Dị ka akụkụ dị mkpa nke ngwaahịa elektrọnik, bọọdụ sekit biri ebi (PCB) na -arụ ọrụ dị mkpa n’ịghọta ọrụ nke ngwaahịa elektrọnik, nke na -eduga n’ịdị mkpa nke imewe PCB, n’ihi na arụmọrụ nke imewe PCB na -ekpebi ọrụ na ọnụ ahịa ngwaahịa elektrọnik ozugbo. Ezi nhazi PCB nwere ike idobe ngwaahịa elektrọnik site n’ọtụtụ nsogbu, si otú a na -ahụ na enwere ike imepụta ngwaahịa na -enweghị nsogbu na izute mkpa niile nke ngwa bara uru.

N’ime ihe niile na -enye aka na imepụta PCB, imepụta ihe nrụpụta (DFM) dị ezigbo mkpa n’ihi na ọ na -ejikọ imebe PCB na nrụpụta PCB iji chọta nsogbu n’oge wee dozie ya n’oge ndụ niile nke ngwaahịa elektrọnik. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

Mmepụta PCB

Site na ijikọta nrụpụta ihe na imebe PCB, imepụta ihe bụ isi ihe na -eduga n’ịrụpụta nke ọma, ogo dị elu na ọnụ ala. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Ọ bụrụ na ebuteghị akụkụ ndị a nke ọma na ọkwa imebe PCB, igwe na -adọkpụ akpaka nwere ike ọ gaghị enwe ike ịnabata mbadamba PCB ma ọ bụrụ na ewereghị usoro nhazi ọzọ. Nke ka njọ, enweghị ike ịme efere ụfọdụ na -akpaghị aka site na iji ịgbado ọkụ. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Onye nrụnye mgbawa ọ bụla nwere nha PCB nke ya, nke na -adịgasị iche dabere na nha nke nrụnye ọ bụla. Dịka ọmụmaatụ, onye nrụnye mgbawa na -anabata nha PCB kachasị nke 500mm * 450mm yana obere PCB nke 30mm * 30mm. Nke a apụtaghị na anyị enweghị ike ijikwa ihe osisi PCB pere mpe karịa 30mm site na 30mm, ma nwee ike ịdabere na bọọdụ jigsaw mgbe achọrọ obere nha. Mgbe ị nwere ike ịdabere naanị na ntinye akwụkwọ ntuziaka na ụgwọ ọrụ na -arị elu na usoro mmepụta adịghịzi, igwe mgbawa SMT agaghị anabata mbadamba PCB nke buru oke ibu ma ọ bụ pere mpe. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Onyonyo a na -egosi akwụkwọ nrụpụta bọọdụ PCB nke ngwanrọ Huaqiu DFM dechara. Dị ka bọọdụ 5 × 2, ngalaba square ọ bụla bụ otu ibe, na -atụ 50mm site na 20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Dabere na ihe ndị a chọrọ n’elu, enwere ike kwubie na nha bọọdụ ahụ dị n’ime oke anabatara.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. PCB nkịtị kwesịrị ịdị n’ụdị akụkụ anọ nwere ogologo ruo obosara nke 4: 3 ma ọ bụ 5: 4 (kacha mma). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. Iji gbochie nke a ime, PCB ga -abụrịrị nke a na -ahụkarị n’oge usoro imebe PCB iji mezuo ihe ndị SMT chọrọ. Agbanyeghị, nke a siri ike ime na omume. Mgbe ụdị ụfọdụ ngwaahịa elektrọnik ga -abụrịrị oge adịghị mma, a ga -ejirịrị oghere stampụ iji nye PCB ikpeazụ ụdị ọdịdị. Mgbe agbakọtara, enwere ike wepu ihe mgbagwoju anya na -enweghị atụ na PCB iji zute nrụnye akpaka na ohere oghere.

Foto dị n’okpuru ebe a na -egosi PCB nwere ọdịdị adịghị mma, ngwanrọ Huaqiu DFM gbakwunyere na nhazi nhazi ya. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. Akụkụ usoro

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

N’ọkwa imebe PCB, ekwesịrị idobe ihu usoro 5mm tupu oge eruo, na -ahapụghị ihe ọ bụla na eriri ọkụ. A na -etinyekarị ntuziaka teknụzụ n’akụkụ dị mkpirikpi nke PCB, mana enwere ike họrọ akụkụ dị mkpirikpi mgbe akụkụ akụkụ gafere 80%. Mgbe mgbakọ gasịrị, enwere ike wepu ihu usoro ahụ dị ka ọrụ mmepụta inyeaka.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. Yabụ, akara Mark bụ akara nrụpụta SMT achọrọ maka nrụpụta akpaghị aka.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. Oghere etiti dị n’etiti Mark na ihu ihu kwesịrị ịdịkarịa ala 5mm. Maka PCBS nwere akụkụ SMT nwere ihu abụọ, ekwesịrị idobe akara n’akụkụ abụọ. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

Mgbakọ PCB, ma ọ bụ PCBA maka mkpụmkpụ, bụ n’ezie usoro ịgbado ọkụ na mbadamba osisi. Iji mezuo ihe achọrọ maka nrụpụta akpaka, mgbakọ PCB nwere ụfọdụ ihe achọrọ maka ngwugwu mgbakọ na nhazi mgbakọ.

1. Nkwakọ ngwaahịa nke ihe

N’oge imebe PCBA, ọ bụrụ na ngwugwu ngwongwo ahụ erughị ụkpụrụ kwesịrị ekwesị yana ihe ndị dị n’otu dịkọrọ ọnụ, nrụnye akpaka agaghị eme.

Iji nweta nkwakọ ngwaahịa akụrụngwa kacha mma, ekwesịrị iji sọftụwia EDA ọkachamara mee ihe kwekọrọ n’ụkpụrụ nkwakọ ngwaahịa akụrụngwa mba ụwa. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

Nhazi akụkụ bụ ọrụ dị mkpa na imebe PCB n’ihi na arụmọrụ ya na -emetụta oke mgbagwoju anya nke PCB na usoro nrụpụta.

N’oge nhazi akụrụngwa, ekwesịrị ikpebi elu ọgbakọ nke ihe SMD na THD. N’ebe a, anyị na -edobe ihu PCB ka akụkụ A n’akụkụ yana azụ dị ka akụkụ B n’akụkụ. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Mgbakọ dị iche iche chọrọ usoro nrụpụta na teknụzụ dị iche iche. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

N’ozuzu, nghazi akụkụ kwesịrị ịdị n’otu. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. Ogo nke ngwa ahụ kwesịrị iru 4mm, na ntụzịaka nnyefe n’etiti akụrụngwa na PCB kwesịrị ịbụ 90 Celsius.

Iji melite ọsọ ịgbado ọkụ nke ihe dị iche iche ma mee ka nyocha dị n’ihu, oghere dị n’etiti ihe kwesịrị ịdị na -agbanwe agbanwe. Components in the same network should be close to each other and a safe distance should be left between different networks according to the voltage drop. Silkscreen na mpe mpe akwa agaghị agabiga, ma ọ bụghị ya, agaghị etinye ihe mejupụtara ya.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. Nhazi nke ngwa kwesịrị ilekwasị anya na mgbasa ọkụ. Ọ bụrụ na ọ dị mkpa, jiri fan ma ọ bụ igwe ncha ọkụ. Ekwesịrị ịhọrọ radiators kwesịrị ekwesị maka ngwa ike yana ihe ndị nwere mmetụta ọkụ kwesịrị ka ewepụ ya na okpomọkụ. Ekwesịrị idobe akụkụ dị elu mgbe akụkụ ala gachara.

Ekwesịrị itinye nkọwa ndị ọzọ na PCB DFM, na ahụmịhe kwesịrị ka agbakọba na omume. Dịka ọmụmaatụ, ihe nrụpụta ihe ngosi PCB nwere oke nwere ihe nrịba ama pụrụ iche, ekwesịrị ka ya na onye nrụpụta bọọdụ kwurịtara tupu imepụta ya nke ọma iji chọpụta impedance na layering information. Iji kwadebe maka nrụpụta na mbadamba PCB pere mpe nwere nnukwu wiwi, ekwesịrị ka gị na onye nrụpụta PCB kwurita mkpanaka kacha nta na oghere iji hụ na mmepụta nke PCBS ndị a dị mma.