Kwiminyaka yakutshanje, ukuze kuhlangatyezwane neemfuno ze-miniaturization yeemveliso zabathengi eziphezulu eziphezulu, ukudityaniswa kwe-chip kuya kuphakama kwaye kuphakama, isithuba se-BGA sisondela ngokusondela (ngaphantsi okanye elingana no-0.4pitch), Ubume bePCB buya buba bumbane ngakumbi, kwaye uxinano lomzila luya lukhulu kwaye lukhulu. Nawuphi na umdlali (odala ngokungahambisaniyo) netekhnoloji isetyenziselwe ukuphucula uyilo ngaphandle kokuchaphazela intsebenzo enjengokuqina kwemiqondiso, Le ALIVH naluphina ubume be-IVH yolwakhiwo lwebhodi ye-wiring eshicilelweyo.
Iimpawu zobugcisa zalo naliphi na umaleko ngomngxuma
Xa kuthelekiswa neempawu zetekhnoloji ye-HDI, uncedo lwe-ALIVH kukuba inkululeko yoyilo inyuswe kakhulu kwaye imingxunya inokubethwa ngokukhululekileyo phakathi kwamanqanaba, angenakufezekiswa yitekhnoloji ye-HDI. Ngokubanzi, abavelisi basekhaya baphumelela kulwakhiwo oluntsonkothileyo, oko kukuthi, umda woyilo lwe-HDI yibhodi ye-HDI yodidi lwesithathu. Ngenxa yokuba i-HDI ingayamkeli ngokupheleleyo i-laser yokomba, kwaye umngxunya ongcwatyelweyo kulwahlulo lwangaphakathi wamkela imingxunya yoomatshini, iimfuno zediski yomngxunya zinkulu kakhulu kunemingxunya ye-laser, kwaye imingxunya yoomatshini ihlala kwisithuba sokudlula. Ke ngoko, xa sithetha nje ngokubanzi, xa kuthelekiswa nokubhola ngokungenabungqina kwitekhnoloji ye-ALIVH, ubukhulu bepore yesingqekembe esingaphakathi singasebenzisa i-0.2mm micropores, esisengumsantsa omkhulu. Ke ngoko, indawo yokufaka iintambo kwibhodi ye-ALIVH kungenzeka ukuba iphezulu kakhulu kunale ye-HDI. Kwangelo xesha, iindleko kunye nokulungisa ubunzima be-ALIVH zikwangaphezulu kunaleyo ye-HDI. Njengoko kubonisiwe kumzobo 3, ngumzobo wesikimu we-ALIVH.
Uyilo lwemiceli mngeni yee-vias nakweyiphi na indawo
Umaleko ngokungenantlonelo ngetekhnoloji ubhukuqa ngokupheleleyo isiko lendlela yoyilo. Ukuba usafuna ukuseta ii-vias kwimiqolo eyahlukeneyo, iya kubonyusa ubunzima bolawulo. Isixhobo sokuyila kufuneka sibe nokukwazi ukubhola okrelekrele, kwaye sinokudityaniswa kwaye sahlulwe ngokuthanda.
I-Cadence yongeza indlela yokutshintsha kwe-wiring esekwe kulwabiwo olusebenzayo lwendlela yendabuko esekwe kulungelelwaniso lwentambo, njengoko kubonisiwe kumzobo 4: ungajonga umaleko onokuqhuba umgca wokujikeleza kwiphaneli yokusebenza, emva koko ucofe kabini umngxuma ukukhetha nawuphi na umaleko wokutshintshwa kwentambo.
Umzekelo woyilo lwe-ALIVH kunye nokwenza iipleyiti:
Uyilo olunemigangatho eyi-10 ye-ELIC
Iqonga le-OMAP4
Ukungqinwa okungcwatyelweyo, ukungcwatywa komthamo kunye nezinto ezifakwe ngaphakathi
Ukudityaniswa okuphezulu kunye nokwenza izinto ezincinci kwizixhobo eziphathwayo kuyafuneka ukufikelela ngokukhawuleza kwi-Intanethi nakunxibelelwano lwasentlalweni. Okwangoku xhomekeka kwitekhnoloji ye-4-n-4 ye-HDI. Nangona kunjalo, ukufezekisa ukuxinana okuphezulu koqhagamshelo kwisizukulwana esilandelayo setekhnoloji entsha, kule ndawo, ukufaka okungahambelaniyo okanye kwamalungu asebenzayo kwi-PCB kunye ne-substrate kunokuhlangabezana nezi mfuno zingasentla. Xa uyila iifowuni eziphathwayo, iikhamera zedijithali kunye nezinye iimveliso zombane zabathengi, lukhetho lwangoku lokujonga ukuba ungazifaka njani izinto ezenziwayo nezisebenzayo kwi-PCB nakwi-substrate. Le ndlela ingahluka kancinci kuba usebenzisa abathengisi abohlukeneyo. Olunye uncedo lwamalungu afakelweyo kukuba itekhnoloji ibonelela ngokukhuselwa kwepropathi enomgangatho ophezulu wokuqonda ngokuchasene nokubizwa ngokuba kuyilo oluguquliweyo. Umhleli we-Allegro PCB unokubonelela ngezisombululo zeshishini. Umhleli we-Allegro PCB unokusebenza ngokusondeleyo kunye nebhodi ye-HDI, ibhodi eguqukayo kunye neendawo ezifakiwe. Unokufumana iiparameter ezichanekileyo kunye nezithintelo zokugqibezela uyilo lwamalungu afakelweyo. Uyilo lwezixhobo ezifakiwe alunakwenza lula inkqubo ye-SMT, kodwa luphucula kakhulu ucoceko lweemveliso.
Ukungcwatywa okungcwatyiweyo kunye noyilo lomthamo
Ukungcwatywa ukungcwatywa, okwaziwa ngokuba kukumelana nokungcwatywa okanye ukunganyangeki kwefilimu, kukucinezela umbandela okhethekileyo wokumelana ne-substrate yokwambathisa, emva koko ufumane ixabiso elifunekayo lokumelana nokuprinta, ukutshisa kunye nezinye iinkqubo, emva koko ucofe kunye nezinye izingqimba zePCB ukwenza umaleko wokumelana nenqwelomoya. Itekhnoloji yokuvelisa eqhelekileyo ye-PTFE ukungcwatywa kwebhodi eshicilelweyo yeebhodi ezininzi kunokufikelela kwinkcaso efunekayo.
I-capacitance engcwatyelweyo isebenzisa umbandela ngobuninzi be-capacitance density kunye nokunciphisa umgama phakathi kwamaleko ukwenza indawo eyaneleyo yeplate capacitance yokudlala indima yokudibanisa kunye nokuhluza kwenkqubo yokuhambisa umbane, ukwenzela ukunciphisa amandla ombane afunekayo ebhodini kwaye ukufezekisa ngcono imeko yokuhluza ephezulu. Ngenxa yokuba i-infasitic inductance ye-capacitance yokungcwatywa incinci kakhulu, indawo yayo yokuhamba rhoqo iya kuba ngcono kune-capacitance eqhelekileyo okanye amandla aphantsi e-ESL.
Ngenxa yokuvuthwa kwenkqubo kunye netekhnoloji kunye nemfuno yoyilo olukhawulezayo lwesixokelelwano sonikezelo lwamandla, itekhnoloji yamandla angcwatyelweyo isetyenziswa ngakumbi nangakumbi. Sisebenzisa itekhnoloji yamandla angcwatyelweyo, kufuneka kuqala sibale ubungakanani beplati yeplate capacitance Umzobo 6 ifomula yokubala yokubala yokubala
Ngokuba:
C kukusebenza kwamandla okungcwatywa okungcwatyelweyo (iplati capacitance)
Ummandla weeplati ezicwangcisiweyo. Kuninzi loyilo, kunzima ukwandisa indawo phakathi kwamacwecwe athe tyaba xa ulwakhiwo luchaziwe
I-D_ K yinto eqhubekayo ye-dielectric ephakathi phakathi kwamacwecwe, kwaye amandla phakathi kwamacwecwe alinganiswe ngokuthe ngqo kwi-dielectric rhoqo
K kukungabikho kwemvume yokuphuma, okwabizwa ngokuba yimvume yokuphuma. Kuyinto ehlala ihleli ebonakalayo enexabiso le-8.854 187 818 × 10-12 farad / M (F / M);
H ubukhulu phakathi kweenqwelomoya, kunye nokubakho phakathi kweepleyiti kulungelelaniswe ngokuthe gca kubukhulu. Ke ngoko, ukuba sifuna ukufumana amandla amakhulu, kufuneka sinciphise ubukhulu babadlali. I-3M c-ply engcwatyelwe amandla e-capacitance anokufikelela kubunzima be-dielectric ye-0.56mil, kwaye i-dielectric engaguqukiyo ye-16 inyusa kakhulu amandla okusebenza phakathi kwamacwecwe.
Emva kokubala, i-3M c-ply engcwatyelwe imithwalo yemithambo ingafezekisa amandla eplati ye-6.42nf nge-intshi nganye yesikwere.
Kwangelo xesha, kuyimfuneko ukusebenzisa isixhobo sePI sokulinganisa ukulinganisa ukungangqinelani kwe-PDN, ukumisela uyilo lobuchule bebhodi enye kunye nokuthintela uyilo olungafunekiyo lokungcwatywa kunye ne-discit capacitance. Umzobo 7 ubonakalisa iziphumo zokufanisa ze-PI zoyilo lomthamo olungcwatyelweyo, kuthathelwa ingqalelo kuphela isiphumo sebhodi yebhodi engaphandle ngaphandle kokudibanisa amandla e-discrete. Kuyabonakala ukuba kuphela ngokwandisa amandla angcwatyiweyo, ukusebenza kwawo onke amandla e-impedance curve kuphuculwe kakhulu, ngakumbi ngaphezulu kwe-500MHz, eyibhanti yamaxesha apho inqanaba lebhodi lokucoca ulungelelwaniso lobunzima kunzima ukusebenza. I-capacitor yebhodi inokunciphisa ngokufanelekileyo ukungasebenzi kwamandla.