Uphuhliso lwamva nje olwenziwe kwi-miniaturization sesona sizathu siphambili sokukhula okunamandla kwemveliso ye-elektroniki. Njengoko i-miniaturization iqhubeka nokuqhuba ishishini, isenza izinto ze-elektroniki kunye PCB Iya isiba ngumceli mngeni ngakumbi. Owona mceli mngeni kwimveliso yePCB kukudityaniswa koxinano oluphezulu ngemingxunya kunye nasemingxunyeni esetyenziselwa unxibelelwano. Ngokusebenzisa imingxunya kusetyenziswa ukufaka izinto zombane ezenza isekethe.

Njengokuxinana kokupakisha kwemingxunya kumgca wendibano ye-PCB inyuka, ibango lemingxunya encinci liyonyuka. Ukubholwa koomatshini kunye nokubola kwelaser ziindlela ezimbini eziphambili ezisetyenziselwa ukuvelisa imingxunya echanekileyo kunye nokuphindayo yemicron. Usebenzisa ezi ndlela zokubhola ze-PCB, imingxunya inokubakho kububanzi ukusuka kwi-50 ukuya kwi-300 microns ngobunzulu obumalunga ne-1-3 mm.

Amanyathelo okuthintela ukubhola kwe-PCB

Umatshini wokushicilela une-spindle esantya esiphezulu esijikeleza malunga ne-300K RPM. Ezi zantya zibalulekile ekufezekiseni ukuchaneka okufunekayo ukuqhuba imingxunya yesikali se-micron kwi-PCBS.

Ukugcina ukuchaneka ngesantya esiphezulu, isixhobo sokuphotha sisebenzisa iibheringi zomoya kunye nendibano ethe ngqo ebanjelwe endaweni ngokuchanekileyo kweecollet chucks. Ukongeza, ukungcangcazela kwencam encinci kwakulawulwa ngaphakathi kwe-10 microns. Ukugcina indawo echanekileyo yomngxunya kwi-PCB, isuntswana lokumba lifakwe kwibhentshi le-servo elilawula ukuhamba kwebhentshi ecaleni kwe-X kunye ne-Y axes. Izixhobo zesitayile zisetyenziselwa ukulawula ukuhamba kwe-PCB ecaleni kwe-Z axis.

Njengokuba isikhewu semingxunya kumgca webandla le-PCB sincipha kwaye isidingo sokwenyuka okuphezulu, i-elektroniki elawula i-servo isenokuwa ngasemva ngexesha elithile. Sebenzisa i-laser yokomba ukwenza imingxunya esetyenziselwa ukwenza iPCBS inceda ukunciphisa okanye ukuphelisa le lag, yimfuno yesizukulwana esilandelayo.

Laser ukubhola

I-laser bit esetyenziswe kwimveliso ye-PCB ineseti entsonkothileyo yezinto ezibonakalayo ezilawula ukuchaneka kweelaser ezifunekayo ukubetha imingxunya.

Ubungakanani (ubukhulu) bemingxunya eza kugrunjwa kwi-PCB ilawulwa ngumngxunya wofakelo, ngelixa ubunzulu bemingxunya bulawulwa lixesha lokuvezwa. Ngaphaya koko, umqadi wahlulwe ngokwamabhanti amaninzi ukubonelela ngolawulo olongezelelekileyo kunye nokuchaneka. Iilensi ezijolise kwiselfowuni zisetyenziselwa ukugxila kumandla ombane we-laser kwindawo eyiyo. Izixhobo zeGalveno zisetyenziselwa ukuhamba kunye nokubekwa kwePCBS ngokuchaneka okuphezulu. Izinzwa zeGalveno ezinokutshintsha kwi-2400 KHz ngoku zisetyenziswa kwimizi-mveliso.

Ukongeza, indlela yenoveli ebizwa ngokuba kukuvezwa ngokuthe ngqo inokusetyenziselwa ukubhola imingxunya kwiibhodi zesekethe. Itekhnoloji isekwe kwingcinga yokulungiswa kwemifanekiso, apho inkqubo iphucula ukuchaneka kunye nesantya ngokwenza umfanekiso wePCB kunye nokuguqula loo mfanekiso kwimephu yendawo. Imephu yokuma isetyenziselwa ukulungelelanisa i-PCB engezantsi kwelaser ngexesha lokomba.

Uphando olwenziweyo lokulungisa umfanekiso kunye nokusebenza ngokuchanekileyo kuya kuqhubeka ukuphucula imveliso kunye nokuveliswa kwemveliso yePCB kunye nokomba okukhawulezayo okusetyenziswa kwinkqubo.