePCB zifuna ukuprintwa kwesikrini kunye neenkqubo zokuphinda zifakwe kwi-solder ngexesha lendibano. Kwimeko ye-SMA, inkqubo ye-PCB yonyango yonyango isasebenzisa iteknoloji ye-HASL ekuqaleni, kodwa njengoko izixhobo ze-SMT ziqhubeka zinciphisa, iipads kunye nokuvulwa kwe-stencil nazo zibe zincinci, kwaye ukungahambi kweteknoloji ye-HASL kuye kwavezwa ngokuthe ngcembe. Iipads ezicutshungulwe yiteknoloji ye-HASL azikho flat ngokwaneleyo, kwaye i-coplanarity ayikwazi ukuhlangabezana neemfuno zenkqubo yeepads-pitch pads. Iinkxalabo zokusingqongileyo zikholisa ukujolisa kwimpembelelo enokubakho yelothe kokusingqongileyo.

2. I-Organic Solderability Umaleko woKhuseleko (OSP)

I-Organic solderability preservative (i-OSP, i-Organic solderability preservative) yingubo yendalo esetyenziselwa ukuthintela i-oxidation yobhedu ngaphambi kokuba i-soldering, oko kukuthi, ukukhusela i-solderability yeepads ze-PCB kumonakalo.

Emva kokuba umphezulu we-PCB uphathwe nge-OSP, i-compound ebhityileyo ye-organic yenziwa phezu kobhedu ukukhusela ubhedu kwi-oxidation. Ubukhulu be-Benzotriazoles OSP ngokuqhelekileyo yi-100 A °, ngelixa ubukhulu be-Imidazoles OSP buqina, ngokubanzi ngama-400 A °. Ifilimu ye-OSP iyabonakala, akulula ukwahlula ubukho bayo ngeliso lenyama, kwaye kunzima ukuyibona. Ngethuba lenkqubo yendibano (i-reflow soldering), i-OSP iyancibilika ngokulula kwi-solder paste okanye i-acidic Flux, kwaye ngexesha elifanayo indawo yobhedu esebenzayo ibonakaliswe, kwaye ekugqibeleni i-Sn / Cu i-intermetallic compounds yenziwa phakathi kwamacandelo kunye neepads. Ngoko ke, i-OSP ineempawu ezintle kakhulu xa isetyenziselwa ukunyanga i-welding surface. I-OSP ayinayo ingxaki yongcoliseko lwelothe, ngoko ke ihambelana nokusingqongileyo.

Unyino lwe-OSP:

①. Ekubeni i-OSP ibonakala ngokucacileyo kwaye ingenambala, kunzima ukuyihlola, kwaye kunzima ukwahlula ukuba i-PCB ifakwe kwi-OSP.

② I-OSP ngokwayo i-insulated, ayiqhubeki umbane. I-OSP ye-Benzotriazoles incinci, enokuthi ingachaphazeli uvavanyo lombane, kodwa kwi-OSP ye-Imidazoles, ifilimu ekhuselayo eyenziweyo iyancipha, eya kuchaphazela uvavanyo lombane. I-OSP ayinakusetyenziswa ukuphatha imiphezulu yoqhagamshelwano yombane, efana nemiphezulu yebhodi yezitshixo.

③ Ngethuba lenkqubo ye-welding ye-OSP, i-Flux enamandla iyadingeka, ngaphandle koko ifilimu ekhuselayo ayikwazi ukupheliswa, eya kukhokelela kwiziphene ze-welding.

④ Ngethuba lokugcinwa kwenkqubo, umphezulu we-OSP akufanele ubonakaliswe kwizinto ezi-acidic, kwaye iqondo lokushisa akufanele libe phezulu kakhulu, ngaphandle koko i-OSP iya kuguquguquka.

3. Ukuntywiliselwa kwegolide (ENIG)

Indlela yokukhusela ye-ENIG:

I-Ni/A ityalwe kumphezulu wobhedu ngendlela yeekhemikhali. Ubukhulu be-deposition yomaleko ongaphakathi we-Ni ngokuqhelekileyo yi-120 ukuya kwi-240 μin (malunga ne-3 ukuya kwi-6 μm), kunye nobukhulu be-deposition yomaleko ongaphandle we-Au buncinci, ngokubanzi yi-2 ukuya kwi-4 μin (0.05 ukuya ku-0.1 μm). I-Ni yenza umaleko womqobo phakathi kwe-solder kunye nobhedu. Ngexesha le-soldering, i-Au engaphandle iya kunyibilika ngokukhawuleza kwi-solder, kwaye i-solder kunye ne-Ni iya kwenza i-Ni / Sn intermetallic compound. Ukufakwa kwegolide ngaphandle kukuthintela i-Ni oxidation okanye i-passivation ngexesha lokugcinwa, ngoko ke umaleko wegolide weplating kufuneka ube xinene ngokwaneleyo kwaye ubukhulu abufuneki bubhityile kakhulu.

Ukuntywiliselwa kwegolide: Kule nkqubo, injongo kukubeka umaleko obhityileyo noqhubekayo okhuselayo wegolide. Ubunzima begolide ephambili akufanele bube bukhulu kakhulu, ngaphandle koko amakhonkco e-solder aya kuba brittle kakhulu, okuya kuchaphazela kakhulu ukuthembeka kwe-welding. Njengokufakwa kwe-nickel, ukuntywiliselwa kwegolide kunobushushu obuphezulu bokusebenza kunye nexesha elide. Ngexesha lenkqubo yokuntywila, ukusabela kokufuduka kuya kwenzeka-kwindawo ye-nickel, igolide ithatha indawo ye-nickel, kodwa xa ukufuduswa kufikelela kwinqanaba elithile, ukusabela kokufuduka kuya kuyeka ngokuzenzekelayo. Igolide inamandla amakhulu, ukuxhathisa kwe-abrasion, ukumelana nobushushu obuphezulu, kwaye akukho lula ukukhupha i-oxidize, ngoko inokuthintela i-nickel kwi-oxidation okanye i-passivation, kwaye ifanelekile ukusebenza kwizicelo zamandla aphezulu.

Umphezulu we-PCB ophathwa yi-ENIG uthe tyaba kwaye une-coplanarity elungileyo, eyona yodwa esetyenziselwa umphezulu woqhagamshelwano weqhosha. Okwesibini, i-ENIG ine-solderability ebalaseleyo, igolide iya kunyibilika ngokukhawuleza kwi-solder etyhidiweyo, ngaloo ndlela iveze i-Ni entsha.

Unyino lwe-ENIG:

Inkqubo ye-ENIG inzima ngakumbi, kwaye ukuba ufuna ukufezekisa iziphumo ezilungileyo, kufuneka ulawule ngokungqongqo iiparameters zenkqubo. Eyona nto inzima kakhulu kukuba umphezulu we-PCB ophathwa yi-ENIG uthambekele kwiipads ezimnyama ngexesha le-ENIG okanye i-soldering, eya kuba nefuthe elibi ekuthembekeni kwamalungu e-solder. Indlela yokuvelisa yediski emnyama inzima kakhulu. Kwenzeka kwi-interface ye-Ni kunye negolide, kwaye ibonakaliswa ngokuthe ngqo njenge-oxidation egqithisileyo ye-Ni. Igolide eninzi kakhulu iya kubambisa amalunga e-solder kwaye ichaphazele ukuthembeka.

Inkqubo nganye yonyango yendawo ineempawu zayo ezizodwa, kwaye ububanzi besicelo bukwahluke. Ngokutsho kokusetyenziswa kweebhodi ezahlukeneyo, iimfuno ezahlukeneyo zonyango lomphezulu ziyafuneka. Ngaphantsi kokunciphisa inkqubo yokuvelisa, ngamanye amaxesha senza iziphakamiso kubathengi ngokusekelwe kwiimpawu zeebhodi. Esona sizathu siphambili kukuba nonyango lomphezulu olufanelekileyo olusekwe kwisicelo semveliso yomthengi kunye nobuchule benkqubo yenkampani. s Ukukhetha.