Amin’ny maha-ampahany ilaina amin’ny vokatra elektronika, pirinty boribory pirinty (PCB) dia mitana andraikitra lehibe amin’ny fahatsapana ny fiasan’ny vokatra elektronika, izay mitarika ho amin’ny fanomezan-danja ny famolavolana PCB, satria ny fahombiazan’ny famolavolana PCB dia mamaritra ny asany sy ny vidin’ny vokatra elektronika. Ny famolavolana PCB tsara dia afaka mitazona ny vokatra elektronika amin’ny olana maro, ka miantoka ny vokatra azo amboarina tsara sy mahafeno ny filan’ny fampiharana azo ampiharina.

Amin’ireo singa rehetra mandray anjara amin’ny famolavolana PCB, ny famolavolana Design (DFM) dia tena ilaina tokoa satria mampifandray ny famolavolana PCB sy ny famokarana PCB mba hahitana olana mialoha sy hamahana azy ara-potoana mandritra ny androm-piainan’ny vokatra elektronika. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

Famokarana PCB

Amin’ny alàlan’ny fampifangaroana ny famokarana sy ny famolavolana PCB, ny famolavolana ny famokarana dia singa iray lehibe mitarika amin’ny famokarana mahomby, avo lenta ary vidiny ambany. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Raha toa ka tsy raisina an-tsakany sy andavany ireo lafin-javatra ireo eo amin’ny sehatry ny famolavolana PCB, dia mety tsy ho afaka hanaiky ny takelaka PCB vita mialoha ny milina fanosotra automatique raha tsy hoe misy fepetra fanodinana fanampiny raisina. Raha te hiharatsy kokoa ny raharaha, ny takelaka sasany dia tsy azo atao mandeha ho azy amin’ny fampiasana fantson-tànana. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Ny mpampiditra chip tsirairay dia samy manana ny haben’ny PCB tadiaviny, izay miovaova arakaraka ny masontsivana an’ny mpiorina tsirairay. Ohatra, ny installer puce dia manaiky haben’ny PCB ambony indrindra 500mm * 450mm ary habe PCB farafaharatsiny 30mm * 30mm. Tsy midika izany fa tsy afaka mifehy ireo singa birao PCB kely kokoa noho ny 30mm amin’ny 30mm isika, ary afaka miantehitra amin’ny tabilaon’ny jigsaw rehefa takiana habe kely kokoa. Rehefa tsy afaka miantehitra amin’ny fametrahana tanana fotsiny ianao ary miakatra ny vidin’ny asa ary tsy voafehy ny tsingerina famokarana, ny milina SMT chip dia tsy hanaiky ny takelaka PCB izay lehibe loatra na kely loatra. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Ity sary manaraka ity dia maneho ny antontan-taratasy famolavolana birao PCB vita amin’ny rindrambaiko Huaqiu DFM. Amin’ny maha board 5 × 2 anao dia singa tokana ny refy iray isaky ny kianja, mirefy 50mm amin’ny 20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Araka ny fepetra takiana etsy ambony, dia azo atao ny mamintina fa ny haben’ny tabilao dia ao anatin’ny faritra azo ekena.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. Ny PCB mahazatra dia tokony ho endrika mahitsizoro amin’ny haben’ny 4: 3 na 5: 4 (tsara indrindra). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. Mba hisorohana izany tsy hitranga dia tsy maintsy noforonina amin’ny endrika mahazatra ny PCB mandritra ny dingana famolavolana PCB hahatratra ny fepetra takian’ny SMT. Na izany aza, sarotra atao amin’ny fampiharana izany. Rehefa tsy maintsy tsy ara-dalàna ny endrik’ireo vokatra elektronika sasany dia tsy maintsy ampiasaina ny lavaka hajia mba hanome endrika mahazatra ny PCB farany. Rehefa mivory dia azo esorina amin’ny PCB ny baffle auxiliary fanampiny izay mahafeno ny fepetra takiana amin’ny fametrahana azy sy ny habaka.

Ity sary eto ambany ity dia mampiseho ny PCB misy endrika tsy ara-dalàna, ary ny sisin’ny fikirakirana dia ampidirin’ny rindrambaiko Huaqiu DFM. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. lafiny lafiny

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

Ao amin’ny sehatra famolavolana PCB, ny sisin’ny dingana 5mm dia tokony hatokana mialoha, nefa tsy mamela singa sy tariby. Ny torolàlana teknika dia matetika apetraka eo amin’ny lafiny fohy amin’ny PCB, fa ny lafiny fohy dia azo fidina rehefa mihoatra ny 80% ny tahan’ny lafiny. Aorian’ny fivoriana, ny sisin’ny fizotrany dia azo esorina ho anjara asa famokarana fanampiny.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. Noho izany, Marka dia marika famokarana SMT takiana amin’ny famokarana mandeha ho azy.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. Ny elanelana afovoany eo anelanelan’ny teboka Mark sy ny sisin’ny takelaka dia tokony 5mm farafaharatsiny. Ho an’ny PCBS misy singa SMT misy lafiny roa dia tokony hapetraka amin’ny lafiny roa ny marika Mark. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

PCB assembly, or PCBA for short, is actually the process of welding components onto bare boards. Mba hahafeno ny fepetra takiana amin’ny famokarana mandeha ho azy, ny fivorian’ny PCB dia misy fepetra takiana amin’ny fonosana fonosana sy ny fametrahana ny fivoriambe.

1. Fonosana singa

Mandritra ny famolavolana PCBA, raha tsy mifanaraka amin’ny fenitra sahaza azy ireo fonosana singa ary mifanakaiky loatra ny singa dia tsy hitranga ny fametrahana azy ho azy.

Mba hahazoana ny fonosana singa tsara indrindra, ny rindrambaiko famolavolana EDA matihanina dia tokony hampiasaina hanarahana ny fenitra famonosana singa iraisam-pirenena. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

Ny firafitry ny singa dia andraikitra lehibe amin’ny famolavolana PCB satria ny fahombiazany dia mifandraika mivantana amin’ny fahasarotan’ny fisehoan’ny PCB sy ny fizotran’ny famokarana.

Mandritra ny firafitry ny singa, ny faritry ny fivorian’ny SMD sy ny THD dia tokony ho faritana. Eto izahay dia mametraka ny alohan’ny PCB ho toy ny lafiny A ary ny aoriana ho toy ny lafiny B. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Ny fivondronana samihafa dia mitaky fomba sy teknika famokarana samihafa. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

Amin’ny ankapobeny, ny orientation-n’ny singa dia tokony hifanaraka. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. Ny haavon’ny singa dia tokony hahatratra 4mm, ary ny lalana fampitana eo anelanelan’ny singa sy ny PCB dia tokony 90 °.

Mba hanatsarana ny hafainganam-pandehan’ny welding sy ny fanamorana ny fanaraha-maso manaraka, ny elanelana misy eo amin’ny singa dia tokony ho mifanaraka. Components in the same network should be close to each other and a safe distance should be left between different networks according to the voltage drop. Silkscreen and pad must not overlap, otherwise components will not be installed.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. Ny firafitry ny singa dia tokony hifantoka amin’ny fanaparitahana ny hafanana. Raha ilaina dia ampiasao ny mpankafy na ny heat sink. Ireo radiatera mety dia tokony hofidina ho an’ireo singa mandeha amin’ny herinaratra ary tokony hapetraka lavitra ny hafanana ireo singa mihetsiketsika momba ny hafanana. Ny singa avo lenta dia tokony hapetraka aorian’ny singa ambany.

Ny antsipiriany bebe kokoa dia tokony hifantoka amin’ny PCB DFM, ary ny traikefa dia tokony hangonina amin’ny fampiharana. Ohatra, ny takiana famolavolana haingam-pandeha haingam-pandeha dia manana fepetra takiana manokana ary tokony horesahina amin’ny mpanamboatra birao alohan’ny tena fanamboarana hamaritana ny impedance sy ny layering information. Mba hiomanana amin’ny famokarana amin’ny takelaka PCB kely habe misy tariby matevina, ny haben’ny tariby farafahakeliny sy ny fahaizany manamboatra savaivony dia tokony horesahina amin’ny mpanamboatra PCB hahazoana antoka ny famokarana PCBS ireo.