As an essential part of electronic products, b’ċirkwit stampat (PCB) għandu rwol ewlieni fit-twettiq tal-funzjoni tal-prodotti elettroniċi, li jwassal għall-importanza dejjem aktar prominenti tad-disinn tal-PCB, minħabba li l-prestazzjoni tad-disinn tal-PCB tiddetermina direttament il-funzjoni u l-ispiża tal-prodotti elettroniċi. Disinn tajjeb tal-PCB jista ‘jżomm prodotti elettroniċi minn ħafna problemi, u b’hekk jiżgura li l-prodotti jistgħu jiġu manifatturati bla xkiel u jissodisfaw il-ħtiġijiet kollha ta’ applikazzjonijiet prattiċi.

Mill-elementi kollha li jikkontribwixxu għad-disinn tal-PCB, id-Disinn tal-manifattura (DFM) huwa assolutament essenzjali minħabba li jorbot id-disinn tal-PCB mal-manifattura tal-PCB sabiex issib problemi kmieni u ssolvihom fil-ħin matul iċ-ċiklu tal-ħajja tal-prodotti elettroniċi. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

Manifatturabilità tal-PCB

Billi tgħaqqad il-manifatturabilità mad-disinn tal-PCB, id-disinn tal-manifattura huwa fattur ewlieni li jwassal għal manifattura effiċjenti, ta ‘kwalità għolja u bi prezz baxx. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Jekk dawn l-aspetti ma jiġux ikkunsidrati għal kollox fl-istadju tad-disinn tal-PCB, il-magni awtomatiċi tal-laminazzjoni taċ-ċippa jistgħu ma jkunux kapaċi jaċċettaw bordijiet tal-PCB prefabbrikati sakemm ma jittieħdux miżuri ta ‘pproċessar addizzjonali. Biex tgħaxxaq, xi pjanċi ma jistgħux isiru awtomatikament bl-użu ta ‘wweldjar manwali. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Kull installatur taċ-ċippa għandu d-daqs tal-PCB mixtieq tiegħu stess, li jvarja skont il-parametri ta ‘kull installatur. Pereżempju, l-installatur taċ-ċippa jaċċetta daqs massimu tal-PCB ta ‘500mm * 450mm u daqs minimu tal-PCB ta’ 30mm * 30mm. Dan ma jfissirx li ma nistgħux nimmaniġġaw komponenti tal-bord tal-PCB iżgħar minn 30mm bi 30mm, u nistgħu niddependu fuq bordijiet tal-jigsaw meta jkunu meħtieġa daqsijiet iżgħar. Meta tista ’tistrieħ biss fuq installazzjoni manwali u l-ispejjeż tax-xogħol qed jiżdiedu u ċ-ċikli tal-produzzjoni huma barra mill-kontroll, il-magni SMT taċ-ċippa qatt ma jaċċettaw bordijiet tal-PCB li huma kbar wisq jew żgħar wisq. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Il-figura li ġejja turi d-dokument tad-disinn tal-bord tal-PCB mimli bis-softwer Huaqiu DFM. Bħala bord 5 × 2, kull unità kwadra hija biċċa waħda, li tkejjel 50mm b’20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Skond ir-rekwiżiti ta ‘hawn fuq, jista’ jiġi konkluż li d-daqs tal-bord huwa fil-medda aċċettabbli.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. PCB normali għandu jkun f’forma rettangolari bi proporzjon bejn tul u wisa ‘ta’ 4: 3 jew 5: 4 (l-aħjar). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. Biex dan ma jseħħx, il-PCB għandu jkun iddisinjat f’forma komuni matul il-fażi tad-disinn tal-PCB biex jissodisfa r-rekwiżiti tal-SMT. Madankollu, dan huwa diffiċli li jsir fil-prattika. Meta l-forma ta ‘xi prodotti elettroniċi trid tkun irregolari, għandhom jintużaw toqob tat-timbru biex jagħtu lill-PCB finali forma normali. Meta mmuntati, baffles awżiljarji żejda jistgħu jitneħħew mill-PCB biex jissodisfaw l-installazzjoni awtomatika u l-ħtiġijiet ta ‘spazju.

L-istampa hawn taħt turi l-PCB b’forma irregolari, u t-tarf tal-ipproċessar huwa miżjud mis-softwer Huaqiu DFM. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. In-naħa tal-proċess

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

Fl-istadju tad-disinn tal-PCB, it-tarf tal-proċess wiesa ‘5mm għandu jitwarrab minn qabel, mingħajr ma jitħallew komponenti u wajers. Il-gwida teknika ġeneralment titqiegħed fuq in-naħa qasira tal-PCB, iżda n-naħa l-qasira tista ‘tintgħażel meta l-proporzjon tal-aspett jaqbeż it-80%. Wara l-assemblaġġ, it-tarf tal-proċess jista ‘jitneħħa bħala rwol ta’ produzzjoni awżiljarju.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. Għalhekk, il-punti Mark huma parametri referenzjarji tal-manifattura SMT meħtieġa għall-manifattura awtomatizzata.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. Id-distanza ċentrali bejn il-punt Mark u t-tarf tal-pjanċa għandha tkun mill-inqas 5mm. Għal PCBS b’komponenti SMT b’żewġ naħat, il-punti Mark għandhom jitpoġġew fuq iż-żewġ naħat. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

PCB assembly, or PCBA for short, is actually the process of welding components onto bare boards. Sabiex tissodisfa r-rekwiżiti tal-manifattura awtomatika, l-assemblaġġ tal-PCB għandu xi rekwiżiti għall-pakkett tal-assemblaġġ u t-tqassim tal-assemblaġġ.

1. Ippakkjar ta ‘komponenti

Matul id-disinn tal-PCBA, jekk il-pakketti tal-komponenti ma jissodisfawx l-istandards xierqa u l-komponenti huma viċin wisq, l-installazzjoni awtomatika ma sseħħx.

Sabiex jinkiseb l-aħjar ippakkjar ta ‘komponenti, softwer ta’ disinn EDA professjonali għandu jintuża biex jikkonforma ma ‘standards internazzjonali ta’ ppakkjar ta ‘komponenti. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

It-tqassim tal-komponent huwa kompitu importanti fid-disinn tal-PCB minħabba li l-prestazzjoni tiegħu hija direttament relatata mal-kumplessità tad-dehra tal-PCB u l-proċess tal-manifattura.

Matul it-tqassim tal-komponent, l-uċuħ tal-assemblaġġ tal-komponenti SMD u THD għandhom jiġu determinati. Hawnhekk, nissettjaw il-faċċata tal-PCB bħala l-komponent A naħa u d-dahar bħala l-komponent B ġenb. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Assemblaġġ differenti jeħtieġ proċessi u tekniki ta ‘manifattura differenti. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

B’mod ġenerali, l-orjentazzjoni tal-komponent għandha tkun konsistenti. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. L-għoli tal-komponent għandu jkun sa 4mm, u d-direzzjoni tat-trasmissjoni bejn il-komponent u l-PCB għandha tkun 90 °.

Biex ittejjeb il-veloċità tal-iwweldjar tal-komponenti u tiffaċilita spezzjoni sussegwenti, l-ispazjar bejn il-komponenti għandu jkun konsistenti. Components in the same network should be close to each other and a safe distance should be left between different networks according to the voltage drop. Silkscreen and pad must not overlap, otherwise components will not be installed.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. It-tqassim tal-komponenti għandu jiffoka fuq id-dissipazzjoni tas-sħana. Jekk meħtieġ, uża fann jew sink tas-sħana. Radjaturi xierqa għandhom jintgħażlu għall-komponenti tal-enerġija u l-komponenti sensittivi għas-sħana għandhom jitpoġġew ‘il bogħod mis-sħana. Il-komponent għoli għandu jitqiegħed wara l-komponent baxx.

Aktar dettalji għandhom ikunu ffokati fuq PCB DFM, u l-esperjenza għandha tkun akkumulata fil-prattika. Pereżempju, ir-rekwiżiti tad-disinn tal-PCB tas-sinjal b’veloċità għolja għandhom rekwiżiti ta ‘impedenza speċjali u għandhom jiġu diskussi mal-manifattur tal-bord qabel il-manifattura attwali biex tiddetermina l-impedenza u l-informazzjoni ta’ saffi. Sabiex tipprepara għall-produzzjoni fuq bordijiet ta ‘PCB ta’ daqs żgħir b’wajers densi, il-wisa ‘minima tal-wajers u l-kapaċità tal-manifattura b’dijametru minn ġo toqba għandhom jiġu diskussi mal-manifattur tal-PCB biex tiġi żgurata produzzjoni bla xkiel ta’ dawn il-PCBS.