As an essential part of electronic products, typis circuitu tabula (PCB) Praecipuum munus agit in functione electronicarum productorum cognoscendo, quod ad pondus PCB designationis magis magisque eminet, quia exsecutio designationis PCB directe determinat munus et sumptus electronicarum productorum. Consilium PCB bonum electronicas res ex multis quaestionibus retinere potest, ita ut fructus aequaliter confici et omnibus applicationibus applicationum usuum occurrere possit.

Omnium elementorum quae ad PCB designationem conferunt, Design fabricandi (DFM) omnino essentiale est, quod PCB cum PCB fabricando consilio coniungit ut difficultates mane invenias et in tempore per totam vitam cycli electronicarum productorum solvendum sit. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

PCB manufacturibilitate

Coniungendo manufacturibilitatem cum consilio PCB, consilium fabricandi factor est key ducens ad fabricam efficientem, qualitatem altam et humilis sumptus. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Si hae rationes in scaena consilio PCB non plene considerentur, schedulae laminae latae sententiae admittere non possunt tabulas praefabbricatas PCB, nisi mensurae accessiones additae sumantur. Ad res deteriores faciendas, nonnullae laminae automatice uti glutino manuali fieri non possunt. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Singulis assulis installator magnitudinem suam PCB desideratam habet, quae secundum ambitum cuiusque institutionis variat. Exempli gratia, instrumentum photographicum accipit magnitudinem maximam PCB 500mm * 450mm et magnitudinem minimam PCB 30mm * 30mm. Hoc non significat nos non possumus componentes tabulas PCB tractare minores quam 30mm per 30mm, et in tabulas jigsaw fidit, cum magnitudinum minorum requiruntur. Cum sola institutione manuali confidere potes et gratuita opera exsurgunt et cycli productionis sunt extra potestatem, machinae SMT chips numquam accipient tabulas PCB quae nimis magnae sunt vel nimis parvae sunt. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Sequens figura illustrat PCB tabulae documenti designati ab Huaqiu DFM programmatis perfecti. As a 5×2 board, each square unit is a single piece, measuring 50mm by 20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Secundum requisita praedicta concludi potest magnitudinem tabulae intra ambitum acceptabilem.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. Normalis PCB figura debet esse rectangula longitudine ad latitudinem ratione 4 3 vel 5:4 (optima). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. Ad hoc ne fiat, PCB designari debet in figura communi per tempus PCB designationis ad occursum SMT requisitis. Sed hoc difficile est in usu facere. Cum figura alicuius productorum electronicorum irregularis esse debet, foramina notata adhibenda est ut ultimam PCB figuram normalem reddat. Cum convenerunt, redundantes casus auxiliares a PCB amoveri possunt ad institutionem latis et spatii requisitis.

Pictura infra ostendit PCB cum figura irregulari, et marginem processus addito programmate Huaqiu DFM. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. Processus parte

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

In scaena consilio PCB, 5mm latum processum in antecessum relinquendum est, nullis componentibus et wiring relinquendis. Technica dux plerumque in brevi PCB parte collocari solet, sed latus breve eligi potest cum ratio aspectum 80% excedit. Post conventum, processus in margine amoveri potest ut munus productionis auxiliaris.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. Ideo puncta Mark sunt SMT vestibulum benchmarks pro fabricando automated requisiti.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. Centrum intervallum inter Mark punctum et laminam marginem saltem 5mm esse debet. For PCBS with double-sided SMT components, Mark points should be placed on both sides. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

PCB assembly, or PCBA for short, is actually the process of welding components onto bare boards. Ut metus activitatis automatice occurrat, conventus PCB quaedam necessaria habet ad sarcinas conventuum et ad missionem assequendam.

1. Packaging of components

In consilio PCBA, si fasciculi componentes signa et partes convenientia non conveniunt, nimis arcta sunt, institutionis automatariae non occurret.

Ad optimam sarcinam componentium obtinendam, consiliorum professionalium EDA programmatio utendum est ad obtemperandum signis componentibus internationalibus packaging. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

Component layout negotium magni momenti in consilio PCB est quia eius effectus directe refertur ad intricationem speciei PCB et processus fabricandi.

In extensione componentium, superficies partium SMD et THD conventus determinari debent. Hic frontem PCB ponimus ut componentia A latus & dorsum ut latus B component. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Diversus conventus diversos processus et artes fabricandi requirit. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

In genere, orientatio componentis congruere debet. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. Altitudo componentis sit usque ad 4mm, et directio transmissio inter componentem et PCB debet 90°.

Ut glutino celeritas partium emendare et inspectionem subsequentem faciliorem reddere, congruere debet spatii inter partes. Components in the same network should be close to each other and a safe distance should be left between different networks according to the voltage drop. Silkscreen and pad must not overlap, otherwise components will not be installed.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. Propositum partium in calore dissipationis intendere debet. Si opus est, ventilabro vel calore subsidunt. Apta radiators eligendus est ad potentiam componentium et caloris sensitivas poni ab calore. The high component should be placed after the low component.

More details should be focused on PCB DFM, and experience should be accumulated in practice. Exempli gratia, summus velocitatis signum PCB designatio requisita specialem impedimentum requiruntur et tractari debent cum fabrica ante tabulam actualem fabricandi ad determinandum impedimentum et informationem stratis. Ut ad productionem parvarum PCB tabularum cum densis wiring mediocribus apparandae, minimae evolutae latitudinis et per foramen diametri capacitatis fabricandi cum PCB fabricandi ratiocinari debet ut lenis horum PCBS productionem curet.