Super gobvu mhangura Multilayer pcb maitiro ekugadzira

1. Laminated chimiro

Tsvagiridzo huru yepepa iri ibhodhi rakakora remhangura rine matatu-layer board, ukobvu hwemhangura hwemukati hunosvika 1.0 mm, ukobvu hwemhangura hwekunze hunosvika 0.3 mm, uye hudiki hwemutsara uye kupatsanurwa kwemutsara wekunze ndeye 0.5 mm. Chimiro che laminated chinoratidzwa muMufananidzo 1. Musoro wepamusoro ndeye FR4 copper clad laminate (girazi fiber epoxy copper clad laminate), nehupamhi hwe 0.3 mm, single-sided etching treatment, uye adhesive layer ipepa rePP risina kuyerera. (semi-yakaporeswa pepa), nehupamhi hwe 0.1 mm, yakanyanya kukora Iyo ndiro yemhangura yakaiswa mukati inoenderana negomba chimiro cheFR-4 epoxy plate.

Kuyerera kwe-ultra-gobvu yemhangura PCB inoratidzwa muFigure 3. Iyo huru machining inosanganisira pamusoro uye yepakati layer yekugaya, gobvu ndiro nhamba yemhangura inogaya. Mushure mekurapwa kwepamusoro, yakaturikidzwa muhuturu hwese kudziya uye kudzvanya, uye mushure mekudzikisa, tevera yakajairwa PCB maitiro Maitiro anopedzisa kugadzirwa kwezvakapera zvigadzirwa.

2. Key teknolojia yekugadzirisa nzira

2.1 Ultra-yakakora mhangura yemukati lamination tekinoroji

Super-gobvu yemhangura yemukati lamination: Kana foil yemhangura ikashandiswa kune yakanyanya-yakakora mhangura, zvichanetsa kuwana ukobvu uhwu. Mune pepa iri, iyo yakakura-yakakora yemhangura yemukati layer inoshandisa 1 mm electrolytic copper plate, iyo iri nyore kutenga kune yakajairika zvinhu uye inogadziriswa zvakananga nemuchina wekugaya; iyo yekunze contour yemukati mhangura ndiro Ukobvu hwakafanana hweFR4 board (girazi fiber epoxy board) inoshandiswa kugadzirisa uye kuumba sekuzadza kwese. Kuti kufambisa kucheneswa uye kuve nechokwadi kuti inopindirana zvakanyanya nenharaunda yeplate yemhangura, kukosha kwegap pakati pemakona maviri sezvakaratidzwa muchimiro cheMufananidzo 4 inodzorwa pa 0 ~ 0.2 Mukati memm. Pasi pekuzadza kweFR4 bhodhi, dambudziko rekukora kwemhangura ye-ultra-gobvu mhangura bhodhi rinogadziriswa, uye iyo yakasimba yekutsikirira uye yemukati yekuvharisa matambudziko mushure mekugadzikiswa kunosimbiswa, kuitira kuti dhizaini yemukati memhangura ukobvu kunogona kunge kwakakura kupfuura 0.5 mm. .

2.2 Super gobvu mhangura yekusviba tekinoroji

Pamusoro pemhangura yakakora inoda kusviba isati yachekwa. Kusviba kweplate yemhangura kunogona kuwedzera nzvimbo yekubatana pakati pemhangura uye resin, uye kuwedzera kunyorova kweyepamusoro-tembiricha inoyerera resin kumhangura, kuitira kuti resin ipinde mukati meiyo oxide layer gap uye kuratidza kushanda kwakasimba. mushure mekuoma. Simba rekunamatira rinovandudza kudzvanya maitiro. Panguva imwecheteyo, inogona kuvandudza iyo laminating chena nzvimbo chiitiko uye kuchena uye mabhuru akakonzerwa nebvunzo yekubheka (287 ℃ ± 6 ℃). Iwo chaiwo maparameter ekudzima anoratidzwa muTafura 2.

2.3 Super gobvu mhangura PCB lamination tekinoroji

Nekuda kwekukanganisa kwekugadzira muhukobvu hwemukati-yakakora yemhangura ndiro uye FR-4 ndiro inoshandiswa pakuzadza kwakapoteredza, ukobvu haugone kunyatsoenderana. Kana yakajairika lamination nzira inoshandiswa lamination, zviri nyore kubudisa lamination chena makwapa, delamination uye kumwe kuremara, uye lamination yakaoma. . Kuti uderedze kuomerwa kwekudzvanya iyo yekupedzisira-yakakora yemhangura layer uye kuve nechokwadi cheiyo dimensional kurongeka, yakaedzwa uye yakasimbiswa kuti ishandise yakabatana yekutsikirira mold chimiro. Iwo epamusoro uye ezasi matemplate e mold anogadzirwa nesimbi molds, uye iyo silicone cushion inoshandiswa seyepakati buffer layer. Maitiro maparamendi akadai setembiricha, kudzvanywa, uye kumanikidza kubata nguva kuzadzisa iyo lamination mhedzisiro, uye zvakare kugadzirisa matambudziko ehunyanzvi emavara machena uye delamination ye Ultra-gobvu mhangura lamination, uye kusangana nelamination zvinodiwa zve Ultra-gobvu mhangura PCB mabhodhi.

(1) Super gobvu mhangura PCB lamination nzira.

The stacking level of the product in the ultra-thick copper laminate mold inoratidzwa muMufananidzo 5. Nekuda kwekuderera kwemvura yePP resin isingayereki, kana yakajairwa cladding material kraft paper ikashandiswa, pepa rePP harigoni kusungirirwa zvakafanana, zvichikonzera kukanganisa kwakadai semavara machena uye delamination mushure mekucheka. Zvigadzirwa zvakakora zvemhangura yePCB zvinofanirwa kushandiswa mukuita lamination Sekiyi buffer layer, silica gel pad inoita basa mukugovera zvakaenzana kudzvanywa panguva yekudzvanya. Uye zvakare, kuitira kugadzirisa dambudziko rekudzvanya, iyo yekumanikidza parameter mu laminator yakagadziridzwa kubva ku2.1 Mpa (22 kg/cm²) kuenda ku2.94 Mpa (30 kg/cm²), uye tembiricha yakagadziridzwa kune yakanyanya fusion tembiricha zvinoenderana ne maitiro ePP sheet 170 ° C.

(2) Iyo lamination paramita ye-ultra-thick copper PCB inoratidzwa muTafura 3.

(3) Mhedzisiro yemhando yepamusoro yemhangura PCB lamination.

Mushure mekuedzwa maererano neChikamu 4.8.5.8.2 cheGJB362B-2009, hapafaniri kuva nekuputika uye delamination inopfuura Chikamu 3.5.1.2.3 (pasi-pasi-defects) inobvumirwa paunoedza PCB maererano ne4.8.2. Sampu yePCB inosangana nechitarisiko uye saizi zvinodiwa zve3.5.1, uye ine micro-sectioned uye inoongororwa maererano ne4.8.3, iyo inosangana nezvinodiwa zve 3.5.2. Iyo slicing effect inoratidzwa muMufananidzo 6. Tichitarisa kubva pamamiriro ezvinhu echeka lamination, mutsara wakazara zvakakwana uye hapana micro-slit bubbles.

2.4 Super gobvu mhangura PCB inoyerera glue kutonga tekinoroji

Yakasiyana neyakajairwa PCB kugadzirisa, chimiro chayo uye mudziyo wekubatanidza maburi zvakapedzwa kusati kwaitwa lamination. Kana iyo glue inoyerera yakakomba, inokanganisa kutenderera uye ukuru hwekubatanidza, uye kutaridzika uye kushandiswa hazvizosangana nezvinodiwa; iyi nzira yakaedzwawo mukugadzirwa kwemaitiro. Nzira yekugadzira chimiro chekugaya mushure mekudzvanya, asi iyo inotevera chimiro chekugaya zvinodiwa zvinodzorwa zvakanyanya, kunyanya pakugadziriswa kwemukati makobvu ekubatanidza mhangura yekubatanidza, kudzika kwekutonga kwakasimba, uye mwero wekupasa wakaderera zvakanyanya.

Kusarudza zvinhu zvekubatanidza zvakafanira uye kugadzira chimiro chinonzwisisika chemudziyo ndeimwe yezvinetso mukutsvagisa. Kuti ugadzirise dambudziko rekuonekwa kweglue kufashukira kunokonzerwa neakajairika prepregs mushure mekucheka, prepregs ine yakaderera fluidity (Benefits: SP120N) inoshandiswa. Iyo inonamira zvinhu ine hunhu hwekudzika resin fluidity, kuchinjika, yakanakisa kupisa kupisa uye magetsi emagetsi, uye Zvinoenderana nehunhu hweglue kufashukira, contour ye prepreg pane imwe nzvimbo inowedzerwa, uye contour yechimwe chimiro inogadziriswa. nokucheka nokudhirowa. Panguva imwecheteyo, maitiro ekugadzira kutanga uye kudzvanya anoonekwa, uye chimiro chinoumbwa mushure mekudzvanya, pasina kudiwa kwe CNC kugaya zvakare. Izvi zvinogadzirisa dambudziko rekuyerera kweglue mushure mekunge PCB yaiswa laminated, uye inova nechokwadi chekuti hapana glue pane yekubatanidza pamusoro mushure meiyo super-gobvu ndiro yemhangura yakashongedzwa uye kudzvanywa kwakasimba.

3. Yakapedzwa mhedzisiro ye-ultra-thick copper PCB

3.1 Ultra-yakakora yemhangura PCB zvigadzirwa

Yakakura-yakakora yemhangura PCB chigadzirwa chinotsanangurwa parameter tafura 4 uye yapera chigadzirwa mhedzisiro inoratidzwa mumufananidzo 7.

3.2 Kumira bvunzo yemagetsi

Mapango ari mu-ultra-thick copper PCB sample akaedzwa kuti akwanise kushingirira voltage. The test voltage was AC1000V, uye pakanga pasina kurova kana flashover mu1 min.

3.3 Yakakwira ikozvino tembiricha yekukwira bvunzo

Dhizaina inoenderana inobatanidza ndiro yemhangura yekubatanidza danda rega rega reyekupedzisira-yakakora yemhangura PCB sampu munhevedzano, ibatanidze kune yakakwira ikozvino jenareta, uye edza zvakasiyana zvinoenderana neinoenderana bvunzo ikozvino. Mibairo yebvunzo inoratidzwa muTafura 5:

Kubva pakukwira kwekushisa muTable 5, kupisa kwese kukwira kwe-ultra-thick copper PCB yakaderera, iyo inogona kusangana nezvinodiwa zvekushandisa (kazhinji, kukwira kwekushisa kunoda pasi pe30 K). Iyo yakakwira ikozvino tembiricha yekukwira kweyakanyanya-yakakora yemhangura PCB ine hukama nechimiro chayo, uye kukwira kwekushisa kweakasiyana akakora emhangura zvimiro kuchave nemisiyano.

3.4 Thermal stress test

Thermal stress test zvinodiwa: Mushure mekupisa kushushikana bvunzo pasample zvinoenderana neGJB362B-2009 General Specification yeRigid Printed Boards, ongororo yekuona inoratidza kuti hapana chakaremara senge delamination, blistering, pad warping, uye mavara machena.

Mushure mekuonekwa uye saizi yePCB sampuli inosangana nezvinodiwa, inofanirwa kuve microsectioned. Nekuda kwekuti mukati memhangura yesample iyi yakakora zvakanyanya kuti isagadzirwe metallographically, sampu iyi inoiswa muyedzo yekupisa yekushushikana pa287 ℃ ± 6 ℃, uye chitarisiko chayo chete chinoongororwa nemeso.

Mhedzisiro yemuyedzo ndeye: hapana delamination, blistering, pad warping, mavara machena uye humwe hurema.

4. pfupiso

Ichi chinyorwa chinopa nzira yekugadzira nzira ye Ultra-yakakora copper multilayer PCB. Kuburikidza nehunyanzvi hwekuvandudza tekinoroji uye kuvandudzwa kwemaitiro, inogadzirisa zvinobudirira muganho uripo wemhangura ukobvu hweyakanyanya-yakakora copper multilayer PCB, uye inokunda zvakajairwa kugadzirisa matambudziko ehunyanzvi sezvinotevera:

(1) Ultra-yakakora mhangura yemukati lamination tekinoroji: Inogadzirisa zvinobudirira dambudziko rekusarudzwa kwemhangura yakawanda. Iko kushandiswa kwe-pre-milling processing hakudi etching, iyo inonyatso dzivirira matambudziko ehunyanzvi ekukora mhangura etching; iyo FR-4 yekuzadza tekinoroji inovimbisa kudzvanywa kwemukati wemukati Vhara kusimba uye matambudziko ekudzivirira;

(2) Ultra-yakakora mhangura PCB lamination tekinoroji: zvinobudirira kugadzirisa dambudziko remavara machena uye delamination mu lamination, uye akawana itsva kudzvanya nzira uye mhinduro;

(3) Super-gobvu yemhangura PCB inoyerera glue yekudzora tekinoroji: Inogadzirisa zvinobudirira dambudziko rekuyerera kweglue mushure mekudzvanya, uye inova nechokwadi chekushandiswa kweiyo pre-milling chimiro uye nekudzvanya.