Ke keleawe mānoanoa nui PCB Multilayer kaʻina hana

1. Hoʻolālā Laminated

ʻO ka noiʻi nui o kēia pepa he papa keleawe ʻekolu-papa nui, ʻo ka mānoanoa keleawe o loko he 1.0 mm, ʻo ka mānoanoa keleawe o waho he 0.3 mm, a ʻo ka laulā laina haʻahaʻa a me ka spacing laina o ka papa waho he 0.5 mm. Hōʻike ʻia ka hale laminated ma ka Figure 1. ʻO ka ʻili o ka ʻili he FR4 copper clad laminate (aniani fiber epoxy copper clad laminate), me ka mānoanoa o 0.3 mm, hoʻokahi ʻaoʻao etching lapaʻau, a ʻo ka papa hoʻopili he pepa PP ʻole kahe. (pepa semi-cured), me ka mānoanoa o 0.1 mm, mānoanoa nui Ua hoʻokomo ʻia ka pā keleawe i loko o ka hoʻolālā lua o ka pā epoxy FR-4.

Hōʻike ʻia ke kaʻina hana o ka hana PCB keleawe ultra-mānoanoa i ka Figure 3. ʻO ka mīkini nui e pili ana i ka wili ʻana o ka ʻili a me ka papa waena, ka wili helu keleawe mānoanoa. Ma hope o ka mālama ʻana i ka ʻili, hoʻopaʻa ʻia i loko o ka ʻōpala holoʻokoʻa e wela a paʻi, a ma hope o ka demolding, e hahai i ke kaʻina hana PCB maʻamau.

2. Nā ʻano hana ʻenehana koʻikoʻi

2.1 Ultra-mānoanoa keleawe lamination ‘enehana

ʻO ka lamination keleawe nui-mānoanoa: Inā hoʻohana ʻia ka pahu keleawe no ke keleawe mānoanoa nui, paʻakikī ke hoʻokō i kēia mānoanoa. I loko o kēia pepa, hoʻohana ka super-thick copper copper plate i ka 1 mm electrolytic copper plate, he mea maʻalahi ke kūʻai aku no nā mea maʻamau a hoʻoponopono pololei ʻia e ka mīkini wili; ka ʻaoʻao o waho o ka pā keleawe i loko ʻO ka mānoanoa like o ka papa FR4 (papa aniani fiber epoxy) hoʻohana ʻia no ka hana ʻana a me ka hoʻoheheʻe ʻana e like me ka hoʻopiha piha. No ka hoʻomaʻamaʻa ʻana i ka lamination a me ka hoʻopaʻa ʻana e pili pono me ka ʻaoʻao o ka pā keleawe, ʻo ka waiwai āpau ma waena o nā contours ʻelua e like me ka mea i hōʻike ʻia ma ke ʻano o ka Figure 4 e hoʻomalu ʻia ma 0 ~ 0.2 I loko o mm. Ma lalo o ka hoʻopiha piha ʻana o ka papa FR4, ua hoʻopau ʻia ka pilikia mānoanoa keleawe o ka papa keleawe ultra-thick, a ua hōʻoia ʻia ka paʻa paʻa ʻana a me nā pilikia insulation kūloko ma hope o ka lamination, i ʻoi aku ka nui o ka hoʻolālā o ka mānoanoa keleawe i loko o 0.5 mm. .

2.2 ʻenehana ʻeleʻele keleawe mānoanoa nui

Pono e ʻeleʻele ka ʻili o ke keleawe ultra-mānoanoa ma mua o ka lamination. Hiki i ka ʻeleʻele o ka pā keleawe ke hoʻonui i ka wahi pili ma waena o ka ʻili keleawe a me ka resin, a hoʻonui i ka wettability o ka resin kahe kahe kiʻekiʻe i ke keleawe, i hiki ai i ka resin ke komo i loko o ke āpau o ka oxide a hōʻike i ka hana ikaika. mahope o ka paakiki ana. Hoʻonui ka ikaika adhesion i ka hopena kaomi. I ka manawa like, hiki iā ia ke hoʻomaikaʻi i ka laminating wahi keʻokeʻo keʻokeʻo a me ka keʻokeʻo a me nā ʻōpū i hoʻokumu ʻia e ka hoʻāʻo baking (287 ℃ ± 6 ℃). Hōʻike ʻia nā ʻāpana ʻeleʻele kikoʻī ma ka Papa 2.

2.3 Super mānoanoa keleawe PCB lamination enehana

Ma muli o ka hewa o ka hana ʻana i ka mānoanoa o ka pā keleawe super-thick i loko a me ka pā FR-4 i hoʻohana ʻia no ka hoʻopiha piha ʻana, ʻaʻole hiki ke kūlike ka mānoanoa. Inā hoʻohana ʻia ke ʻano lamination maʻamau no ka lamination, maʻalahi ka hana ʻana i nā kiko keʻokeʻo lamination, delamination a me nā hemahema ʻē aʻe, a paʻakikī ka lamination. . I mea e hōʻemi ai i ka paʻakikī o ke kaomi ʻana i ka ʻāpana keleawe ultra-mānoanoa a hōʻoia i ka pololei o ka dimensional, ua hoʻāʻo ʻia a hōʻoia ʻia e hoʻohana i kahi ʻano hoʻoheheʻe hoʻohui. ʻO ka papa luna a me lalo o ka mold i hana ʻia i nā mole kila, a hoʻohana ʻia ka cushion silicone e like me ka papa waena waena. ʻO nā ʻāpana hana e like me ka mahana, ke kaomi, a me ka manawa paʻa e hoʻokō ai i ka hopena lamination, a hoʻoponopono pū i nā pilikia ʻenehana o nā kiko keʻokeʻo a me ka delamination o ka lamination keleawe ultra-mānoanoa, a hoʻokō i nā koi lamination o nā papa PCB keleawe mānoanoa.

(1) Super mānoanoa keleawe PCB lamination ala.

Hōʻike ʻia ka pae stacking o ka huahana i loko o ka mold copper laminate ultra-thick ma ka Figure 5. Ma muli o ka haʻahaʻa haʻahaʻa o ka resin PP non-flowable, inā hoʻohana ʻia ka pepa kraft maʻamau, ʻaʻole hiki ke paʻi ʻia ka pepa PP. ka hopena i nā hemahema e like me nā kiko keʻokeʻo a me ka delamination ma hope o ka lamination. Pono e hoʻohana ʻia nā huahana PCB keleawe mānoanoa i ke kaʻina hana lamination Ma ke ʻano he kī paʻa, ʻo ka silica gel pad ke kuleana i ka hāʻawi like ʻana i ke kaomi i ka wā kaomi. Eia kekahi, i mea e hoʻoponopono ai i ka pilikia paʻi, ua hoʻoponopono ʻia ke ʻano kaomi i ka laminator mai 2.1 Mpa (22 kg/cm²) a i 2.94 Mpa (30 kg/cm²), a ua hoʻoponopono ʻia ka mahana i ka wela fusion maikaʻi loa e like me ka. nā hiʻohiʻona o ka pepa PP 170 ° C.

(2) Hōʻike ʻia nā ʻāpana lamination o ka PCB keleawe mānoanoa nui ma ka Papa 3.

(3) Ka hopena o ka super mānoanoa keleawe PCB lamination.

Ma hope o ka hoʻāʻo ʻana e like me ka pauku 4.8.5.8.2 o GJB362B-2009, ʻaʻole pono e hoʻohūhū a me ka delamination e ʻoi aku ma mua o ka pauku 3.5.1.2.3 (nā hemahema ma lalo o ka ʻili) i ʻae ʻia i ka hoʻāʻo ʻana i ka PCB e like me 4.8.2. Hoʻokō ka laʻana PCB i ka hiʻohiʻona a me ka nui o nā koi o 3.5.1, a ua ʻoki ʻia a nānā ʻia e like me 4.8.3, e hoʻokō i nā koi o 3.5.2. Hōʻike ʻia ka hopena slicing ma ke Kiʻi 6. Ma muli o ke ʻano o ka ʻāpana lamination, ua piha piha ka laina a ʻaʻohe micro-slit bubbles.

2.4 Super mānoanoa keleawe PCB kahe kalapona ‘enehana mana

ʻOkoʻa mai ka hana PCB maʻamau, ua hoʻopau ʻia kona ʻano a me nā lua pili pūnaewele ma mua o ka lamination. Inā koʻikoʻi ke kahe o ka glue, e hoʻopili ia i ka pōʻai a me ka nui o ka pilina, a ʻaʻole kūpono ke ʻano a me ka hoʻohana ʻana i nā koi; ua hoʻāʻo ʻia kēia kaʻina hana i ka hoʻomohala kaʻina. ʻO ke ala kaʻina o ka milling shape ma hope o ke kaomi ʻana, akā ʻoi aku ka paʻa ʻana o nā koi milling hope, ʻoi loa no ka hana ʻana i nā ʻāpana pili keleawe mānoanoa o loko, ʻoi loa ka mana o ka hohonu, a ʻoi loa ka haʻahaʻa.

ʻO ke koho ʻana i nā mea hoʻopili kūpono a me ka hoʻolālā ʻana i kahi ʻano mea hana kūpono kekahi o nā pilikia i ka noiʻi. I mea e hoʻoponopono ai i ka pilikia o ke ʻano o ke kahe ʻana o ke kāpili i hana ʻia e nā prepregs maʻamau ma hope o ka lamination, hoʻohana ʻia nā prepregs me ka wai haʻahaʻa (Pono: SP120N). ʻO ka mea hoʻopili i nā hiʻohiʻona o ka liʻiliʻi resin haʻahaʻa, hiki ke maʻalahi, maikaʻi ka wela wela a me nā waiwai uila, a e like me nā hiʻohiʻona o ke kahe ʻana o ka glue, ua hoʻonui ʻia ka contour o ka prepreg ma kahi kūlana kikoʻī, a ua hana ʻia ka contour o kahi ʻano kikoʻī. ma ke oki a kaha kii. I ka manawa like, ʻike ʻia ke kaʻina hana o ka hana mua a laila kaomi ʻana, a hoʻokumu ʻia ke ʻano ma hope o ke kaomi ʻana, me ka ʻole o ka pono o ka CNC milling hou. Hoʻopau kēia i ka pilikia o ke kahe ʻana o ke kāpili ma hope o ka laminated ʻana o ka PCB, a hōʻoia i ka ʻole o ke kolu ma ka ʻaoʻao pili ma hope o ka laminated o ka pā keleawe mānoanoa nui a paʻa ke kaomi.

3. Hoʻopau hopena o ka PCB keleawe ultra-mānoanoa

3.1 Nā kikoʻī huahana PCB keleawe mānoanoa nui

Hōʻike ʻia ka papa helu kikoʻī kikoʻī o ka huahana PCB nui-mānoanoa 4 a me ka hopena o ka huahana ma ka helu 7.

3.2 E pale i ka ho’āʻo uila

Ua hoʻāʻo ʻia nā pou i loko o ka laʻana PCB keleawe ultra-mānoanoa no ka pale ʻana i ka uila. ʻO ka volta ho’āʻo he AC1000V, a ʻaʻohe hahau a flashover paha i 1 min.

3.3 Ho’āʻo piʻi wela o kēia manawa

E hoʻolālā i ka pā keleawe pili e hoʻohui i kēlā me kēia pou o ka laʻana PCB keleawe mānoanoa nui ma ka moʻo, e hoʻopili iā ia i ka mīkini hana kiʻekiʻe o kēia manawa, a hoʻāʻo ʻokoʻa e like me ka hoʻāʻo ʻana o kēia manawa. Hōʻike ʻia nā hopena hōʻike ma ka Papa 5:

Mai ka piʻi ʻana o ka mahana ma ka Papa 5, ʻoi aku ka haʻahaʻa o ka piʻi ʻana o ka wela o ka PCB keleawe ultra-mānoanoa, hiki ke hoʻokō i nā koi hoʻohana maoli (maʻamau, ʻo nā koi piʻi wela ma lalo o 30 K). ʻO ka piʻi ʻana o ka wela o kēia manawa o ka PCB keleawe mānoanoa nui e pili ana i kona ʻano, a ʻo ka piʻi ʻana o ka mahana o nā ʻano keleawe mānoanoa like ʻole e loaʻa kekahi mau ʻokoʻa.

3.4 Ho’āʻo koʻikoʻi wela

Nā koi ho’āʻo koʻikoʻi Thermal: Ma hope o ka hoʻāʻo ʻana i ke koʻikoʻi wela ma ka hāpana e like me ka GJB362B-2009 General Specification for Rigid Printed Boards, ʻike ʻia ka nānā ʻana ʻaʻohe hemahema e like me ka delamination, blistering, pad warping, a me nā kiko keʻokeʻo.

Ma hope o ka hiʻohiʻona a me ka nui o ka laʻana PCB e hoʻokō i nā koi, pono ia e microsectioned. Ma muli o ka mānoanoa loa o ka papa keleawe o kēia hāpana no ka hoʻokaʻawale ʻana i ka metallographically, ua hoʻokau ʻia ka hāpana i kahi hoʻāʻo koʻikoʻi wela ma 287 ℃ ± 6 ℃, a ʻo kona helehelena wale nō ke nānā ʻia.

ʻO ka hopena hōʻike: ʻaʻohe delamination, blistering, pad warping, nā kiko keʻokeʻo a me nā hemahema ʻē aʻe.

4. Summary

Hāʻawi kēia ʻatikala i kahi kaʻina hana hana no ka PCB multilayer keleawe ultra-mānoanoa. Ma o ka hana ʻenehana a me ka hoʻomaikaʻi ʻana i ke kaʻina hana, hoʻoponopono maikaʻi ia i ka palena o kēia manawa o ka mānoanoa keleawe o ka ultra-thick copper multilayer PCB, a lanakila i nā pilikia ʻenehana hana maʻamau e like me kēia:

(1) ʻenehana lamination i loko o ke keleawe mānoanoa: Hoʻoponopono maikaʻi ia i ka pilikia o ke koho ʻana i nā mea keleawe mānoanoa. ʻAʻole pono ka hoʻohana ʻana i ka hana pre-milling etching, kahi e pale pono ai i nā pilikia ʻenehana o ka etching keleawe mānoanoa; ʻo ka ʻenehana hoʻopihapiha FR-4 e hōʻoiaʻiʻo i ke kaomi ʻana o ka ʻāpana o loko Hoʻopili i nā pilikia paʻa a me ka insulation;

(2) Ultra-mānoanoa keleawe PCB lamination ʻenehana: hoʻoponopono maikaʻi i ka pilikia o nā kiko keʻokeʻo a me ka delamination i ka lamination, a loaʻa kahi ala kaomi hou a me ka hopena;

(3) Super-mānoanoa keleawe PCB kahe kaʻa kaʻa ‘ike loea hou: Hoʻoponopono pono ia i ka pilikia o ke kahe o ke kāpili ma hope o ke kaomi ʻana, a hōʻoia i ka hoʻokō ʻana i ke ʻano pre-milling a laila kaomi.