Ngokukhula ngokukhawuleza kwetekhnoloji yale mihla, I-PCBA Ikwakhula ibhekise koxinano oluphezulu kunye nokuthembeka okuphezulu. Nangona inqanaba langoku le-PCB kunye ne-PCBA yokuvelisa ubuchwephesha liphuculwe kakhulu, inkqubo yesiqhelo ye-welding ye-PCB ayizukubulala imveliso. Nangona kunjalo, izixhobo ezinesithuba esincinci kakhulu, uyilo olungenangqondo lwe-PCB ye-welding pad kunye ne-PCB yokuthintela iphedi iya kwandisa ubunzima benkqubo ye-SMT yokuwelda kunye nokunyusa umngcipheko womgangatho we-PCBA kumphezulu wentaba.

Ngenxa yeengxaki ezinokubakho zokuvelisa kunye nokuthembeka okubangelwe kukuyilwa okungafunekiyo kwephedi yeWBP kunye nephedi yokuvimba, iingxaki zokwenza izinto zinokuphetshwa ngokwandisa uyilo lokupakisha isixhobo ngokusekwe kwinqanaba lenkqubo yePCB kunye nePCBA. Uyilo olusebenzayo ikakhulu luvela kwimiba emibini, okokuqala, uyilo lokucwangciswa kwePCBING; Okwesibini, uyilo lobuchule lobunjineli bePCB. Uyilo lwephakheji ngokwe-IPC 7351 esemgangathweni yethala leencwadi kwaye ubhekise kubungakanani bephedi ekucetyiswa kuyo kwinkcukacha zesixhobo. Uyilo olukhawulezayo, iinjineli zoyilo kufuneka zonyuse ubungakanani bepad ngokobungakanani obucetyiswayo bokuguqula uyilo. Ubude nobubanzi iphedi welding pad kufuneka inyuswe nge-0.1mm, kwaye ubude nobubanzi iphedi block iwelding kufuneka inyuswe nge-0.1mm ngokwesiseko pad ukuwelda. Inkqubo yesiqhelo yokuchasana ne-PCB ifuna ukuba umda wephedi kufuneka ugqunywe nge-0.05mm, kwaye ibhulorho ephakathi yeepads ezimbini kufuneka ibe nkulu kune-0.1mm. Kwinqanaba loyilo lobunjineli be-PCB, xa ubungakanani beepads ze-solder zingenakulungiswa kwaye ibhulorho ye-solder esembindini phakathi kweepads ezimbini ingaphantsi kwe-0.1mm, ubunjineli be-PCB yamkela unyango loyilo lweplate yeqela. Xa isithuba seephedi ezimbini sisithuba esingaphezulu kwepedi ye-0.2mm, ngokwendlela yoyilo oluqhelekileyo lokupakisha; Xa umgama phakathi kwemiphetho yeepads ezimbini ungaphantsi kwe-0.2mm, uyilo lokwenziwa kwe-DFM luyafuneka. Indlela yoyilo yokwenziwa kwe-DFM iluncedo ekusebenziseni ubungakanani beepads. Qinisekisa ukuba i-soldering flux kwinkqubo ye-soldering inokwenza isiseko esisezantsi somqobo xa i-PCB yenziwa. Xa umda webala phakathi kweephedi ezimbini ungaphezulu kwe-0.2mm, uyilo lobunjineli luya kwenziwa ngokweemfuno eziqhelekileyo; Xa umgama phakathi kwemiphetho yeepads ezimbini ungaphantsi kwe-0.2mm, uyilo lwe-DFM luyafuneka. Indlela ye-DFM yoyilo lobunjineli ibandakanya ukulungiswa koyilo lothintelo lokumelana ne-welding kunye nokusika ubhedu lomaleko woncedo. Ubungakanani bokusika ubhedu kufuneka bubhekise kwinkcukacha zesixhobo. Iphedi yokusika ubhedu kufuneka ibe phakathi kobungakanani bohlobo loyilo olucetyiswayo, kwaye uyilo lwe-PCB lokuvala iwelding kufuneka luyilo lwewindows enye, oko kukuthi, ibhulorho ebhloka inokugqunywa phakathi kweephedi. Qinisekisa ukuba kwinkqubo yokuvelisa i-PCBA, kukho ibhulorho yokuvala iwelding phakathi kwezi pads zimbini zodwa, ukunqanda ukuwelda iingxaki zomgangatho wokubonakala kunye neengxaki zokusebenza kokuthembeka kombane. Welding ukumelana umboniso kwinkqubo ibandla welding nga ngempumelelo ukuthintela iwelding ibhulorho uxhulumaniso elifutshane, ngokuba high -xinano PCB kunye izikhonkwane izithuba ocoliweyo, ukuba ibhulorho evulekileyo iwelding phakathi izikhonkwane iyodwa, PCBA isityalo processing ayikwazi ukuqinisekisa umgangatho iwelding lendawo imveliso. Kwi-PCB ebekelwe bucala ngokufaka iwelding evulekileyo yoxinaniso kunye nezikhonkwane zokushiya izithuba, umzi-mveliso wePCBA okhoyo ngoku umisela ukuba izinto ezingenayo zePCB zinesiphene kwaye azikuvumeli ukuveliswa kwe-Intanethi. Ukuthintela umngcipheko osemgangathweni, umzi mveliso wePCBA awuyi kuqinisekisa umgangatho wokuwelda kweemveliso ukuba umthengi unyanzelisa ukubeka iimveliso kwi-intanethi. Kuqikelelwa ukuba iingxaki zomgangatho we-welding kwinkqubo yokuvelisa kwefektri ye-PCBA ziya kusonjululwa ngothethathethwano.

Into yokuphonononga:

Ubungakanani bencwadi yokucacisa ubungakanani besixhobo, izithuba zesithuba sepini: 0.65mm, ububanzi bepini: 0.2 ~ 0.4mm, ubude bepini: 0.3 ~ 0.5mm. Ubungakanani bephedi ye-solder yi-0.8 * 0.5mm, ubungakanani bephedi ye-solder yi-0.9 * 0.6mm, isithuba esiphakathi kwephedi yefowuni yi-0.65mm, isithuba somda wephedi ye-solder yi-0.15mm, isithuba somda wephedi ye-solder 0.05mm, kwaye ububanzi be-unilateral solder pad bonyuswe nge-0.05mm. Ngokwendlela yobunjineli be-welding yoyilo oluqhelekileyo, ubungakanani bephedi yokuwelda engalinganiyo kufuneka ibe nkulu kunobungakanani bepad yokuwelda i-0.05mm, kungenjalo kuya kubakho umngcipheko wokudibanisa ukubhobhoza okugubungela iphedi yokuwelda. Njengoko kubonisiwe kumzobo 5, ububanzi be-welding ye-unilateral yi-0.05mm, ehlangabezana neemfuno zemveliso ye-welding kunye nokulungiswa. Nangona kunjalo, umgama phakathi kwemiphetho yeepads ezimbini yi-0.05mm kuphela, engazifezekisiyo iimfuno zetekhnoloji yebhulorho yokumelana ne-welding. Uyilo lobunjineli luyilo ngokuthe ngqo kumqolo wonke wendlela yoyilo lwepin yoyilo lweplani yeplani yeplate. Yenza ibhodi kwaye uyigqibe i-SMT patch ngokwemfuneko yoyilo lobunjineli. Ngovavanyo lomsebenzi, inqanaba lokusilela kwentsimbi kwi-chip lingaphezulu kwe-50%. Kwakhona kuvavanyo lomjikelo wobushushu, inokujonga ngaphezulu kwe-5% yenqanaba elinesiphene. Ukhetho lokuqala kukuhlalutya inkangeleko yesixhobo (iiglasi ezingama-20 zokukhulisa), kwaye kufunyaniswe ukuba kukho i-tin slag kunye neentsalela ze-welding phakathi kwezikhonkwane ezikufutshane ze-chip. Okwesibini, ukusilela kohlalutyo lwemveliso, kufumanise ukuba ukusilela kwesipin chip chip okufutshane kushushu. Jonga ilayibrari yephakeji esemgangathweni ye-IPC 7351, uyilo lwephedi yoncedo yi-1.2mm * 0.3mm, uyilo lwephedi yebhloko yi-1.3 * 0.4mm, kwaye umgama osembindini phakathi kweephedi ezikufutshane yi-0.65mm. Ngoyilo olungentla apha, ubungakanani be-welding ye-unilateral ye-0.05mm iyahlangabezana neemfuno zetekhnoloji yokulungisa i-PCB, kunye nobukhulu be-welding esikufutshane phakathi kwe-0.25mm iyahlangabezana neemfuno zetekhnoloji ye-bridge ye-welding. Ukunyusa uyilo olungafunekiyo kwibhulorho ye-welding kunokunciphisa kakhulu umngcipheko womgangatho we-welding, ukuze kuphuculwe ukuthembeka kweemveliso. Ububanzi bephedi yokuncedisa iwelding bubhedu obunqunywe, kwaye ubungakanani bephedi yokuxhathisa buhlengahlengiswa. Qinisekisa ukuba umda phakathi kweephedi ezimbini zesixhobo ungaphezulu kwe-0.2mm kwaye umda phakathi kweephedi ezimbini zesixhobo mkhulu kune-0.1mm. Ubude beepads zeepads ezimbini zihlala zingatshintshanga. Uyakwazi ukuhlangabezana nemfuneko manufacturability of ukumelana PCB welding uyilo ipleyiti enye window. Ukujonga iiphedi ezikhankanywe apha ngasentla, iphedi kunye nokuyilwa kokudibanisa ukuwelda kulungisiwe siskimu esingentla. Isithuba somda weepads ezikufutshane sikhulu kune-0.2mm, kwaye isithuba somda weepads zokumelana ne-welding sikhulu kune-0.1mm, esinokuhlangabezana neemfuno zenkqubo yokuvelisa ibhulorho yokuxhathisa. Emva kokusebenzisa uyilo lokumelana nokuwelda kuyilo lwe-PCB LAYOUT kunye noyilo lobunjineli be-PCB, cwangcisa ukuphinda usebenzise inani elifanayo le-PCB, kwaye ugqibezele imveliso yokunyuka ngokwenkqubo efanayo.