Nā mea nui e hoʻopili i ka hiki ke hana ʻia o PCB

Ma ke ʻano he ʻāpana nui o nā huahana uila, papa kaapuni i paʻi ʻia (PCB) he kī nui i ka hoʻomaopopo ʻana i ka hana o nā huahana uila, e alakaʻi ai i ka koʻikoʻi nui o ka hoʻolālā PCB, no ka mea ʻo ka hana o ka hoʻolālā PCB e hoʻoholo pololei i ka hana a me ke kumukūʻai o nā huahana uila. Hiki i ka hoʻolālā PCB maikaʻi ke mālama i nā huahana uila mai nā pilikia he nui, no laila e hōʻoia ana i hiki ke hana maʻalahi ʻia nā huahana a hoʻokō i nā pono āpau o nā noi hana.

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ʻO nā mea āpau e hāʻawi i ka hoʻolālā PCB, pono pono ka hoʻolālā hana (DFM) no ka mea e hoʻopili ana i ka hoʻolālā PCB me ka hana ʻana o PCB i mea e ʻike ai i nā pilikia i ke kakahiaka a hoʻonā iā lākou i ka manawa ma ke ola holoʻokoʻa o nā huahana uila. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

PCB hiki ke hana

Ma ka hoʻohui ʻana i ka hana me ka hoʻolālā PCB, hana hoʻolālā hoʻolālā kahi kī nui e alakaʻi i ka hana ʻana i ke ʻano kūpono, kiʻekiʻe kiʻekiʻe a me ke kumu kūʻai haʻahaʻa. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Inā ʻaʻole e noʻonoʻo pono ʻia kēia mau ʻaoʻao i ke kahua hoʻolālā PCB, ʻaʻole hiki i nā mīkini laminating chip chip automate ke ʻae i nā papa PCB prefabricated ke ʻole e lawe ʻia nā ana hana hou. I mea e pōʻino ai, ʻaʻole hiki ke hana maʻalahi ʻia kekahi mau pā i ka hoʻohana ʻana i ka hoʻopili lima. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Loaʻa i kēlā me kēia mea hoʻokipa i kāna nui PCB makemake, i loli e like me nā palena o kēlā me kēia mea hoʻonoho. ʻO kahi laʻana, ʻae ka mea hoʻokipa i ka nui o ka nui PCB o 500mm * 450mm a me ka nui o ka nui PCB o 30mm * 30mm. ʻAʻole ia he kumu ʻaʻole hiki iā mākou ke lawelawe i nā ʻāpana papa PCB ma mua o 30mm e 30mm, a hiki ke hilinaʻi i nā papa jigsaw ke koi ʻia nā liʻiliʻi liʻiliʻi. Ke hiki iā ʻoe ke hilinaʻi wale i ka hoʻokomo lima ʻana a piʻi nā kumukūʻai hana a piʻi ʻole ka hana ʻana, hana ʻole nā ​​mīkini SMT chip i nā papa PCB nui a liʻiliʻi paha. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Hōʻike ka hiʻohiʻona aʻe i ka palapala hoʻolālā papa PCB i hoʻopau ʻia e Huaqiu DFM polokalamu. Ma ke ʻano he papa 5 × 2, he ʻāpana hoʻokahi kēlā me kēia ʻāpana huinahā, ana 50mm e 20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Wahi a nā koi i luna, hiki ke hoʻoholo ʻia ka nui o ka papa ma waena o ka pae i ʻae ʻia.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. Pono kahi PCB maʻamau e huinahā i ke ʻano me ka lōʻihi o ka laulā o 4: 3 a i ʻole 5: 4 (ʻoi loa). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. I mea e pale ʻole ai i kēia, pono e hoʻolālā ʻia ka PCB i kahi ʻano maʻamau i ka manawa o ka hoʻolālā PCB e kū ai i nā koina SMT. Eia naʻe, paʻakikī kēia hana i ka hana. Ke pono ʻole ke kinona o kekahi huahana uila, pono e hoʻohana i nā lua hehi e hāʻawi i ka PCB hope loa i kahi kinona maʻamau. Ke ʻākoakoa, hiki ke hoʻoneʻe ʻia nā baffle kōkua kōkua hou mai ka PCB e hālāwai i nā pono hoʻonohonoho ponoʻī.

Hōʻike ke kiʻi ma lalo i ka PCB me ke ʻano kaulike ʻole, a ua hoʻohui ʻia ka lihi hana e Huaqiu DFM polokalamu. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. ʻaoʻao hana

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

I ka hoʻolālā hoʻolālā PCB, pono e hoʻokaʻawale ʻia ka 5mm ākea ākea ma mua, me ka waiho ʻole i nā ʻāpana a me nā uea. Hoʻokomo ʻia ke alakaʻi ʻenehana ma ka ʻaoʻao pōkole o ka PCB, akā hiki ke koho ʻia i ka ʻaoʻao pōkole ke ʻoi aku ka hiʻohiʻona i 80%. Ma hope o ka ʻākoakoa, hiki ke hemo i ke kaʻina hana ma ke ʻano he hana hana kōkua.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. No laila, ʻo Mark māka nā māka hana hana SMT i koi ʻia no ka hana automated.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. ʻO ke kikowaena waena ma waena o ka lae Mark a me ka lihi o ka papa ma kahi o 5mm. No PCBS me nā ʻaoʻao SMT ʻelua ʻaoʻao, e kau ʻia nā māka Mark ma nā ʻaoʻao ʻelua. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

ʻO ka hui PCB, a i ʻole PCBA no ka pōkole, ʻo ia ke kaʻina o nā pono hoʻohui i nā papa hanau. I mea e hoʻokō ai i nā koina o ka hana aunoa, aia i kahi hui PCB kekahi mau koi no ka pūʻulu hui a me ka hoʻonohonoho hoʻonohonoho.

1. Packaging o nā ʻāpana

Ma ka hoʻolālā PCBA, inā ʻaʻole hoʻokō nā pūʻulu ʻāpana i nā kūlana kūpono a kokoke loa nā ʻāpana, ʻaʻole hiki ke kau aunoa.

I mea e loaʻa ai ka ʻāpana ʻāpana ʻoi loa, pono e hoʻohana i ka lako polokalamu hoʻolālā EDA ʻoihana e kūlike me nā pae hoʻohālikelike ʻāpana o ka honua. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

ʻO ka hoʻonohonoho hoʻonohonoho kahi hana nui i ka hoʻolālā PCB no ka mea pili pono kāna hana i ka paʻakikī o ka helehelena PCB a me ke kaʻina hana.

I ka hoʻonohonoho hoʻonohonoho, pono e hoʻoholo i nā ʻāpana o ka hui o SMD a me THD. Maʻaneʻi, hoʻonohonoho mākou i ka mua o ka PCB ma ke ʻano he ʻaoʻao A a ʻo ka hope ma ke ʻaoʻao B ʻaoʻao. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Pono ka ʻaha ʻokoʻa i nā kaʻina hana a me nā ʻenehana ʻokoʻa. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

Ma ke ʻano laulā, e kūlike ka ʻaoʻao orientation. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. Pono ke kiʻekiʻe o ka mea i 4mm, a ʻo ka kuhikuhi i ka lawe ma waena o ka mea a me ka PCB 90 °.

I mea e hoʻomaikaʻi ai i ka wikiwiki o ka wili ʻana o nā ʻāpana a kōkua i ka nānā hou ʻana, e kūlike ka spacing ma waena o nā mea. Pono nā mea hana i ka pūnaewele like e kokoke i kekahi i kekahi a waiho ʻia kahi mamao palekana ma waena o nā pūnaewele like ʻole e like me ka hāʻule uila. ʻAʻole pono e hoʻopili ʻia ka silkscreen a me ka pale, i ʻole e hoʻonoho ʻia nā ʻāpana.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. Pono e hoʻonohonoho i ka hoʻonohonoho o nā mea i ka hoʻopau wela. Inā pono, e hoʻohana i ka peahi a i ʻole ka poho wela. Pono e koho ʻia nā radiator kūpono no nā pono uila a pono e hoʻokau ʻia nā mea wela wela mai ka wela. Pono e kau i ka mea kiʻekiʻe ma hope o ka mea haʻahaʻa.

E kia nui aʻe nā kikoʻī ma PCB DFM, a pono e hōʻiliʻili i ka ʻike i ka hana. ʻO kahi laʻana, nā koi hoʻolālā PCB wikiwiki wikiwiki i nā koi impedance kūikawā a pono e kūkākūkā ʻia me ka mea hana papa ma mua o ka hana maoli ʻana e hoʻoholo ai i ka impedance a me ka hoʻomoe ʻana i ka ʻike. I mea e hoʻomākaukau ai no ka hana ʻana ma nā papa PCB liʻiliʻi liʻiliʻi me ka uea paʻa, pono e kūkākūkā ʻia ka palena palena palena palena liʻiliʻi a me ka puka hana anawaena o ka lua-puka me ka mea hana PCB e hōʻoia i ka hana maʻalahi o kēia PCBS.