Ngokuthuthuka okusheshayo kobuchwepheshe besimanje be-elekthronikhi, PCBA ibuye ithuthuke iye ekumeni okuphezulu nasekuthembekeni okuphezulu. Yize i-PCB yamanje ne-PCBA level technology technology ithuthukiswe kakhulu, inqubo ejwayelekile ye-PCB welding ngeke ibulale umkhiqizo. Kodwa-ke, kumadivayisi anezikhala ezincane kakhulu zepini, umklamo ongenangqondo we-PCB welding pad kanye ne-PCB block pad kuzokhuphula ubunzima benqubo yokushisela i-SMT futhi kwandise ubungozi bekhwalithi bokucutshungulwa kwe-PCBA surface mount.

Ngenxa yezinkinga ezingaba khona zokwenziwa nokwethenjelwa okubangelwe ukwakheka okungenangqondo kwephedi yokushisela ye-PCB kanye nephedi yokuvimba, izinkinga zokukhiqiza zingagwenywa ngokuqhakambisa ukwakheka kokufakwa kwensimbi kususelwa enqubeni yenqubo yangempela ye-PCB ne-PCBA. Ukwakhiwa kokuqamba ikakhulukazi okuvela ezicini ezimbili, okokuqala, ukwakheka kokusebenziseka kwe-PCB LAYOUT; Okwesibili, i-PCB design optimization design. Idizayini yephakheji ngokusho kwelabhulali ejwayelekile yephakeji ye-IPC 7351 futhi ubheke usayizi wephedi onconyiwe kusincazelo sedivayisi. Ngokuklama okusheshayo, onjiniyela be-Layout kufanele bandise usayizi wephedi ngokosayizi onconyiwe wokuguqula ukwakheka. Ubude nobubanzi bephedi yokushisela i-PCB kufanele benyuswe ngo-0.1mm, futhi ubude nobubanzi bephedi yokuvikela i-block kufanele benyuswe ngo-0.1mm ngesisekelo sephedi yokushisela. Inqubo evamile yokushisela i-PCB idinga ukuthi onqenqemeni lwephedi kufanele lumbozwe ngu-0.05mm, futhi ibhuloho eliphakathi kwamapayipi amabili kufanele libe likhulu kuno-0.1mm. Esigabeni sokuklama sobunjiniyela be-PCB, lapho usayizi wamaphakethe we-solder ungeke ulungiselelwe futhi ibhuloho eliphakathi nendawo le-solder phakathi kwamapayipi amabili lingaphansi kuka-0.1mm, ubunjiniyela be-PCB busebenzisa ukwelashwa kokuklama kwewindows plate. Lapho isikhala esinqenqemeni sepedi sikhulu kune-0.2mm pad, ngokuya ngomklamo ojwayelekile wokupakisha wephedi; Lapho ibanga phakathi kwemiphetho yamapayipi amabili lingaphansi kuka-0.2mm, ukwakheka kokusebenza kwe-DFM kuyadingeka. Indlela yokuklama yokwenza kahle ye-DFM iyasiza ekwandiseni usayizi wamapayipi. Qinisekisa ukuthi ukuguquguquka kokunamathisela ngomthofu kumgudu wokufaka izinsimbi kungakha isithiyo esincane lapho kwenziwa i-PCB. Lapho ibanga onqenqemeni phakathi kwamapayipi amabili likhulu kune-0.2mm, umklamo wobunjiniyela uzokwenziwa ngokuya ngezidingo ezivamile; Lapho ibanga phakathi kwemiphetho yamapayipi amabili lingaphansi kuka-0.2mm, ukwakhiwa kwe-DFM kuyadingeka. Indlela ye-DFM yomklamo wobunjiniyela ifaka phakathi ukwakheka kokuklanywa kwesendlalelo sokumelana nokushisela nensimbi yethusi yensimbi yosizo lokushisela. Usayizi wokusika ithusi kufanele ubhekise kokucacisiwe kwedivayisi. Iphedi yokusika ithusi kufanele ibe ngaphakathi kobubanzi besayizi yomklamo onconyiwe wephedi, futhi ukwakheka kwe-Welding welding kufanele kube ukwakheka kwewindi okukodwa, okungukuthi, ibhuloho lokuvimba lingambozwa phakathi kwamaphakethe. Qinisekisa ukuthi enqubeni yokukhiqiza ye-PCBA, kunebhuloho lokuvimba le-welding phakathi kwamapayipi amabili lokuzihlukanisa, ukugwema ukushisela izinkinga zekhwalithi yokubukeka nezinkinga zokwethenjelwa kokusebenza kukagesi. Welding ukumelana ifilimu inqubo Welding inhlangano ingavimbela ngempumelelo Welding ibhuloho uxhumano iDemo, ngoba high-ukuminyana PCB nge emihle Isikhala izikhonkwane, uma evulekile Welding ibhuloho phakathi izikhonkwane isodwa, PCBA ukucutshungulwa isitshalo abakwazi ukuqinisekisa izinga Welding wendawo umkhiqizo. Okwe-PCB okuhlukaniswe ngokushisela okuvulekileyo kwezikhonkwane eziphakeme kakhulu nezikhala ezinhle, ifektri yamanje yokukhiqiza ye-PCBA inquma ukuthi into engenayo ye-PCB inephutha futhi ayikuvumeli ukukhiqizwa kwe-inthanethi. Ukugwema ubungozi bekhwalithi, ifektri yokukhiqiza ye-PCBA ngeke iqinisekise ikhwalithi yokushisela kwemikhiqizo uma ikhasimende liphikelela ukubeka imikhiqizo online. Kubikezelwa ukuthi izinkinga zekhwalithi zokushisela enqubeni yokukhiqiza yefektri ye-PCBA kuzobhekwana nazo ngokuxoxisana.

Ucwaningo lwesigameko:

Usayizi wencwadi ecacisiwe wedivayisi, isikhala sesikhungo sephini yedivayisi: 0.65mm, ububanzi bepini: 0.2 ~ 0.4mm, ubude bepini: 0.3 ~ 0.5mm. Usayizi wephedi le-solder ngu-0.8 * 0.5mm, ubukhulu be-solder pad bungu-0.9 * 0.6mm, isikhala esiphakathi kwephedi yedivayisi singu-0.65mm, isikhala esinqenqemeni sephedi le-solder lingu-0.15mm, isikhala esinqenqemeni sephedi ye-solder 0.05mm, nobubanzi be-unilateral solder pad banda nge-0.05mm. Ngokwedizayini ejwayelekile yobunjiniyela be-welding, ubukhulu bephedi yokuxhuma eyodwa kufanele bube bukhulu kunosayizi wephedi yokushisela engu-0.05mm, ngaphandle kwalokho kuzoba nengozi yokugeleza kwe-welding okumboza iphedi lokushisela. Njengoba kukhonjisiwe kuMdwebo 5, ububanzi bensimbi engxenyeni eyodwa ingu-0.05mm, ehlangabezana nezidingo zokukhiqizwa kokushisela nokucubungula. Kodwa-ke, ibanga eliphakathi kwemiphetho yamapayipi amabili lingama-0.05mm kuphela, angahlangabezani nezidingo zobuchwepheshe zebhuloho lokushisela eliphansi lokumelana. Umklamo wobunjiniyela udizayina ngqo wonke umugqa wokuklanywa kwe-chip pin eqenjini le-welding plate design. Yenza ibhodi bese uqedela i-SMT patch ngokusho kobunjiniyela bokudingeka. Ngokuhlolwa komsebenzi, isilinganiso sokuhluleka kwe-welding se-chip singaphezu kwama-50%. Futhi ngokuhlolwa komjikelezo wokushisa, futhi kungabukisa ngaphezu kwe-5% yesilinganiso esingalungile. Okukhethwa kuqala ukuhlaziya ukubonakala kwensimbi (ingilazi yokukhulisa izikhathi eziphindwe ka-20), futhi kutholakala ukuthi kukhona izinsalela zethini nezinsalela zokushisela phakathi kwezikhonkwane eziseduze ze-chip. Okwesibili, ukwehluleka kokuhlaziywa komkhiqizo, kutholakale ukuthi ukwehluleka kwesekethe elifushane le-chip pin kushile. Bheka umtapo wezincwadi ojwayelekile we-IPC 7351, ukwakheka kwephedi yosizo kungu-1.2mm * 0.3mm, ukwakheka kwephedi yokuvimba kungu-1.3 * 0.4mm, kanti ibanga lesikhungo phakathi kwamaphedi aseduze ngu-0.65mm. Ngomklamo ongenhla, ubukhulu bensimbi eyodwa yokushisela i-0.05mm ihlangabezana nezidingo ze-PCB processing technology, nosayizi wesikhala esiseduze sokushisela onqenqemeni u-0.25mm uhlangabezana nezidingo zobuchwepheshe be-welding bridge. Ukwandisa ukwakheka kokudilizwa kwebhuloho lokushisela kunganciphisa kakhulu ubungozi bekhwalithi ye-welding, ukuze kuthuthukiswe ukuthembeka kwemikhiqizo. Ububanzi bephedi yokusiza yokusiza bunqunywe ngethusi, futhi ubukhulu bephedi yokumelana ne-welding buyalungiswa. Qinisekisa ukuthi umphetho phakathi kwamaphakethe amabili wedivayisi mkhulu kune-0.2mm futhi umphetho phakathi kwamaphakethe amabili wedivayisi mkhulu kune-0.1mm. Ubude bamaphayiphu wamaphakethe amabili ahlala engashintshiwe. Kungaba ukuhlangabezana nemfuneko manufacturability ka PCB ukumelana Welding ipuleti olulodwa iwindi design. Ngokubuka kwamaphakethe ashiwo ngenhla, iphedi kanye nedizayini yokumelana nokushiswa kwenziwa ngohlelo olungenhla. Isikhala sonqenqemeni lwamapayipi aseduze sikhulu kune-0.2mm, futhi isikhala esinqenqemeni samaphayiphu wokumelana nezinsimbi sikhulu kune-0.1mm, esingahlangabezana nezidingo zenqubo yokukhiqiza ibhuloho lokumelana nokuvikela. Ngemuva kokuklama ukuklanywa kokushisela kwe-welding kusuka ku-PCB LAYOUT design kanye ne-PCB engineering design, hlela ukuphinda unikeze inani elifanayo le-PCB, bese uqedela ukukhiqizwa kokufaka ngokuya ngenqubo efanayo.