Sechikamu chakakosha chemagetsi zvigadzirwa, yakadhindwa redunhu bhodhi (PCB) inoita basa rakakosha mukuziva mashandiro ezvigadzirwa zvemagetsi, izvo zvinotungamira mukukosha kwakanyanya kwePBB dhizaini, nekuti iko kuita kwePCB dhizaini kunoisa zvakananga basa nemutengo wezvigadzirwa zvemagetsi. Yakanaka pcb dhizaini inogona kuchengeta zvigadzirwa zvemagetsi kubva kumatambudziko mazhinji, nekudaro ichivimbisa kuti zvigadzirwa zvinogona kugadzirwa zvakanaka uye kusangana nezvinodiwa zvese zvekushandisa kunoshanda.

Pazvinhu zvese zvinobatsira kuPCB dhizaini, kugadzira Dhizaini (DFM) kwakakosha nekuti inobatanidza PCB dhizaini nePCB yekugadzira kuitira kuti uwane matambudziko nekukurumidza uye kuagadzirisa munguva mukati mehupenyu hupenyu hwezvigadzirwa zvemagetsi. One myth is that the complexity of PCB design will increase as manufacturability of electronics is considered at the PCB design stage. In the design life cycle of electronic products, DFM can not only make electronic products participate in automatic production smoothly, and save labor costs in the manufacturing process, but also effectively shorten the manufacturing time to ensure the timely completion of the final electronic products.

Pcb kugadzirwa

Nekubatanidza kugadzirwa nePCB dhizaini, kugadzira dhizaini chinhu chakakosha chinotungamira mukugadzira kwakanaka, mhando yepamusoro uye mutengo wakaderera. The research of PCB manufacturability covers a wide range, usually divided into PCB manufacturing and PCB assembly.

LPCB production

For PCB manufacturing, the following aspects should be considered: PCB size, PCB shape, process edge and Mark point. Kana zvinhu izvi zvisina kunyatso kutariswa padanho rePBB dhizaini, otomatiki chip laminating michina inogona kusakwanisa kugamuchira mabhodhi ePCB kutoti matanho ekugadzirisa akatorwa. Kuita kuti zvinhu zviwedzere kuoma, mamwe mahwendefa haagone kuitwa otomatiki achishandisa iwo manyowani emoto. As a result, the manufacturing cycle will be longer and labor costs will increase.

1. PCB size

Imwe neimwe chip inosimudza ine yayo yaunoda pcb saizi, iyo inosiyana zvinoenderana nemipimo yeumwe neumwe mugadziri. Semuenzaniso, iyo chip inosimudza inogamuchira yakakwira PCB saizi ye500mm * 450mm uye hushoma pcb saizi ye30mm * 30mm. Izvi hazvireve kuti isu hatigone kubata pcb bhodhi zvinhu zvidiki pane 30mm ne30mm, uye tinogona kuvimba nejigsaw board kana madiki madiki achidikanwa. Kana iwe uchigona chete kuvimba nemaoko ekuisa uye emubhadharo mari iri kukwira uye michina yekugadzira isisakwanise kudzora, chip SMT michina haizombobvuma mabhodhi ePBB akakurisa kana kudiki. Therefore, in the PCB design stage, the PCB size requirements set by automatic installation and manufacturing must be fully considered, and it must be controlled within the effective range.

Iyi inotevera nhamba inoratidza iyo PCB bhodhi dhizaini gwaro rakapedzwa neHuaqiu DFM software. Se 5 × 2 bhodhi, yega yega square unit chidimbu chimwe chete, ichiyera 50mm ne20mm. The connection between each unit is achieved by V-cut/V-scoring technology. In this image, the entire square is shown with a final size of 100mm by 100mm. Zvinoenderana nezvinodiwa pamusoro apa, zvinogona kugumiswa kuti saizi yebhodhi iri mukati meyakagamuchirwa nzvimbo.

2. PCB shape

In addition to PCB size, all chip SMT machines have requirements for PCB shape. Pcb yakajairwa inofanirwa kuve yakatetepa muchimiro nehurefu kusvika pahupamhi reshiyo ye4: 3 kana 5: 4 (yakanakisa). If the PCB is irregularly shaped, additional measures must be taken prior to SMT assembly, resulting in increased costs. Kudzivirira izvi kuti zviitike, iyo PCB inofanirwa kuve yakagadzirirwa mune yakafanana chimiro panguva yePBB dhizaini danho kusangana nezvinodiwa neSMT. Zvisinei, izvi zvakaoma kuita mukuita. Kana chimiro chemimwe michina yemagetsi chichifanira kunge chisingaite, maburi etampu anofanirwa kushandiswa kupa iyo yekupedzisira PCB chimiro chakajairika. Kana yaunganidzwa, zvisingabatsiri zvinobatsira zvinogona kubviswa paPCB kuti zvisangane otomatiki kumisikidza uye nzvimbo zvinoda.

Mufananidzo uri pazasi unoratidza iyo PCB ine chisina kujairika chimiro, uye iyo yekumucheto yekumucheto inowedzerwa neHuaqiu DFM software. The whole circuit board size is 80mm * 52mm, and the square area is the size of the actual PCB. The size of the upper right corner area is 40mm by 20mm, which is the auxiliary craft edge produced by the bridge of the stamp hole.

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3. Nzira yekugadzirisa

To meet the requirements of automatic manufacturing, process edges must be placed on the PCB to secure the PCB.

Mune pcb dhizaini dhizaini, 5mm yakafara maitiro ekumucheto anofanirwa kuiswa parutivi pamberi, pasina kusiya chero chinhu uye wiring. Iyo technical technical gwara inowanzoiswa parutivi pfupi rwePCB, asi ipfupi divi rinogona kusarudzwa kana iyo ratio chiyero ichidarika 80%. Mushure mekusangana, iyo nzira yekumucheto inogona kubviswa seyakabatsira yekugadzira basa.

4. Mark point

For PCBS with components installed, Mark points should be added as a common reference point to ensure that component locations are accurately determined for each assembly device. Naizvozvo, maMark mapoinzi eSMT mabenchimendi ekugadzira anodikanwa ekugadzira otomatiki.

Components require 2 Mark points and PCBS require 3 Mark points. These marks should be placed on the edges of the PCB board and cover all SMT components. Pakati penzvimbo pakati peMako poindi uye mupendero weplate inofanira kunge iri 5mm. Kune PCBS ine maviri-mativi SMT zvikamu, Maka mapoinzi anofanirwa kuiswa pamativi ese. If the components are too close together to place Mark points on the board, they can be placed on the edge of the process.

LPCB assembly

Pcb gungano, kana PCBA kwenguva pfupi, ndiyo nzira yekushambadza zvinhu pamabhodhi asina chinhu. Kuti usangane nezvinodiwa zve otomatiki kugadzira, pcb gungano ine zvimwe zvinodiwa kugungano pasuru uye gadziriso dhizaini.

1.Kupaka zvinhu

Munguva yePCBA dhizaini, kana zvikamu zvemapakeji zvikasasangana nematanho akakodzera uye zvinhu zviri padyo padyo pamwe, otomatiki kumisikidza hakuzoitika.

Kuti uwane yakanakisa yekupakira chinhu, nyanzvi EDA dhizaini software inofanira kushandiswa kutevedzera epasi rose yezvinhu kupakisa zviyero. During PCB design, the aerial view area must not overlap with other areas, and the automatic IC SMT machine will be able to accurately identify and mount the surface.

2. Component layout

Chidimbu dhizaini ibasa rakakosha muPCB dhizaini nekuti mashandiro ayo anoenderana zvakananga nekunetseka kwekuonekwa kwePCB uye maitiro ekugadzira.

Munguva yekumisikidzwa kwechinhu, nzvimbo dzemusangano dzeSMD neTHD zvinofanirwa kutemerwa. Pano, isu tinogadzika kumberi kwePCB sechinhu chikamu A padivi uye kumashure sechikamu chechikamu B. The assembly layout should consider the assembly form, including single layer single package assembly, double layer single package assembly, single layer mixed package assembly, Side A mixed package and side B single package assembly and side A THD and side B SMD assembly. Gungano rakasiyana rinoda nzira dzakasiyana dzekugadzira uye matekinoroji. Therefore, in terms of component layout, the best component layout should be selected to make manufacturing simple and easy, so as to improve the manufacturing efficiency of the whole process.

In addition, consideration must be given to the orientation of component layout, spacing between components, heat dissipation, and component height.

Muzhinji, chimiro chechimiro chinofanirwa kunge chichienderana. Components are laid out in accordance with the principle of minimum tracking distance, based on which components with polarity markers should have uniform polarity directions, and components without polarity markers should be neatly aligned along the X or Y axis. Kureba kwechinhu kunofanirwa kusvika kusvika 4mm, uye nzira yekufambisa pakati pechinhu nePCB inofanira kunge iri 90 °.

Kuti uvandudze kumhanyisa kwekumhanyisa kwezvinhu uye kugadzirisa kuongorora kunotevera, nzvimbo pakati pezvinhu inofanirwa kunge ichienderana. Midziyo mune imwechete network inofanira kunge iri padhuze nepadhuze uye chinhambwe chakachengeteka chinofanira kusiiwa pakati penzvimbo dzakasiyana netiweki maererano nemhepo inodonha. Silkscreen uye pad hazvifanire kuwiriranwa, zvikasadaro zvinhu hazvizoiswa.

Due to the actual operating temperature of the PCB and the thermal characteristics of the electrical components, heat dissipation should be considered. Kurongeka kwezvinhu zvinofanirwa kutarisa pakupisa kwekupisa. Kana zvichidikanwa, shandisa fan kana singi yekupisa. Ma radiator akakodzera anofanirwa kusarudzwa pazvinhu zvemagetsi uye zvinodziya zvinopisa zvinofanirwa kuiswa kure nekupisa. Chikamu chepamusoro chinofanira kuiswa mushure mechinhu chakaderera.

Mamwe mashoko anofanirwa kuve akatarisana nePCB DFM, uye ruzivo rwunofanirwa kuunganidzwa mukuita. Semuenzaniso, yekumhanyisa-chiratidzo chiratidzo pcb dhizaini inoda yakasarudzika impedance zvinodikanwa uye inofanirwa kukurukurwa nemugadziri webhodhi isati yagadzirwa chaiyo kuona impedance uye kuisa ruzivo. Kuti ugadzirire kugadzirwa pamabhodhi madiki ePBB ane dense wiring, hushoma wiring upamhi uye kuburikidza-gomba dhayamita yekugadzira kugona inofanirwa kukurukurwa neyeMugadziri wePBB kuona kugadzirwa kwakanaka kweaya maPCBS.