Hnub no lub PCB substrate substrate is composed of Cooper Foil, Reinforcement, resin and other three main components, but since the Lead Free process began, the fourth powder Fillers have been massively added to the PCB board. Txhawm rau txhim kho qhov kub tsis kam ntawm PCB.

We can think of copper foil as the blood vessels of the human body, used to transport important blood, so that PCB can play the ability of activity; Kev txhawb zog tuaj yeem xav txog tib neeg cov pob txha, siv los txhawb thiab ntxiv dag zog rau PCB yuav tsis poob; Resin, ntawm qhov tod tes, tuaj yeem xav tias yog cov leeg nqaij ntawm tib neeg lub cev, lub hauv paus tseem ceeb ntawm PCB.

Kev siv, tus yam ntxwv thiab teeb meem xav tau kev saib xyuas ntawm plaub daim ntawv PCB tau piav qhia hauv qab no:

1. Copper Ntawv Nyiaj

Hluav Taws Xob Hluav Taws Xob: Lub Circuit Court uas ua hluav taws xob.

Kab teeb liab: tus lej uas xa xov.

Vcc: txheej fais fab mov, ua haujlwm voltage. Lub zog ua haujlwm ntawm cov khoom siv hluav taws xob ntxov tshaj plaws tau teeb tsa ua 12V. Nrog kev hloov pauv ntawm thev naus laus zis thiab qhov yuav tsum tau txuag hluav taws xob, qhov ua haujlwm tau maj mam dhau los ua 5V thiab 3V, thiab tam sim no nws tau maj mam txav mus rau 1V, thiab qhov xav tau ntawm cov ntawv ci tooj liab kuj tau nce thiab siab dua.

GND (Grounding) : Grounding ground. Vcc tuaj yeem xav txog tias yog tus pej thuam dej hauv tsev, thaum peb qhib lub kais, dhau los ntawm cov dej siab (ua haujlwm voltage) yuav muaj dej (hluav taws xob) ntws tawm, vim tias qhov ua haujlwm ntawm cov khoom siv hluav taws xob tau txiav txim siab los ntawm cov khoom siv hluav taws xob; GND yog qhov dej ntws tawm. Tag nrho cov dej uas tau siv lossis tsis tau siv mus rau hauv qhov dej. Txwv tsis pub tus kais dej yuav ntws tawm thiab koj lub tsev yuav nyab.

Tshav Kub Tshav Kub (vim yog Kev Kub Siab Ua Haujlwm): Tshav Kub Kub Dhau. Koj puas tau hnov ​​txog qee qhov CPU kub txaus kom rhaub qe, qhov no tsis yog qhov ntau dhau, feem ntau ntawm cov khoom siv hluav taws xob yuav siv hluav taws xob thiab tsim hluav taws xob, lub sijhawm no xav tau tsim thaj tsam loj ntawm cov ntawv ci tooj liab kom tso cua sov rau saum huab cua sai li sai tau. ua tau, txwv tsis pub tsuas yog tib neeg tsis tuaj yeem tiv taus, txawm tias cov khoom siv hluav taws xob tseem yuav ua raws lub tshuab.

Qhov cuab lub zog.

Thaum xaiv cov cuab yeej txhawb nqa PCB, nws yuav tsum muaj cov yam ntxwv zoo hauv qab no. Most of the PCB reinforcement materials we see are made of GF (Glass Fiber). If you look carefully, the material of Glass Fiber is a little like a very thin fishing line. Because of the following personality advantages, it is often used as the basic material of PCB.

Siab tawv: Ua PCB tsis yooj yim rau deform.

Dimension Stability: Good dimensional Stability.

Low CTE: provides Low “thermal expansion rate” to prevent the circuit contacts inside the PCB from disconnecting and causing failure.

Tsawg Warpage: nrog Tsawg deformation, uas yog, Tsawg phaj khoov, phaj warping.

Modules siab: High Young’s modulus

3. Resin Matrix

Traditional FR4 boards are epoxy-dominated, LF (Lead Free)/HF (Halogen Free) boards are made of a variety of resins and different curing agents, making the cost of LF about 20%, HF about 45%.

HF phaj yooj yim tawg thiab nce dej nqus, tuab thiab phaj loj yog nquag rau CAF, nws yog qhov yuav tsum tau siv qhib daim ntaub, ntaub ntaub tiaj tus, thiab ntxiv dag zog rau cov khoom uas muaj cov dej tsis sib xws.

Cov resins zoo yuav tsum muaj cov xwm txheej hauv qab no:

Zoo Thaum Tshav Kub Kub. Thaum tshav kub kub vuam ob mus rau peb zaug tom qab lub phaj yuav tsis tawg, yog qhov ua kom sov zoo.

Kev Nqes Dej Tsawg: Dej Dej Tsawg. Kev nqus dej yog lub hauv paus tseem ceeb ntawm PCB pawg thawj coj tawg.

Nplaim Qub: Yuav tsum yog nplaim hluav taws.

Peel Lub Zog: Nrog siab “rhuav lub zog”.

Siab Tg: Siab iav lub xeev hloov pauv taw tes. Feem ntau ntawm cov ntaub ntawv uas muaj Tg siab tsis yooj yim nqus dej, thiab qhov laj thawj yooj yim rau tsis tawg lub rooj tsavxwm tsis yog nqus dej, ntau dua Tg siab.

Koj hais tias Toughness yog qhov zoo. Qhov ntau dua qhov tawv, qhov tawg ntawm lub rooj tsavxwm tsawg dua. Kev Nyuaj Siab ntawm lub phaj hu ua “lub zog tawg,” thiab cov khoom siv zoo dua, nws zoo dua tuaj yeem tuaj yeem tiv taus kev cuam tshuam thiab kev puas tsuaj.

Cov khoom siv hluav taws xob: Cov khoom siv Dielectric siab, piv txwv li cov khoom siv insulating.

4. Fillers System (hmoov, muab tub lim)

Nyob rau theem pib ntawm kev siv cov hlau lead, qhov ntsuas kub tsis siab heev, thiab thawj lub rooj tsav xwm PCB tseem tseem tuaj yeem tiv taus. Txij li cov hlau tsis muaj vuam, qhov kub tau nce ntxiv, yog li cov hmoov tau ntxiv rau PCB pawg thawj coj los ua kom PCB muaj zog tiv taus kub.

Fillers yuav tsum tau ua ke ua ntej txhawm rau txhim kho kev tawg thiab kev cog lus.

Zoo Thaum Tshav Kub Kub. Thaum tshav kub kub vuam ob mus rau peb zaug tom qab lub phaj yuav tsis tawg, yog qhov ua kom sov zoo.

Kev Nqes Dej Tsawg: Dej Dej Tsawg. Kev nqus dej yog lub hauv paus tseem ceeb ntawm PCB pawg thawj coj tawg.

Nplaim Qub: Yuav tsum yog nplaim hluav taws.

Siab tawv: Ua PCB tsis yooj yim rau deform.

Low CTE: provides Low “thermal expansion rate” to prevent the circuit contacts inside the PCB from disconnecting and causing failure.

Dimension Stability: Good dimensional Stability.

Tsawg Warpage: nrog Tsawg deformation, uas yog, Tsawg phaj khoov, phaj warping.

Vim yog qhov nruj thiab siab tawv ntawm cov hmoov, PCB drilling nyuaj.

Modulus Siab: Young’s Modulus

Tshav Kub Tshav Kub (vim yog Kev Kub Siab Ua Haujlwm): Tshav Kub Kub Dhau.