Mkuwa wapamwamba kwambiri Multilayer PCB ntchito yopanga

1. Mapangidwe a laminated

Kufufuza kwakukulu kwa pepalali ndi bolodi lachitsulo chamkuwa chamagulu atatu, makulidwe amkati amkuwa ndi 1.0 mm, makulidwe akunja amkuwa ndi 0.3 mm, ndipo mzere wocheperako ndi katayanidwe ka mzere wakunja ndi 0.5 mm. Mapangidwe opangidwa ndi laminated akuwonetsedwa mu Chithunzi 1. Pamwamba pake ndi FR4 copper clad laminate (glass fiber epoxy copper clad laminate), yokhala ndi makulidwe a 0.3 mm, chithandizo cha mbali imodzi, ndi zomatira ndi pepala losayenda la PP. (chitsamba chowachizira), chokhala ndi makulidwe a 0.1 mm, wokhuthala kwambiri Mbale yamkuwa imayikidwa mu dzenje lofananira la mbale ya FR-4 epoxy.

The ndondomeko otaya kopitilira muyeso-wonenepa kwambiri mkuwa processing PCB ikuwonetsedwa Chithunzi 3. Machining chachikulu chimaphatikizapo pamwamba ndi pakati wosanjikiza mphero, wandiweyani mbale mkuwa nambala mphero. Pambuyo pa chithandizo chapamwamba, imayikidwa mu nkhungu yonse kuti itenthe ndi kusindikiza, ndipo mutatha kupukuta, tsatirani ndondomeko ya PCB yachizolowezi Njirayi imamaliza kupanga zinthu zomalizidwa.

2. Njira zamakono zogwirira ntchito

2.1 Ukadaulo wokhuthala kwambiri wamkuwa wamkati

Lamination wamkati wamkuwa wokhuthala kwambiri: Ngati zojambulazo zimagwiritsidwa ntchito ngati mkuwa wokhuthala kwambiri, zimakhala zovuta kukwaniritsa makulidwe awa. Mu pepala ili, wapamwamba kwambiri wandiweyani mkuwa wosanjikiza wamkati amagwiritsa 1 mm electrolytic mkuwa mbale, amene n’zosavuta kugula zipangizo ochiritsira ndipo mwachindunji kukonzedwa ndi makina mphero; mawonekedwe akunja a mbale yamkuwa yamkati Makulidwe omwewo a bolodi la FR4 (magalasi fiber epoxy board) amagwiritsidwa ntchito pokonza ndi kuumba ngati kudzaza kwathunthu. Pofuna kuwongolera kuyanika ndikuwonetsetsa kuti kumagwirizana kwambiri ndi periphery ya mbale yamkuwa, kusiyana kwapakati pakati pa ma contours awiri monga momwe tawonetsera mu chithunzi 4 kumayendetsedwa pa 0 ~ 0.2 Mkati mwa mm. Pansi pa kudzaza kwa bolodi la FR4, vuto la makulidwe amkuwa a bolodi lakuda kwambiri limathetsedwa, ndipo kukanikiza kolimba komanso zovuta zamkati zamkati pambuyo pa kuyanika zimatsimikizika, kotero kuti makulidwe amkati amkuwa amatha kukhala akulu kuposa 0.5 mm. .

2.2 Ukadaulo wakuda kwambiri wamkuwa

Pamwamba pa mkuwa wokhuthala kwambiri uyenera kudayidwa usanachitike. Kudetsa kwa mbale yamkuwa kumatha kukulitsa malo olumikizana pakati pa mkuwa ndi utomoni, ndikuwonjezera kunyowa kwa utomoni wotentha kwambiri wamkuwa, kuti utomoni ulowe mumpata wosanjikiza wa oxide ndikuwonetsa magwiridwe antchito amphamvu. pambuyo kuumitsa. Mphamvu yomatira imathandizira kukakamiza. Pa nthawi yomweyo, akhoza kusintha laminating woyera banga chodabwitsa ndi whitening ndi thovu chifukwa cha mayeso kuphika (287 ℃ ± 6 ℃). Zosintha zenizeni zakuda zikuwonetsedwa mu Table 2.

2.3 Ukadaulo wapamwamba kwambiri wamkuwa wa PCB

Chifukwa cha zolakwika zopanga mu makulidwe a mbale yamkuwa yokhuthala kwambiri komanso mbale ya FR-4 yomwe imagwiritsidwa ntchito podzaza mozungulira, makulidwe ake sangagwirizane. Ngati ochiritsira lamination njira ntchito kwa lamination, n’zosavuta kubala lamination woyera mawanga, delamination ndi zolakwika zina, ndi lamination ndi kovuta. . Pofuna kuchepetsa vuto la kukanikiza kopitilira muyeso wamkuwa ndikuwonetsetsa kulondola kwa mawonekedwe, adayesedwa ndikutsimikiziridwa kuti agwiritse ntchito mawonekedwe ophatikizika a nkhungu. Ma templates apamwamba ndi apansi a nkhungu amapangidwa ndi zitsulo zachitsulo, ndipo khushoni ya silikoni imagwiritsidwa ntchito ngati gawo lapakati. Njira magawo monga kutentha, kuthamanga, ndi kuthamanga akugwira nthawi kukwaniritsa zotsatira lamination, komanso kuthetsa mavuto luso mawanga woyera ndi delamination wa kopitilira muyeso-wandiweyani mkuwa lamination, ndi kukwaniritsa zofunika lamination wa kopitilira muyeso-wokhuthala matabwa PCB zamkuwa.

(1) Super wandiweyani mkuwa PCB lamination njira.

Kuchuluka kwa mankhwalawa mu nkhungu yolimba kwambiri yamkuwa ikuwonetsedwa mu Chithunzi 5. Chifukwa cha kutsika kwamadzimadzi kwa utomoni wa PP wosasunthika, ngati pepala lokhazikika la kraft likugwiritsidwa ntchito, pepala la PP silingakanidwe mofanana, kuchititsa zolakwika monga mawanga oyera ndi delamination pambuyo lamination. Zogulitsa zamkuwa za PCB zokhuthala ziyenera kugwiritsidwa ntchito poyanika Monga chotchinga chotchinga, silika gel pad imagwira nawo ntchito pogawa kukakamiza pakukakamiza. Kuphatikiza apo, kuti athetse vutoli, kuthamanga kwa gawo la laminator kunasinthidwa kuchokera ku 2.1 Mpa (22 kg / cm²) mpaka 2.94 Mpa (30 kg / cm²), ndipo kutentha kunasinthidwa kuti pakhale kutentha kwabwino kwambiri. Makhalidwe a pepala la PP 170 ° C.

(2) Miyezo yoyatsira ya PCB yamkuwa yokhuthala kwambiri ikuwonetsedwa mu Gulu 3.

(3) Zotsatira za lamination wapamwamba kwambiri wamkuwa wa PCB.

Pambuyo poyesedwa molingana ndi Gawo 4.8.5.8.2 la GJB362B-2009, sipayenera kukhala matuza ndi delamination zomwe zimadutsa Gawo 3.5.1.2.3 (zowonongeka zapansi) zololedwa poyesa PCB molingana ndi 4.8.2. Chitsanzo cha PCB chimakwaniritsa zofunikira za maonekedwe ndi kukula kwa 3.5.1, ndipo ndi gawo laling’ono ndikuyang’aniridwa molingana ndi 4.8.3, zomwe zimakwaniritsa zofunikira za 3.5.2. Zotsatira za slicing zikuwonetsedwa mu Chithunzi 6. Poyang’ana mkhalidwe wa kagawo kakang’ono, mzerewo umadzazidwa mokwanira ndipo palibe thovu laling’ono.

2.4 Super wandiweyani mkuwa PCB otaya guluu luso kulamulira

Osiyana ndi ambiri PCB processing, mawonekedwe ake ndi chipangizo mabowo kugwirizana zatha pamaso lamination. Ngati guluu likuyenda mozama, lidzakhudza kuzungulira ndi kukula kwa kugwirizana, ndipo maonekedwe ndi ntchito sizidzakwaniritsa zofunikira; ndondomekoyi yayesedwanso mu chitukuko cha ndondomeko. Njira njira ya mawonekedwe mphero pambuyo kukanikiza, koma kenako mawonekedwe mphero zofunika mosamalitsa ankalamulira, makamaka kwa processing wa mbali mkati wandiweyani mkuwa kugwirizana, kuya mwatsatanetsatane kulamulira ndi okhwima kwambiri, ndi mlingo chiphaso ndi otsika kwambiri.

Kusankha zida zoyenera zomangira ndikupanga zida zoyenera ndi chimodzi mwazovuta mu kafukufukuyu. Pofuna kuthetsa vuto la maonekedwe a guluu kusefukira chifukwa prepregs wamba pambuyo lamination, prepregs ndi otsika fluidity (Ubwino: SP120N) ntchito. Zomatira zimakhala ndi mawonekedwe otsika utomoni fluidity, kusinthasintha, kukana kutentha kwambiri ndi mphamvu zamagetsi, ndipo Malinga ndi mawonekedwe a guluu kusefukira, contour ya prepreg pamalo enaake imachulukitsidwa, ndipo mawonekedwe a mawonekedwe apadera amakonzedwa. mwa kudula ndi kujambula. Pa nthawi yomweyo, ndondomeko kupanga choyamba ndiyeno kukanikiza anazindikira, ndipo mawonekedwe aumbike pambuyo kukanikiza, popanda kufunika CNC mphero kachiwiri. Izi zimathetsa vuto la guluu kuyenda pambuyo PCB laminated, ndi kuonetsetsa kuti palibe guluu pa cholumikizira pamwamba mbale yamkuwa wapamwamba kwambiri wandiweyani laminated ndipo kupanikizika kuli kolimba.

3. Anamaliza zotsatira za kopitilira muyeso-wokhuthala mkuwa PCB

3.1 Zodziwika bwino kwambiri za PCB zamkuwa

Mkuwa wokhuthala kwambiri wa PCB wokhazikika patebulo 4 ndi zotsatira zomaliza zikuwonetsedwa pachithunzi 7.

3.2 Kupirira kuyesedwa kwamagetsi

Mitengo yomwe ili mu chitsanzo cha PCB yamkuwa yochuluka kwambiri inayesedwa kuti ipirire mphamvu. Mphamvu yoyesera inali AC1000V, ndipo panalibe kugunda kapena flashover mu 1 min.

3.3 Kuyesa kwatsopano kwa kutentha kwakukulu

Kupanga lolingana kulumikiza mbale mkuwa kulumikiza mzati aliyense wa kopitilira muyeso-wokhuthala mkuwa chitsanzo PCB mndandanda, kulumikiza ndi jenereta mkulu panopa, ndi kuyesa padera malinga lolingana mayeso panopa. Zotsatira za mayeso zikuwonetsedwa mu Gulu 5:

Kuchokera pakukwera kwa kutentha mu Table 5, kutentha kwakukulu kwa PCB yamkuwa yochuluka kwambiri ndi yotsika kwambiri, yomwe imatha kukwaniritsa zofunikira zenizeni zogwiritsira ntchito (nthawi zambiri, kutentha kwa kutentha kumakhala pansi pa 30 K). Kukwera kwaposachedwa kwa kutentha kwa PCB yamkuwa yochuluka kwambiri kumagwirizana ndi kapangidwe kake, ndipo kutentha kwamitundu yosiyanasiyana yamkuwa kumakhala ndi kusiyana kwina.

3.4 Kuyeza kupsinjika kwa kutentha

Zofunikira pakuyesa kupsinjika kwamafuta: Pambuyo pakuyesa kupsinjika kwamafuta pachitsanzo molingana ndi GJB362B-2009 General Specification for Rigid Print Boards, kuyang’ana kowoneka kumawonetsa kuti palibe cholakwika monga delamination, matuza, ma pad warping, ndi mawanga oyera.

Pambuyo maonekedwe ndi kukula kwa chitsanzo PCB kukwaniritsa zofunika, ayenera microsectioned. Chifukwa wosanjikiza wamkati wamkuwa wa chitsanzochi ndi wandiweyani kwambiri kuti usakhale wogawanika ndi metallographically, chitsanzocho chimayesedwa ku 287 ℃ ± 6 ℃, ndipo maonekedwe ake okha ndi omwe amawunikidwa.

Zotsatira zake ndi: palibe delamination, matuza, pad warping, mawanga oyera ndi zolakwika zina.

4. Chidule

Nkhaniyi ikupereka njira yopangira makina a PCB amitundu yambiri yamkuwa. Kupyolera mu luso lamakono ndi kukonza ndondomeko, imathetsa bwino malire amakono amkuwa makulidwe a ultra-thick copper multilayer PCB, ndikugonjetsa mavuto omwe amagwiritsidwa ntchito pokonza ndondomeko motere:

(1) Ukadaulo wochuluka kwambiri wamkuwa wamkuwa wamkati: Imathetsa bwino vuto la kusankha kwazinthu zamkuwa zakuda kwambiri. Kugwiritsa ntchito chisanadze mphero processing sikutanthauza etching, amene bwino amapewa luso mavuto wandiweyani mkuwa etching; ukadaulo wodzaza FR-4 umatsimikizira kukakamizidwa kwa wosanjikiza wamkati Tsekani zolimba ndi zovuta zotsekereza;

(2) Koposa wandiweyani mkuwa PCB lamination luso: bwino anathetsa vuto la mawanga woyera ndi delamination mu lamination, ndipo anapeza njira yatsopano kukanikiza ndi njira;

(3) Ukadaulo wowongolera kwambiri wamkuwa wa PCB woyenda ndi guluu: Imathetsa bwino vuto la guluu otaya mutatha kukanikiza, ndikuwonetsetsa kukhazikitsidwa kwa mawonekedwe opangira mphero ndiyeno kukanikiza.