Ubhedu obukhulu kakhulu I-PCB ye-Multilayer Inkqubo yokwenza

1. Isakhiwo se-laminated

Uphando oluphambili lweli phepha yibhodi ye-ultra-thick copper ye-three-layer, ubukhulu bobhedu obungaphakathi buyi-1.0 mm, ubukhulu bobhedu bangaphandle bu-0.3 mm, kunye nobubanzi obuncinane bomgca kunye nomgca womgca womgca wangaphandle ngu-0.5 mm. Ubume be-laminated buboniswe kwi-Figure 1. Uluhlu lwe-surface yi-FR4 i-copper clad laminate (i-glass fiber epoxy copper clad laminate), kunye nobukhulu be-0.3 mm, unyango lwe-single-side etching treatment, kunye ne-adhesive layer is a non-flowing PP sheet. (iphepha eline-semi-cured), elinobunzima be-0.1 mm, ubukhulu obukhulu kakhulu Ipleyiti yobhedu ifakwe kwisakhiwo esihambelanayo somngxuma we-FR-4 epoxy plate.

Ukuqukuqela kwenkqubo yocweyo lwePCB yobhedu olutyebileyo kubonisiwe kuMfanekiso 3. Owona matshini uphambili ubandakanya umphezulu kunye nombindi wokusila, ipleyiti eshinyeneyo yokusila inombolo yobhedu. Emva konyango olungaphezulu, lufakwe kwi-mold jikelele ukutshisa kwaye ucinezele, kwaye emva kokudiliza, landela inkqubo ye-PCB eqhelekileyo Inkqubo igqiba ukuveliswa kweemveliso ezigqityiweyo.

2. Iindlela eziphambili zokucwangcisa iteknoloji

2.1 Itekhnoloji ye-lamination yobhedu yangaphakathi etyebileyo

I-Super-thick copper lamination yangaphakathi: Ukuba i-foil yobhedu isetyenziselwa ubhedu obukhulu kakhulu, kuya kuba nzima ukufezekisa obu bunzima. Kweli phepha, umaleko wangaphakathi wobhedu obunzima kakhulu usebenzisa i-1 mm ipleyiti yobhedu ye-electrolytic, ekulula ukuyithenga kwizinto eziqhelekileyo kwaye icutshungulwa ngokuthe ngqo ngumatshini wokugaya; i-contour yangaphandle yeplate yobhedu yangaphakathi Ubukhulu obufanayo bebhodi ye-FR4 (i-glass fiber epoxy board) isetyenziselwa ukucubungula kunye nokubumba njengokuzaliswa ngokubanzi. Ukuze kuququzelelwe i-lamination kunye nokuqinisekisa ukuba ihambelana ngokusondeleyo kunye ne-periphery yepleyiti yobhedu, ixabiso le-gap phakathi kwee-contours ezimbini njengoko kubonisiwe kwisakhiwo soMfanekiso 4 ulawulwa kwi-0 ~ 0.2 Ngaphakathi kwe-mm. Ngaphantsi komphumo wokuzaliswa kwebhodi ye-FR4, ingxaki yobunzima bobhedu bebhodi yethusi ye-ultra-thick isonjululwe, kwaye iingxaki ezixinzelelekileyo kunye neengxaki zangaphakathi zokugquma emva kokufakwa kwe-lamination ziqinisekiswa, ukwenzela ukuba uyilo lobunzima bangaphakathi lobhedu bube lukhulu ngaphezu kwe-0.5 mm. .

2.2 Itekhnoloji yokwenza mnyama ubhedu obukhulu

Umphezulu wobhedu olutyebileyo kakhulu kufuneka wenziwe mnyama phambi kokulanyiswa. Ubumnyama becwecwe lobhedu kunokunyusa indawo yoqhagamshelwano phakathi kwendawo yobhedu kunye ne-resin, kunye nokwandisa ukumanzisa kwe-resin ephezulu yobushushu bokushisa ukuya kubhedu, ukuze i-resin ikwazi ukungena kwi-gap ye-oxide kwaye ibonise ukusebenza okunamandla. emva kokuqina. Amandla okubambelela aphucula umphumo wokucinezela. Kwangaxeshanye, inokuphucula isenzeko sebala elimhlophe elilaminezayo kunye nokuba mhlophe kunye namaqamza abangelwa luvavanyo lokubhaka (287 ℃ ± 6 ℃). Iiparamitha ezithile ezimnyama ziboniswa kwiThebhile 2.

2.3 Itekhnoloji yokulamisa yobhedu etyebileyo yePCB

Ngenxa yeempazamo zokuvelisa kwi-thickness ye-inner-super-thick copper plate kunye ne-FR-4 plate esetyenziselwa ukuzaliswa okujikelezayo, ubukhulu abukwazi ukuhambelana ngokupheleleyo. Ukuba indlela yokwanyisa eqhelekileyo isetyenziselwa ukuhlamba, kulula ukuvelisa amabala amhlophe amhlophe, i-delamination kunye nezinye iziphene, kwaye i-lamination inzima. . Ukuze kuncitshiswe ubunzima bokucinezela i-ultra-thick copper layer kunye nokuqinisekisa ukuchaneka kwe-dimensional, kuye kwavavanywa kwaye kwaqinisekiswa ukuba kusetyenziswe i-integrated pressing mold structure. Iitemplates eziphezulu kunye nezantsi ze-mold zenziwe nge-molds yensimbi, kwaye i-silicone cushion isetyenziswe njengoluhlu lwe-buffer ephakathi. Iiparamitha zenkqubo ezifana nobushushu, uxinzelelo, kunye nexesha lokubamba uxinzelelo zifezekise isiphumo sokuthambisa, kunye nokusombulula iingxaki zobugcisa zamabala amhlophe kunye ne-delamination ye-ultra-thick copper lamination, kunye nokuhlangabezana neemfuno zokunyibilika kweebhodi zePCB zobhedu ezityebileyo.

(1) Indlela yokulamisa yobhedu etyebileyo yePCB.

Inqanaba lokupakisha imveliso kwi-ultra-thick copper laminate mold iboniswe kuMzobo 5. Ngenxa yobuninzi obuphantsi be-non-flowable PP resin, ukuba kusetyenziswe iphepha le-kraft eliqhelekileyo le-cladding, iphepha le-PP alikwazi ukucinezelwa ngokufanayo, okukhokelela kwiziphene ezifana namabala amhlophe kunye delamination emva lamination. Iimveliso zePCB ezishinyeneyo zobhedu kufuneka zisetyenziswe kwinkqubo yokuthambisa Njengomaleko ongundoqo we-buffer, i-silica gel pad idlala indima ekusasazeni ngokulinganayo uxinzelelo ngexesha lokucinezela. Ukongeza, ukusombulula ingxaki yokucinezela, iparameter yoxinzelelo kwi-laminator yahlengahlengiswa ukusuka kwi-2.1 Mpa (22 kg/cm²) ukuya kwi-2.94 Mpa (30 kg/cm²), kwaye iqondo lobushushu lahlengahlengiswa kwiqondo lobushushu elingcono le-fusion ngokwe iimpawu zephepha le-PP 170 °C.

(2) Iiparamitha zokukhanya zePCB yobhedu etyebileyo kakhulu zibonisiwe kwiThebhile yesi-3.

(3) Isiphumo sobhedu olutyebileyo lwePCB lamination.

Emva kokuvavanya ngokuhambelana neCandelo 4.8.5.8.2 le-GJB362B-2009, akufuneki kubekho amadyungudyungu kunye ne-delamination edlula iCandelo 3.5.1.2.3 (iziphene ezingaphantsi komhlaba) ezivunyelweyo xa kuhlolwa i-PCB ngokwe-4.8.2. Isampuli ye-PCB ihlangabezana neemfuno zembonakalo kunye nobukhulu be-3.5.1, kwaye i-micro-sectioned kwaye ihlolwe ngokwe-4.8.3, ehlangabezana neemfuno ze-3.5.2. Umphumo we-slicing uboniswe kuMzobo 6. Ukuqwalasela imeko ye-lamination slice, umgca uzaliswe ngokupheleleyo kwaye akukho bubbles micro-slit.

2.4 Itekhnoloji yokulawula iglu yobhedu etyebileyo yePCB

Eyahlukileyo kwi-PCB processing ngokubanzi, imilo yayo kunye nemingxunya yoqhagamshelo isixhobo ziye zagqitywa phambi lamination. Ukuba ukuhamba kweglue kunzulu, kuya kuchaphazela ukujikeleza kunye nobukhulu bokudibanisa, kwaye ukubonakala kunye nokusetyenziswa akuyi kuhlangabezana neemfuno; le nkqubo iye yavavanywa kuphuhliso lwenkqubo. Indlela yenkqubo yokusila imilo emva kokucinezela, kodwa iimfuno zokugaya iimilo zamva zilawulwa ngokungqongqo, ngakumbi ukusetyenzwa kweendawo zoqhagamshelo ezityebileyo zobhedu, ubunzulu bolawulo lokuchaneka bungqongqo kakhulu, kwaye izinga lokupasa liphantsi kakhulu.

Ukukhetha izinto ezifanelekileyo zokudibanisa kunye nokuyila isakhiwo sesixhobo esifanelekileyo yenye yobunzima kuphando. Ukuze ucombulule ingxaki yokubonakala kweglue ephuphumayo ebangelwa yi-prepregs eqhelekileyo emva kokulahlwa, i-prepregs kunye ne-fluidity ephantsi (i-Benefits: SP120N) isetyenziswa. Izinto ezincamathelayo zineempawu zokuguquguquka kwe-resin ephantsi, ukuguquguquka, ukumelana nobushushu obugqwesileyo kunye neempawu zombane, kwaye ngokweempawu zokuphuphuma kweglue, i-contour ye-prepreg kwindawo ethile iye yanda, kwaye i-contour yesimo esithile iyalungiswa. ngokusika nokuzoba. Kwangaxeshanye, inkqubo yokuqulunqa kuqala kwaye ucinezele iyenzeka, kwaye imilo yenziwa emva koxinzelelo, ngaphandle kwemfuneko yokugaya kwakhona i-CNC. Oku kusombulula ingxaki yokuhamba kweglue emva kokuba i-PCB i-laminated, kwaye iqinisekisa ukuba akukho glue kwindawo yokudibanisa emva kokuba ipleyiti yobhedu ephezulu i-laminated kwaye uxinzelelo luqinile.

3. Isiphumo esigqityiweyo sePCB yobhedu etyebileyo

3.1 Iimpawu zemveliso yePCB yobhedu etyebileyo kakhulu

Itheyibhile yesi-4 yobhedu etyebileyo yemveliso yeparamitha kunye nesiphumo semveliso egqityiweyo iboniswe kumfanekiso wesi-7.

3.2 Ukumelana novavanyo lombane

Izibonda ezikwisampulu yePCB yobhedu etyebileyo kakhulu zavavanyelwa ukumelana nombane. I-voltage yokuvavanya yayiyi-AC1000V, kwaye kwakungekho siteleka okanye i-flashover kwi-1 min.

3.3 Uvavanyo oluphezulu lwangoku lokunyusa ubushushu

Yila ipleyiti yobhedu ehambelanayo yokudibanisa ipali nganye yesampula yePCB yobhedu etyebileyo kuthotho, uyidibanise nejenereyitha ephezulu yangoku, kwaye uvavanye ngokwahlukileyo ngokuhambelana novavanyo lwangoku. Iziphumo zovavanyo ziboniswe kwiThebhile 5:

Ukususela ekunyukeni kweqondo lokushisa kwiThebhile 5, ukunyuka kweqondo lokushisa ngokubanzi kwe-ultra-thick copper PCB iphantsi, enokuthi ihlangabezane neemfuno zangempela zokusetyenziswa (ngokubanzi, iimfuno zokunyuka kweqondo lokushisa zingaphantsi kwe-30 K). Ukunyuka kobushushu obuphezulu bangoku be-PCB yobhedu obutyebileyo bunxulumene nolwakhiwo lwayo, kunye nokunyuka kwamaqondo obushushu bezakhiwo ezahlukeneyo zobhedu kuya kuba neeyantlukwano ezithile.

3.4 Uvavanyo loxinzelelo lobushushu

Iimfuno zovavanyo loxinzelelo lwe-thermal: Emva kovavanyo loxinzelelo lwe-thermal kwisampulu ngokwe-GJB362B-2009 Inkcazo Jikelele yeeBhodi eziShicileleyo eziShicileleyo, ukuhlolwa okubonakalayo kubonisa ukuba akukho ziphene ezifana ne-delamination, i-blistering, i-pad warping, kunye namabala amhlophe.

Emva kwenkangeleko kunye nobukhulu besampula ye-PCB ihlangabezana neemfuno, kufuneka i-microsectioned. Ngenxa yokuba umaleko wangaphakathi wobhedu wale sampuli ushinyene kakhulu ukuba ungahlulwa ngokwe-metallographically, isampuli iphantsi kovavanyo loxinzelelo lwe-thermal kwi-287 ℃ ± 6 ℃, kwaye kuphela inkangeleko yayo ihlolwe ngokubonakalayo.

Iziphumo zovavanyo zezi: akukho delamination, amadyungudyungu, pad warping, amabala amhlophe kunye nezinye iziphene.

4. isishwankathelo

Eli nqaku libonelela ngendlela yenkqubo yokwenziwa kwe-PCB yobhedu etyebileyo etyebileyo. Ngokusebenzisa itekhnoloji entsha kunye nokuphuculwa kwenkqubo, isombulula ngokusebenzayo umda wangoku wobunzima bobhedu lwe-PCB yobhedu etyebileyo etyebileyo, kwaye yoyisa iingxaki zobugcisa eziqhelekileyo ngolu hlobo lulandelayo:

(1) Itekhnoloji ye-lamination yangaphakathi yobhedu etyebileyo: Isombulula ngempumelelo ingxaki yokukhethwa kwezinto zobhedu ezityebileyo. Ukusetyenziswa kwenkqubo yokugaya kwangaphambili ayifuni i-etching, ethintela ngokufanelekileyo iingxaki zobuchwepheshe ze-etching yobhedu; iteknoloji yokuzalisa i-FR-4 iqinisekisa ukunyanzeliswa komgangatho wangaphakathi Vala ukuqina kunye neengxaki zokugquma;

(2) Itekhnoloji ye-lamination ye-PCB yobhedu ye-Ultra-thick: isonjululwe ngokufanelekileyo ingxaki yamabala amhlophe kunye ne-delamination kwi-lamination, kwaye yafumana indlela entsha yokucofa kunye nesisombululo;

(3) Itekhnoloji yokulawula iglu yobhedu etyebileyo ye-PCB: Isombulula kakuhle ingxaki yokuhamba kweglu emva kokucinezela, kwaye iqinisekisa ukuphunyezwa kwemilo yokugaya kwangaphambili kwaye icinezele.