Super kauri tagulla PCB mai Rarrabawa tsarin masana’antu

1. Laminated tsarin

Babban binciken wannan takarda shine allo mai kauri mai kauri uku, kaurin jan karfe na ciki shine mm 1.0, kauri na waje shine 0.3 mm, mafi ƙarancin layin layi da tazarar layin na waje shine 0.5 mm. An nuna tsarin laminated a cikin Hoto 1. Layer Layer shine FR4 jan karfe clad laminate (gilashin fiber epoxy jan karfe clad laminate), tare da kauri na 0.3 mm, maganin etching mai gefe guda, kuma manne Layer shine takardar PP ba mai gudana ba. (Semi-warke takardar), tare da kauri na 0.1 mm, super lokacin farin ciki An saka farantin jan karfe a cikin daidaitaccen tsarin rami na FR-4 epoxy farantin.

Ana nuna tsarin tafiyar da aikin PCB na jan ƙarfe mai kauri a cikin hoto na 3. Babban injin ɗin ya haɗa da milling na saman ƙasa da na tsakiya, mai kauri mai kauri mai lamba lambar jan karfe. Bayan saman jiyya, shi ne stacked a cikin overall mold don zafi sama da latsa, kuma bayan rushewa, bi na al’ada PCB tsari Tsarin kammala samar da ƙãre kayayyakin.

2. Maɓalli hanyoyin sarrafa fasaha

2.1 Fasahar lamination na ciki mai tsananin kauri

Lamination na ciki mai kauri mai kauri: Idan aka yi amfani da foil na jan karfe don babban kauri, zai yi wahala a cimma wannan kauri. A cikin wannan takarda, babban kauri mai kauri na ciki yana amfani da farantin ƙarfe na lantarki na 1 mm electrolytic, wanda ke da sauƙin siye don kayan yau da kullun kuma ana sarrafa shi kai tsaye ta injin niƙa; Kwakwalwar waje na farantin jan karfe na ciki Ana amfani da kauri iri ɗaya na allon FR4 (gilashin fiber epoxy board) don sarrafawa da gyare-gyare azaman cikar gabaɗaya. Don sauƙaƙe lamination da kuma tabbatar da cewa ya dace daidai da gefen farantin tagulla, ƙimar rata tsakanin ma’auni guda biyu kamar yadda aka nuna a cikin tsarin Hoto 4 ana sarrafa shi a 0 ~ 0.2 A cikin mm. A ƙarƙashin tasirin ciko na hukumar FR4, an warware matsalar kauri na jan ƙarfe na katako mai kauri, kuma an tabbatar da matsananciyar matsa lamba da matsalolin rufewa na ciki bayan lamination, ta yadda ƙirar tagulla na ciki na iya zama sama da 0.5 mm. .

2.2 Fasaha mai kauri mai kauri tagulla

saman jan karfe mai kauri yana buƙatar yin baki kafin lamination. Baƙar fata na farantin jan karfe na iya ƙara wurin tuntuɓar da ke tsakanin saman jan ƙarfe da guduro, kuma yana ƙara yawan wettability na guduro mai zafi mai zafi zuwa jan ƙarfe, ta yadda guduro zai iya shiga cikin ratar oxide Layer kuma ya nuna ƙarfin aiki. bayan taurin. Ƙarfin mannewa yana inganta tasirin latsawa. A lokaci guda, zai iya inganta laminating farin tabo sabon abu da whitening da kumfa lalacewa ta hanyar yin burodi gwajin (287 ℃ ± 6 ℃). Ana nuna takamaiman sigogin baƙar fata a cikin Table 2.

2.3 Super kauri tagulla PCB fasahar lamination

Saboda kurakuran masana’anta a cikin kaurin farantin ƙarfe mai kauri na ciki da farantin FR-4 da aka yi amfani da shi don cikewar kewaye, kauri ba zai iya zama daidai ba. Idan ana amfani da hanyar lamination na al’ada don lamination, yana da sauƙi don samar da lamination fararen spots, delamination da sauran lahani, kuma lamination yana da wahala. . Domin a rage wahalar matsi mai kauri mai kauri da kuma tabbatar da daidaiton girman, an gwada shi kuma an tabbatar da shi don amfani da tsarin matsi na matsi. Samfurin sama da na ƙasa na ƙirar an yi su ne da ƙirar ƙarfe, kuma matashin silicone ana amfani da shi azaman tsaka-tsakin buffer Layer. Tsari sigogi kamar zafin jiki, matsa lamba, da kuma matsa lamba riƙe lokaci cimma lamination sakamako, da kuma warware fasaha matsaloli na farin spots da delamination na matsananci-kauri jan lamination, da saduwa da lamination bukatun na matsananci-kauri jan karfe PCB allon.

(1) Hanyar lamination na PCB mai kauri mai kauri.

An nuna matakin stacking na samfurin a cikin ƙwanƙwasa mai kauri mai kauri na jan ƙarfe a cikin Hoto 5. Saboda ƙarancin ruwa na guduro na PP wanda ba zai iya gudana ba, idan ana amfani da takarda na cladding na al’ada, takardar PP ba za a iya dannawa daidai ba. yana haifar da lahani irin su farar fata da delamination bayan lamination. Ana buƙatar amfani da samfuran PCB mai kauri na jan ƙarfe a cikin tsarin lamination A matsayin maɓalli na maɓalli, kushin gel ɗin silica yana taka rawa wajen rarraba matsa lamba daidai lokacin latsawa. Bugu da ƙari, don magance matsalar latsawa, an daidaita ma’aunin matsa lamba a cikin laminator daga 2.1 Mpa (22 kg/cm²) zuwa 2.94 Mpa (30 kg/cm²), kuma an daidaita zafin jiki zuwa mafi kyawun zafin fuska bisa ga halaye na takardar PP 170 ° C.

(2) Ana nuna sigogin lamination na PCB mai kauri mai kauri a cikin Tebur 3.

(3) Tasirin lamination na PCB mai kauri mai kauri.

Bayan gwaji daidai da Sashe na 4.8.5.8.2 na GJB362B-2009, bai kamata a sami blistering da delamination da ya wuce Sashe na 3.5.1.2.3 (lalacewar ƙasa) da aka yarda lokacin gwada PCB bisa ga 4.8.2. Samfurin PCB ya sadu da buƙatun bayyanar da girman girman 3.5.1, kuma yana da ƙananan yanki kuma an bincika shi bisa ga 4.8.3, wanda ya dace da buƙatun 3.5.2. Ana nuna tasirin slicing a cikin Hoto 6. Yin la’akari da yanayin yanki na lamination, layin ya cika cikakke kuma babu ƙananan kumfa.

2.4 Super kauri jan karfe PCB kwarara manne iko fasaha

Daban-daban da sarrafa PCB na gabaɗaya, an kammala siffarsa da ramukan haɗin na’urar kafin lamination. Idan manne manne yana da tsanani, zai shafi zagaye da girman haɗin kai, kuma bayyanar da amfani ba zai dace da bukatun ba; An kuma gwada wannan tsari a cikin ci gaban tsari. Hanyar aiwatar da milling siffar bayan latsa, amma daga baya siffar milling bukatun suna da tsananin sarrafawa, musamman ga aiki na ciki lokacin farin ciki da jan karfe dangane sassa, zurfin madaidaicin iko ne sosai m, kuma wucewa kudi ne musamman low.

Zaɓin kayan haɗin kai masu dacewa da tsara tsarin na’ura mai ma’ana ɗaya ne daga cikin matsalolin bincike. Don magance matsalar bayyanar manne ambaliya lalacewa ta hanyar prepregs na yau da kullun bayan lamination, ana amfani da prepregs tare da ƙarancin ruwa (Amfanin: SP120N). Abubuwan da aka ɗaure suna da halaye na ƙarancin guduro ruwa, sassauci, kyakkyawan juriya na zafi da kaddarorin lantarki, kuma Dangane da halayen manne da ambaliya, ƙirar prepreg a wani takamaiman matsayi yana ƙaruwa, kuma ana sarrafa kwatancen takamaiman sifa. ta hanyar yankewa da zane. A lokaci guda kuma, ana aiwatar da tsari na farko sannan kuma a latsawa, kuma ana samun siffar bayan an danna, ba tare da buƙatar sake yin niƙa na CNC ba. Wannan yana magance matsalar kwararar manne bayan PCB ɗin an lanƙwasa, kuma yana tabbatar da cewa babu manne akan saman haɗin bayan an lanƙwasa farantin jan karfe mai kauri da matsa lamba.

3. Ƙarshen sakamako na PCB mai kauri mai kauri

3.1 Ƙaƙƙarfan samfurin PCB mai kauri mai kauri

Babban kauri mai kauri na PCB samfurin ƙayyadaddun ma’aunin ƙayyadaddun samfur 4 da ƙãre samfurin ana nuna su a cikin adadi 7.

3.2 Juriya gwajin ƙarfin lantarki

An gwada sandunan da ke cikin samfurin PCB na jan ƙarfe mai kauri don jurewa wutar lantarki. Wutar gwajin ta kasance AC1000V, kuma babu yajin aiki ko walƙiya a cikin 1 min.

3.3 Gwajin hawan zafi mai girma na yanzu

Zana farantin tagulla mai haɗawa don haɗa kowane igiya na samfurin PCB na jan ƙarfe mai kauri a jeri, haɗa shi zuwa babban janareta na yanzu, kuma gwada dabam bisa ga daidaitaccen gwajin halin yanzu. Ana nuna sakamakon gwajin a Table 5:

Daga hawan zafin jiki a cikin Tebur 5, yawan zafin jiki na PCB mai kauri mai kauri yana da ɗan ƙaramin ƙarfi, wanda zai iya saduwa da ainihin buƙatun amfani (gaba ɗaya, buƙatun hawan zafin jiki suna ƙasa da 30 K). Haɓakar yanayin zafi na yanzu na PCB mai kauri mai kauri yana da alaƙa da tsarin sa, kuma hauhawar zafin nau’ikan tsarin tagulla daban-daban zai sami wasu bambance-bambance.

3.4 Gwajin damuwa na thermal

Bukatun gwajin danniya na thermal: Bayan gwajin danniya na thermal akan samfurin bisa ga GJB362B-2009 Gabaɗaya Ƙayyadaddun ƙayyadaddun ƙayyadaddun allon bugu, dubawa na gani yana nuna cewa babu lahani kamar delamination, blistering, pad warping, da fararen tabo.

Bayan bayyanar da girman samfurin PCB sun hadu da buƙatun, ya kamata a yi microsectioned. Saboda rufin tagulla na ciki na wannan samfurin yana da kauri sosai don a raba shi ta hanyar metallographically, samfurin yana fuskantar gwajin damuwa na thermal a 287 ℃ ± 6 ℃, kuma kawai ana duba bayyanarsa ta gani.

Sakamakon gwajin shine: babu delamination, blistering, pad warping, farin spots da sauran lahani.

4. Summary

Wannan labarin yana ba da hanyar masana’anta don PCB multilayer tagulla mai kauri. Ta hanyar ƙirƙira fasaha da haɓaka tsari, yadda ya kamata ya warware iyakar kauri na jan karfe na PCB mai kauri mai kauri, kuma yana shawo kan matsalolin fasaha na yau da kullun kamar haka:

(1) Fasahar lamination na ciki mai kauri mai kauri: Yana magance matsalar zaɓin kayan abu mai kauri sosai. Yin amfani da kayan aiki na riga-kafi ba ya buƙatar etching, wanda zai guje wa matsalolin fasaha na kauri mai kauri; fasahar cikawa ta FR-4 tana tabbatar da matsa lamba na rufin ciki Kusa da matsananciyar damuwa da matsaloli;

(2) Ultra-kauri jan karfe PCB lamination fasaha: yadda ya kamata warware matsalar fari spots da delamination a cikin lamination, da kuma samu wani sabon latsa hanya da kuma bayani;

(3) Super-kauri jan karfe PCB kwarara manne iko fasaha: Yana yadda ya kamata warware matsalar manne kwarara bayan latsa, da kuma tabbatar da aiwatar da pre-milling siffar sa’an nan kuma latsa.