Ithusi eliwugqinsi I-Multilayer PCB inqubo yokukhiqiza

1. Isakhiwo se-laminated

Ucwaningo oluyinhloko lwaleli phepha luyibhodi le-ultra-thick yethusi elinezingqimba ezintathu, ubukhulu bethusi obungaphakathi bungu-1.0 mm, ubukhulu bethusi obungaphandle bungu-0.3 mm, kanti ububanzi obuncane bomugqa kanye nesikhala somugqa wengqimba yangaphandle ngu-0.5 mm. Isakhiwo esakhiwe nge-laminated sikhonjiswe kuMfanekiso 1. Ungqimba olungaphezulu luyi-FR4 copper clad laminate (ingilazi ye-fiber epoxy copper clad laminate), enogqinsi lwe-0.3 mm, ukwelashwa okubamba uhlangothi olulodwa, futhi isendlalelo sokunamathisela siyishidi le-PP elingagelezi. (ishidi eliphulukisiwe), elinobukhulu obungu-0.1 mm, obukhulu kakhulu Ipuleti lethusi lishumekwe esakhiweni sembobo esihambisanayo sepuleti le-epoxy le-FR-4.

Ukugeleza kwenqubo yokucutshungulwa kwe-PCB yethusi ewugqinsi kakhulu kuboniswa kuMfanekiso 3. Umshini omkhulu uhlanganisa ukugaya ungqimba olungaphezulu naphakathi, ukugaya inombolo yepuleti lethusi eliwugqinsi. Ngemva kokwelashwa okungaphezulu, kupakishwa kusikhunta sonke ukuze kushiswe futhi kucindezelwe, futhi ngemva kokudilizwa, landela inqubo evamile ye-PCB Inqubo iqeda ukukhiqizwa kwemikhiqizo eqediwe.

2. Izindlela zokucubungula ubuchwepheshe ezisemqoka

2.1 Ubuchwepheshe be-lamination yethusi obujiyile kakhulu

I-super-thick copper lamination yangaphakathi: Uma ucwecwe lwethusi lusetshenziselwa ithusi eliwugqinsi kakhulu, kuzoba nzima ukufeza lokhu kushuba. Kuleli phepha, ungqimba lwangaphakathi lwethusi olujiyile kakhulu lusebenzisa ipuleti yethusi ye-electrolytic engu-1 mm, okulula ukuyithenga ngezinto ezivamile futhi icutshungulwa ngokuqondile ngomshini wokugaya; i-contour yangaphandle yepuleti yethusi yangaphakathi Ubukhulu obufanayo bebhodi le-FR4 (i-glass fiber epoxy board) isetshenziselwa ukucubungula nokubumba njengokugcwalisa jikelele. Ukuze kube lula ukucwenga nokuqinisekisa ukuthi kufanelana eduze nendawo ezungezile yepuleti lethusi, inani legebe phakathi kwamakhonco amabili njengoba kukhonjisiwe esakhiweni soMfanekiso 4 lilawulwa kokuthi 0~0.2 Ngaphakathi kwe-mm. Ngaphansi komphumela wokugcwalisa webhodi le-FR4, inkinga yokuqina kwethusi yebhodi yethusi ewugqinsi kakhulu iyaxazululwa, futhi ukucindezela okuqinile kanye nezinkinga zokufakwa kwangaphakathi ngemuva kokufakwa kwe-lamination kuqinisekiswa, ukuze ukwakheka kogqinsi lwethusi lwangaphakathi lube lukhulu kuno-0.5 mm. .

2.2 Ubuchwepheshe bokwenza mnyama ngethusi obukhulu kakhulu

Ingaphezulu le-ultra-thick copper lidinga ukufiphala ngaphambi kokuba lamination. Ukuba mnyama kwepuleti yethusi kungakhuphula indawo yokuxhumana phakathi kwendawo yethusi ne-resin, futhi kwandise ukumanzisa kwe-resin eshisa kakhulu yokushisa ukuya ethusi, ukuze i-resin ikwazi ukungena phakathi kwegebe lesendlalelo se-oxide futhi ibonise ukusebenza okuqinile. ngemva kokuqina. Amandla okunamathela athuthukisa umphumela wokucindezela. Ngasikhathi sinye, ingathuthukisa i-laminating ye-white spot phenomenon kanye nokuba mhlophe namabhamuza okubangelwa ukuhlolwa kokubhaka (287 ℃ ± 6 ℃). Amapharamitha athile amnyama aboniswa kuThebula 2.

2.3 Ubuchwepheshe be-lamination be-PCB bethusi obukhulu kakhulu

Ngenxa yamaphutha okukhiqiza kugqinsi lwepuleti lethusi eliwugqinsi olungaphakathi kanye nepuleti le-FR-4 elisetshenziselwa ukugcwalisa okuzungezile, ukujiya angeke kuhambisane ngokuphelele. Uma indlela ye-lamination evamile isetshenziselwa ukugcoba, kulula ukukhiqiza amachashazi amhlophe amhlophe, i-delamination kanye nezinye iziphambeko, futhi ukugcoba kunzima. . Ukuze kuncishiswe ubunzima bokucindezela isendlalelo sethusi esiwugqinsi kakhulu nokuqinisekisa ukunemba kobukhulu, ihloliwe futhi yaqinisekiswa ukuze kusetshenziswe uhlaka lwesikhunta esicindezelayo esibalulekile. Izifanekiso ezingenhla neziphansi zesikhunta zenziwe ngesikhunta sensimbi, futhi umcamelo we-silicone usetshenziswa njengesendlalelo se-buffer esiphakathi. Amapharamitha okucubungula afana nezinga lokushisa, ingcindezi, kanye nesikhathi sokubamba ingcindezi afinyelela umphumela wokulalisa, futhi aphinde axazulule izinkinga zobuchwepheshe zamabala amhlophe kanye ne-delamination ye-ultra-thick copper lamination, futhi ahlangabezane nezidingo zokubeka amabhodi e-PCB yethusi ewugqinsi.

(1) Super aminyene yethusi PCB lamination indlela.

Izinga lokunqwabelanisa lomkhiqizo kusikhunta se-laminate yethusi esiwugqinsi kakhulu siboniswa kuMfanekiso 5. Ngenxa yokuncibilika okuphansi kwe-resin ye-PP engagelezi, uma kusetshenziswa iphepha elivamile le-cladding kraft paper, ishidi le-PP alikwazi ukucindezelwa ngokufanayo, okuholela ekulimaleni okufana namachashaza amhlophe kanye ne-delamination ngemva kokulanywa. Imikhiqizo ye-PCB yethusi ewugqinsi idinga ukusetshenziswa enqubweni ye-lamination Njengosendlalelo sebhafa esiyisihluthulelo, i-silica gel pad idlala indima ekusabalaliseni ukucindezela ngokulinganayo ngesikhathi sokucindezela. Ngaphezu kwalokho, ukuze kuxazululwe inkinga yokucindezela, ipharamitha yokucindezela ku-laminator yalungiswa isuka ku-2.1 Mpa (22 kg/cm²) yaya ku-2.94 Mpa (30 kg/cm²), futhi izinga lokushisa lalungiselelwa izinga lokushisa elingcono kakhulu lokuhlanganisa ngokuvumelana izici zephepha le-PP 170°C.

(2) Amapharamitha wokuxhuma we-PCB yethusi ewugqinsi kakhulu akhonjisiwe kuThebula 3.

(3) Umphumela we-super thick copper PCB lamination.

Ngemva kokuhlola ngokuhambisana neSigaba 4.8.5.8.2 se-GJB362B-2009, akumele kube namabhamuza kanye nokuncipha okungaphezu kweSigaba 3.5.1.2.3 (amaphutha angaphansi) okuvunyelwe lapho kuhlolwa i-PCB ngokuya 4.8.2. Isampula ye-PCB ihlangabezana nezidingo zokubukeka nosayizi we-3.5.1, futhi ihlukaniswe ngezigaba ezincane futhi ihlolwe ngokuya nge-4.8.3, ehlangabezana nezidingo ze-3.5.2. Umphumela wokusika uboniswa kuMfanekiso 6. Uma sibheka isimo socezu lwe-lamination, umugqa ugcwele ngokugcwele futhi awekho ama-bubbles amancane.

2.4 Ubuchwepheshe bokulawula ukugeleza kweglue ye-PCB eqinile yethusi

Ihlukile ekucubunguleni okujwayelekile kwe-PCB, ukwakheka kwayo nezimbobo zokuxhuma idivayisi kuqediwe ngaphambi kokufakwa kwe-lamination. Uma ukugeleza kweglue kungathí sina, kuzothinta ukujikeleza nobukhulu bokuxhuma, futhi ukubukeka nokusetshenziswa ngeke kuhlangabezane nezidingo; lolu hlelo luphinde lwahlolwa ekuthuthukisweni kwenqubo. Umzila wenqubo wokugaywa komumo ngemva kokucindezela, kodwa izidingo zokugaya umumo wakamuva zilawulwa ngokuqinile, ikakhulukazi ukucubungula izingxenye zokuxhuma zethusi eziwugqinsi zangaphakathi, ukulawula ukunemba ukujula kuqinile kakhulu, futhi izinga lokuphasa liphansi kakhulu.

Ukukhetha izinto ezifanele zokuhlanganisa kanye nokuklama isakhiwo sedivayisi esinengqondo obunye bobunzima ocwaningweni. Ukuze uxazulule inkinga yokubonakala kokuchichima kweglue okubangelwa ama-prepregs avamile ngemva kokulahlwa, ama-prepregs ane-fluidity ephansi (Izinzuzo: SP120N) asetshenziswa. I-adhesive material inezici zokuguquguquka kwe-resin ephansi, ukuguquguquka, ukumelana nokushisa okuhle kakhulu kanye nezakhiwo zikagesi, futhi Ngokwezici zokuchichima kweglue, i-contour ye-prepreg endaweni ethile iyakhuphuka, futhi i-contour yomumo othize iyacutshungulwa. ngokusika nokudweba. Ngesikhathi esifanayo, inqubo yokwenza kuqala bese ucindezela iyabonakala, futhi ukuma kwakheka ngemva kokucindezela, ngaphandle kwesidingo sokugaya i-CNC futhi. Lokhu kuxazulula inkinga yokugeleza kweglue ngemva kokuba i-PCB i-laminated, futhi iqinisekisa ukuthi ayikho i-glue endaweni yokuxhuma ngemva kokuba ipuleti yethusi ewugqinsi kakhulu i-laminated futhi ingcindezi iqinile.

3. Umphumela oqediwe we-PCB yethusi ewugqinsi kakhulu

3.1 Ukucaciswa komkhiqizo we-PCB yethusi ewugqinsi kakhulu

Ipharamitha yepharamitha yepharamitha ye-PCB yethusi enogqinsi 4 kanye nomphumela womkhiqizo oqediwe kukhonjisiwe kumfanekiso wesi-7.

3.2 Ukumelana nokuhlolwa kwamandla kagesi

Izigxobo zesampula ye-PCB yethusi ewugqinsi kakhulu zahlolelwa ukumelana nogesi. I-voltage yokuhlola ibingu-AC1000V, futhi akubangakho siteleka noma i-flashover emzuzwini ongu-1.

3.3 Ukuhlolwa kwezinga lokushisa eliphezulu kwamanje

Dizayina ipuleti le-copper elihambisanayo ukuze uxhume isigxobo ngasinye sesampula ye-PCB yethusi ewugqinsi kakhulu ochungechungeni, uyixhume kujeneretha yamanje ephezulu, bese uhlola ngokuhlukile ngokuya ngesivivinyo samanje esihambisanayo. Imiphumela yokuhlolwa ikhonjisiwe kuThebula 5:

Kusukela ekukhuphukeni kwezinga lokushisa kuThebula 5, ukukhuphuka kwezinga lokushisa okuphelele kwe-PCB yethusi ewugqinsi kakhulu kuphansi, okungahlangabezana nezidingo zangempela zokusetshenziswa (ngokuvamile, izidingo zokukhuphuka kwezinga lokushisa zingaphansi kuka-30 K). Ukukhuphuka kwezinga lokushisa kwamanje kwe-PCB yethusi ewugqinsi kakhulu kuhlobene nesakhiwo sayo, futhi ukukhuphuka kwezinga lokushisa kwezakhiwo ezahlukene zethusi eziwugqinsi kuzoba nomehluko othile.

3.4 Ukuhlolwa kokucindezeleka okushisayo

Izidingo zokuhlolwa kokucindezeleka okushisayo: Ngemva kokuhlolwa kokucindezeleka okushisayo kusampula ngokuya nge-GJB362B-2009 General Specification for Rigid Printed Boards, ukuhlola okubonakalayo kubonisa ukuthi azikho iziphambeko ezifana ne-delamination, blistering, pad warping, namachashaza amhlophe.

Ngemuva kokuvela nosayizi wesampula ye-PCB ukuhlangabezana nezidingo, kufanele ihlukaniswe ngezigaba ezincane. Ngenxa yokuthi ungqimba lwangaphakathi lwethusi lwale sampuli lukhulu kakhulu ukuthi lungahlukaniswa ngokwe-metallographically, isampula ingaphansi kokuhlolwa kwengcindezi yokushisa engu-287 ℃ ± 6 ℃, futhi ukubonakala kwayo kuphela kuhlolwa ngokubonakalayo.

Umphumela wokuhlolwa uthi: akukho delamination, amabhamuza, ama-pad warping, amabala amhlophe nokunye ukukhubazeka.

I-4. Isifingqo

Lesi sihloko sihlinzeka ngendlela yenqubo yokukhiqiza ye-ultra-thick copper multilayer PCB. Ngokusungula izinto ezintsha zobuchwepheshe kanye nokuthuthukiswa kwenqubo, ixazulula ngempumelelo umkhawulo wamanje wogqinsi lwethusi we-ultra-thick copper multilayer PCB, futhi inqoba izinkinga zobuchwepheshe ezivamile zokucubungula ngale ndlela elandelayo:

(1) Ubuchwepheshe be-lamination yethusi obujiyile obuqinile: Ixazulula ngokuphumelelayo inkinga yokukhethwa kwezinto zethusi eziwugqinsi. Ukusetshenziswa kokucubungula kwangaphambi kokugaya akudingi ukucwiliswa, okugwema ngokuphumelelayo izinkinga zobuchwepheshe ze-etching yethusi eqinile; ubuchwepheshe bokugcwalisa i-FR-4 buqinisekisa ukucindezelwa kwesendlalelo sangaphakathi Vala ukuqina kanye nezinkinga zokufaka;

(2) Ubuchwepheshe be-lamination be-PCB yethusi obukhulu kakhulu: ixazulule ngempumelelo inkinga yamabala amhlophe kanye ne-delamination ku-lamination, futhi yathola indlela entsha yokucindezela nesixazululo;

(3) Ubuchwepheshe bokulawula ukugeleza kweglue ye-PCB egqinsi kakhulu yethusi: Ixazulula ngokuphumelelayo inkinga yokugeleza kweglue ngemva kokucindezela, futhi iqinisekisa ukuqaliswa kokuma kwangaphambi kokugaya bese ucindezela.