1. PCB ukwelashwa kwendawo:

I-Anti-oxidation, isifutho sikathayela, isifutho sikathayela esingenamthofu, igolide lokucwiliswa, ithini lokucwiliswa, isiliva lokucwiliswa, i-hard gold plating, ibhodi eligcwele legolide, umunwe wegolide, i-nickel palladium gold OSP: izindleko eziphansi, ukudayiswa okuhle, izimo zokugcina ezinzima, isikhathi Ubuchwepheshe obufushane, obuhambisana nemvelo, ukushisela okuhle nokushelelayo.

I-spray tin: Ipuleti le-spray tin ngokuvamile liyimodeli ye-PCB enezingqimba eziningi (ungqimba olu-4-46) olunembe kakhulu, olusetshenziswe ukuxhumana okuningi kwasekhaya okukhulu, ikhompuyutha, imishini yezokwelapha kanye namabhizinisi asemkhathini namayunithi ocwaningo. Umunwe wegolide (umunwe oxhumayo) uyingxenye exhumanisayo phakathi kwebha yememori ne-memory slot, wonke amasignali adluliselwa ngeminwe yegolide.

Umunwe oyigolide wakhiwe ngokuthintana okuphuzi okusagolide okuningi. Ngenxa yokuthi ingaphezulu ligcwele igolide futhi othintana nabo be-conductive bahlelwa njengeminwe, ibizwa ngokuthi “umunwe wegolide”.

Umunwe wegolide empeleni umbozwe ungqimba lwegolide ebhodini le-copper clad ngenqubo ekhethekile, ngoba igolide limelana kakhulu ne-oxidation futhi linokuqhuba okuqinile.

Kodwa-ke, ngenxa yenani eliphezulu legolide, iningi lenkumbulo manje selithathelwa indawo yi-tin plating. Kusukela ngawo-1990s, izinto zikathayela bezilokhu zanda. Njengamanje, “iminwe yegolide” yamabhodi omama, inkumbulo namakhadi ehluzo cishe wonke asetshenziswa. Okubalulekile kukathayela, ingxenye kuphela yezindawo zokuxhumana zamaseva/iziteshi zokusebenza ezisebenza kahle ezizoqhubeka nokunameka ngegolide, okumba eqolo ngokwemvelo.

2. Kungani kufanele usebenzise amapuleti anegolide

Njengoba izinga lokuhlanganisa le-IC liya liphakama futhi liphakeme, amaphinikhodi e-IC aba aminyene kakhulu. Inqubo ye-spray tin emile inzima ukuthambisa amaphedi amancane, okuletha ubunzima ekubekweni kwe-SMT; ngaphezu kwalokho, impilo yeshalofu ye-spray tin plate ifushane kakhulu.

Ibhodi elifakwe ngegolide lixazulula lezi zinkinga:

1. Ngenqubo yokukhweza okungaphezulu, ikakhulukazi ku-0603 kanye no-0402 okukhweza okungaphezulu kwe-ultra-small, ngoba ukucaba kwephedi kuhlobene ngokuqondile nekhwalithi yenqubo yokuphrinta yokunamathisela i-solder, kunethonya elibalulekile kukhwalithi yokugeleza kabusha okulandelayo. i-soldering, ngakho-ke ibhodi lonke Ukufakwa kwegolide kuvamile ezinqubweni zokukhweza eziphezulu zokuminyana kanye nezincane kakhulu.

2. Esigabeni sokukhiqiza isilingo, ngenxa yezici ezifana nokuthengwa kwengxenye, ngokuvamile akukhona ukuthi ibhodi lithengiswa ngokushesha lapho lifika, kodwa livame ukusetshenziswa amasonto ambalwa noma ngisho nezinyanga. Impilo yeshelufu yebhodi efakwe ngegolide ingcono kuneyomthofu. I-tin alloy yinde ngokuphindwe kaningi, ngakho wonke umuntu uyakujabulela ukuyisebenzisa.

Ngaphandle kwalokho, izindleko ze-PCB efakwe ngegolide esigabeni sesampula zicishe zifane nalezo zebhodi le-lead-tin alloy.

Kodwa njengoba izintambo ziba ziminyene, ububanzi bomugqa nesikhala sesifinyelele ku-3-4MIL.

Ngakho-ke, inkinga yocingo olufushane lwegolide ilethwa: njengoba imvamisa yesiginali iba phezulu nangaphezulu, ukudluliswa kwesignali kungqimba olunamanzi amaningi okubangelwa umphumela wesikhumba kunethonya elisobala kakhulu kwikhwalithi yesiginali.

Umphumela wesikhumba ubhekisela ku: i-high frequency alternating current, yamanje izovame ukugxila ebusweni bocingo ukuze lugeleze. Ngokwezibalo, ukujula kwesikhumba kuhlobene nobuningi.

Ukuze kuxazululwe izinkinga ezingenhla zamabhodi anegolide, ama-PCB asebenzisa amabhodi anegolide ikakhulukazi anezici ezilandelayo:

1. Ngenxa yokuthi isakhiwo sekristalu esakhiwe ngokucwiliswa kwegolide nokucwecwa kwegolide sihlukile, igolide lokucwiliswa lizoba phuzi ngokusagolide kune-plating yegolide, futhi amakhasimende ayokwaneliseka kakhulu.

2. Ukucwiliswa kwegolide kulula ukushiselela kunokucwecwa kwegolide, futhi ngeke kubangele ukushisela okubi futhi kubangele izikhalazo zamakhasimende.

3. Ngenxa yokuthi ibhodi legolide lokucwiliswa line-nickel negolide kuphela ku-pad, ukudluliswa kwesignali kumphumela wesikhumba ngeke kuthinte isignali kungqimba lwethusi.

4. Ngenxa yokuthi igolide lokucwiliswa linokwakheka kwekristalu elicinene kune-plating yegolide, akulula ukukhiqiza i-oxidation.

5. Ngenxa yokuthi ibhodi legolide lokucwiliswa line-nickel negolide kuphela kuma-pads, ngeke likhiqize izintambo zegolide futhi libangele ubufushane obuncane.

6. Ngenxa yokuthi ibhodi legolide lokucwiliswa line-nickel negolide kuphela kuma-pads, imaski ye-solder kusekethe kanye nongqimba lwethusi kuhlanganiswe ngokuqinile.

7. Iphrojekthi ngeke ithinte ibanga lapho kwenziwa isinxephezelo.

8. Ngenxa yokuthi isakhiwo sekristalu esakhiwe ngokucwiliswa kwegolide nokucwecwa kwegolide sihlukile, ukucindezelwa kwepuleti legolide lokucwiliswa kulula ukulawula, futhi emikhiqizweni ene-bonding, kulungele kakhulu ukucubungula ukuhlanganisa. Ngesikhathi esifanayo, kungenxa yokuthi igolide lokucwiliswa lithambile kune-gilding, ngakho-ke ipuleti legolide lokucwiliswa alikwazi ukumelana nomunwe wegolide.

9. Ubucaba kanye nempilo yokuma kwebhodi legolide lokucwiliswa kuhle njengebhodi elinamekwe ngegolide.

Ngenqubo yokufaka i-gilding, umphumela we-tinning uyancipha kakhulu, kanti umphumela we-tinning wegolide lokucwiliswa ungcono; ngaphandle uma umkhiqizi edinga ukubopha, abakhiqizi abaningi manje sebezokhetha inqubo yokucwiliswa kwegolide, evame ukuvama Ngaphansi kwezimo, ukwelashwa kwendawo ye-PCB imi kanje:

Ukufakwa kwegolide (igolide lokufaka i-electroplating, igolide lokucwiliswa), i-silver plating, i-OSP, ukufafaza ngamathini (okunomthofu nokungenawo umthofu).

Lezi zinhlobo ikakhulukazi eze-FR-4 noma i-CEM-3 namanye amabhodi. I-paper base material kanye nendlela yokwelapha engaphezulu ye-rosin coating; uma i-tin ingalungile (i-tin embi yokudla), uma i-solder paste kanye nabanye abakhiqizi be-patch bengafakiwe Ngenxa yezizathu zokukhiqiza kanye nobuchwepheshe bezinto ezibonakalayo.

Lapha kungenxa yenkinga ye-PCB kuphela, kunezizathu ezilandelayo:

1. Ngesikhathi sokuphrinta kwe-PCB, kungakhathaliseki ukuthi kukhona indawo yefilimu evumela uwoyela endaweni ye-PAN, engavimba umphumela we-tinning; lokhu kungaqinisekiswa ngokuhlolwa kokufiphalisa ithini.

2. Ukuthi indawo yokugcoba ye-PAN ihlangabezana nezidingo zokuklama, okungukuthi, noma ngabe umsebenzi wokusekela wengxenye ungaqinisekiswa yini ngesikhathi sokuklanywa kwephedi.

3. Ukuthi i-pad ingcolile, lokhu kungatholwa ngokuhlolwa kokungcoliswa kwe-ion; amaphuzu amathathu angenhla ngokuyisisekelo ayizici ezibalulekile ezicatshangwa abakhiqizi be-PCB.

Ngokuphathelene nezinzuzo nezinkinga zezindlela eziningana zokwelapha ngaphandle, ngayinye inamandla nobuthakathaka bayo!

Ngokuphathelene nokucwecwa kwegolide, ingagcina ama-PCB isikhathi eside, futhi ingaphansi kwezinguquko ezincane kumazinga okushisa nomswakama wendawo yangaphandle (uma kuqhathaniswa nezinye izindlela zokwelapha ezingaphezulu), futhi ngokuvamile ingagcinwa isikhathi esingangonyaka owodwa; Ukwelashwa kwendawo efuthwe ngothayela kungokwesibili, i-OSP futhi, lokhu Kufanele kuqashelwe kakhulu isikhathi sokugcina sokwelashwa okubili kwendawo emazingeni okushisa asendaweni kanye nomswakama.

Ngaphansi kwezimo ezijwayelekile, ukwelashwa okungaphezulu kwesiliva lokucwiliswa kuhluke kancane, intengo nayo iphakeme, futhi izimo zokugcina zidinga kakhulu, ngakho-ke idinga ukupakishwa ephepheni elingenayo isulfure! Futhi isikhathi sokugcina cishe izinyanga ezintathu! Ngomthelela wokuthamba, igolide lokucwiliswa, i-OSP, ukufuthwa ngothayela, njll. empeleni kuyafana, futhi abakhiqizi babheka kakhulu ukuphumelela kwezindleko!