Umgangatho PCB ngokusebenzisa ubukhulu umngxuma

Yintoni i-PCB enqamlezileyo kwaye kutheni kubalulekile kuyo ibhodi yesekethe eprintiweyo? I-PCB ifuna ukugqobhoza imingxunya okanye amaqula ukudibanisa umaleko wayo. Understanding the standard through-hole sizes used by PCB manufacturers can help you design boards to meet common bit sizes.

Umgangatho ngobukhulu bomngxuma

Abavelisi PCB babe iseti zabo ubukhulu umngxuma standard ukuba ukhethe xa kusombiwa imingxunya, kodwa ke banokusebenzisa nawuphi na ubungakanani umngxuma standard. Ngokubanzi, abavelisi bePCB banokwenza ubungakanani bePCB ngemingxunya encinci njenge-0.15 mm, xa kuthelekiswa nobukhulu obuqhelekileyo be-0.6 mm.

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I-PCB ngokweemingxunya zobungakanani bemfuno

Olu luphononongo olunzulu lweemfuno zobungakanani.

PCB ngokusebenzisa umngxuma ubukhulu

Ubungakanani bePCB ngomngxuma bunokwahluka ngokuxhomekeka kwindawo ekuyo, ukusetyenziswa kwayo, kunye nezinye izinto, yiyo loo nto wonke umenzi wePCB enikezela ngobungakanani bePCB. Most manufacturers can make holes as small as 0.15 mm or larger holes of 1 mm or larger. Xa ujonga ubungakanani bomngxunya ofunekayo, kuya kufuneka ujonge iringi okanye iphedi yobhedu ejikeleze umngxunya, oya kuthi uvele.

How do you calculate rings? The ideal ring is equal to the sum of the diameter of the copper pad minus the diameter of the drill hole divided by 2, which gives the rig the best chance of hitting the center of the pad for optimal connectivity.

Umgangatho ngobukhulu bomngxuma

Akukho mfuneko yokuba ubungakanani be-PCB obuphakathi kwimingxunya yokuvelisa i-PCB, njengoko ubukhulu be-PCB obuhamba phakathi emngxunyeni buhlala buhluka kumenzi ukuya kumenzi wePCB. Nangona kunjalo, abavelisi abaninzi be-PCB bakhetha ukusebenzisa ubungakanani obuqhelekileyo, abanokuthi babhekise kubo njengobungakanani obuqhelekileyo bePCB. Olunye ubungakanani obuqhelekileyo yi-0.6 mm, kodwa i-0.2 mm kunye ne-0.3 mm nazo zisetyenziswa ngokuxhaphakileyo.

Type of PCB through hole

Ungasebenzisa ubungakanani obuqhelekileyo obusemngxunyeni ukwenza iintlobo ezahlukeneyo ze-PCB ngemingxunya, kuxhomekeke kubeko, ukwakhiwa, uyilo, kunye nenjongo ye-PCB. Ezi ntathu ze-PCB zixhaphakileyo kwimingxunya yile:

Watyabeka ngomngxuma

I-Electroplated through-hole (PTH) yimingxunya ehamba kuyo yonke imiqolo ye-PCB ukudibanisa amanqanaba aphezulu nasezantsi. Kuya kufuneka ukwazi ukubona i-PTH ukusuka kwelinye icala le-PCB ukuya kwelinye. I-PTH inokuthi ifakwe okanye ingafakwanga. Ukungafakwanga ngemingxunya akuwenzi umbane, ngelixa kugalelwe imingxunya kufakelwe i-electroplated, oko kuthetha ukuba baqhuba umbane kuwo onke amanqanaba e-PCB.

Umngxunya ongaboniyo

Blind holes connect the outer (top or bottom) layers of the PCB to one or more inner layers, but do not completely drill through the board. Precise drilling of blind holes can be challenging, so they are typically more expensive to manufacture than PTH.

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Embedded holes can also increase the cost of PCB because they are difficult to manufacture. The holes are located in the inner layer of the PCB to connect two or more inner layers. Awunakuyibona imathiriyeli engcwatywayo kumaleko wangaphandle wePCB.

Izinto ekufuneka ziqwalaselwe

Kukho izinto ezimbalwa ekufuneka ziqwalaselwe xa kusenziwa i-PCB. Okokuqala, kuya kufuneka uyazi ukuba yeyiphi imeko ekuyilo lwePCB. The aspect ratio is the PCB thickness relative to the diameter of the through hole, which determines the reliability of the copper plating on the PCB. The higher the ratio, the more difficult it is to obtain reliable plating, which affects the type of hole and plating method you choose.

Imingxunya efakelweyo okanye engaboniyo inokusebenzela i-PCB yakho ngcono ngomlinganiso we-15: 1, ngelixa i-PTH inokusebenza kakuhle ngomgangatho ophantsi we-2: 1. Njani na ukhetha ukutyeba PCB ubhedu? Usually, through holes in the outer layer (e.g., through holes) require a thicker layer of copper than the buried through holes inside. Umbane osetyenziswa yi-PCB ukwachaphazela ukutyeba kobhedu. High voltage applications typically require thicker PCB copper than low voltage applications.

By filling program

Sometimes PCB through-holes need to be filled, for example to reduce the risk of trapping air or increase electrical conductivity. Some common ways to fill through holes include:

Ngentente leyo

Intente enqamleze umda yenza umaleko wokuthintela ukuthengisa ngaphezulu kwe-PCB ngembobo kunokuba ugcwalise umngxuma ngezinto. This can be a quick, easy and cost-effective option to cover the through-holes, but the tent-style through-holes may reopen over time.

Ngokuthintela

Inkqubo yokuphuma emngxunyeni igcwalisa umngxunya ngezinto ezingahambisiyo kwaye iyitywine ngesigqumathelo. Through-hole clogging also covers the ring and does not produce a smooth, glossy surface.

Ngokugcwalisa

Ukuzaliswa kwemingxunya ngokusebenzisa umngxunya ukwenza umngxunya ozaliswe ngokusisigxina. A through-hole fill is a common through-hole fill in which the manufacturer fills the through-hole with conductive material, coats the surface with copper, and then trims the surface. This process can route signals to other areas of the PCB.

PCB ngokusebenzisa umngxuma izicelo nesingxobo

Abavelisi banokusebenzisa iindlela ezahlukeneyo zokusebenzisa i-PCB ngokufaka umngxunya ngaphakathi ukuze kuqinisekiswe ukusebenza kwayo. One common method is to use a low viscosity ink that covers the inside of the through-hole to form a conductive layer. Then through the heat curing process to bond the ink.

Enye indlela yokwenza i-electroplating, apho i-PCB ingena kwindawo yokuhlambela. Kule nkqubo, ubhedu lugubungela iindonga ze-PCB nganye ngemingxunya, okukhokelela kubungakanani bezinto eziqhubayo. Le ndlela ihlala ithatha ixesha elide kwaye iyabiza ngaphezulu kwenkqubo ye-inki, kodwa inokwenza isambatho esithembekileyo kunye nebhondi.

Sequential drilling blind drilling and deep drilling

IiPCBS ezinemingxunya engaboniyo zinokwenziwa ngeendlela ezimbini. This can be done by laser drilling or by a method called continuous layer construction. Using the sequential construction method, pairs of layers can be drilled and electroplated before bonding is applied. Because they have holes at both ends, electroplating is easy to penetrate for chemical coatings. It also allows blind holes to be designed in such a way that they can pass through multiple layers.

Isakhono sokudibanisa ukudibanisa okufanelekileyo, ukubhola kunye nokulandelelana kwesingxobo kwenza ukuba kube lula ukwenza imingxunya emininzi engaboniyo. Konke kuxhomekeke ekubeni umngxunya ongaboniyo ungagqitha nakwimaleko engaphandle.

Simultaneous deep drilling or reverse drilling is the process of removing any unused copper drum residue from the through hole. Oku kudla ngokwenzeka xa imiqondiso yesantya esiphezulu igqwethwa njengoko idlula kwiityhubhu zobhedu phakathi kweendlela zePCB. Ukuba usebenzisa umaleko womqondiso kuphumela kunqamlezo olude, kuya kubakho ukuphambuka okuninzi.

Umlinganiso wembonakalo ye-PCB uchazwa njengomlinganiso wobunzima beplate ukuya kububanzi bequla. Imingxunya engaboniyo ifuna umlinganiso we-1 ukuya ku-1 okanye ngaphezulu.

Xa kusombiwa nzulu, ubunzulu bomngxunya buchazwa ngokumisela isibini semingxunya echaza ukuqala kunye nokuphela komaleko ecaleni kwebhodi. Ububanzi besuntswana lokombiwa okunzulu kubalwa ngale ndlela ilandelayo:

Ubungakanani be-back drill = Ubungakanani beHole / pad ubukhulu + 2 x Imithetho yoyilo Ubungakanani be-drill yobukhulu bukhulu kakhulu

PCB overinductance calculator

I-PCB yokufaka ngaphakathi emngxunyeni ixhomekeke kwizinto ezininzi, kubandakanywa ubungakanani bomngxunya, ubungakanani bendandatho, umlinganiso wezinto, kunye nokuchaneka ngokuchanekileyo. Unokufumana iikhalityhuleyitha ezikwi-intanethi ukukunceda ubale i-PCB elungileyo ngokobungakanani obufanele uyisebenzise.