Use/characteristics of PCB materials and matters needing attention

Kajeno PCB substrate substrate e entsoe ka Cooper Foil, Reinforcement, resin le likarolo tse ling tse tharo tsa mantlha, empa ho tloha ts’ebetsong ea Lead Free e qalile, phofo ea bone ea Fillers e ekelitsoe ka bongata ho board ea PCB. Ho ntlafatsa mocheso ho hanyetsa PCB.

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Re ka nahana ka foil ea koporo e le methapo ea mali ea ‘mele oa motho, e neng e sebelisoa ho tsamaisa mali a bohlokoa, e le hore PCB e ka bapala bokhoni ba ts’ebetso; Matlafatso a ka nahanoa e le masapo a batho, a sebelisetsoang ho ts’ehetsa le ho matlafatsa PCB e ke ke ea oela fatše; Ka lehlakoreng le leng, lehoakhoa le ka nkoa e le mosifa oa ‘mele oa motho, e leng karolo e ka sehloohong ea PCB.

Ts’ebeliso, litšobotsi le litaba tse hlokang tlhokomelo ea lisebelisoa tsena tse ‘ne tsa PCB li hlalositsoe ka tlase:

1. Foil ea Koporo

Electric Circuit: Potoloho e tsamaisang motlakase.

Mohala oa lets’oao: nomoro e romellang molaetsa.

Vcc: phepelo ea motlakase, motlakase o sebetsang. Matla a sebetsang a lihlahisoa tsa pele tsa elektroniki a ne a behiloe haholo e le 12V. Le ho iphetola ha lintho tsa theknoloji le tlhokahalo ea ho boloka motlakase, gagamalo sebetsa butle-butle e ile ea 5V le 3V, ‘me hona joale e butle-butle ho fallela 1V,’ me tlhokahalo ea foil koporo e boetse e fumana e phahameng le e phahameng.

GND (Grounding) : Grounding ground. Vcc e ka nahanoa joalo ka ha tora ea metsi ka tlung, ha re bula pompo, ka khatello ea metsi (voltage e sebetsang) e tla tsoa metsi (elektroniki), hobane ketso ea likarolo tsa elektroniki e khethoa ke phallo ea lielektrone; GND ke mokelikeli. Metsi ohle a sebelisoang kapa a sa sebelisoeng a theoha ka har’a tsoe. Ho seng joalo pompo e ne e tla lula e nela ebe ntlo ea hau e ka tlala likhohola.

Boipheliso ba mocheso (ka lebaka la Matla a phahameng a mocheso): Phokotso ea mocheso. Na u utloile ka li-CPU tse chesang ka ho lekana ho belisa mahe, sena ha se fetelletsoe, boholo ba likarolo tsa elektroniki li tla ja matla le ho hlahisa mocheso, ka nako ena li hloka ho rala sebaka se seholo sa koporo ea koporo ho lokolla mocheso moeeng hang ha ho ka etsahala, ho seng joalo ha se motho feela ea ke keng a mamella, le likarolo tsa elektroniki le tsona li tla latela mochini.

Matlafatso.

Ha khetha PCB matlafatso tse bonahalang, e lokela ho ba le litšobotsi tse latelang o babatsehang. Boholo ba thepa ea matlafatso ea PCB eo re e bonang e entsoe ka GF (Glass Fiber). Haeba u sheba ka hloko, lisebelisoa tsa Glass Fiber li batla li tšoana le mohala o ts’esaane oa ho ts’oasa lihlapi. Ka lebaka la menyetla e latelang ea botho, hangata e sebelisoa e le thepa ea mantlha ea PCB.

Ho satalla ho phahameng: E ​​etsa hore PCB e se bonolo ho holofala.

Bophahamo ba botsitso: Ho ba le botsitso bo botle.

CTE e tlase: e fana ka “sekhahla sa katoloso ea mocheso” se tlase ho thibela mabitso a balebeli ba potoloho kahare ho PCB hore e khaole ebe e baka ho hloleha.

Tlaase Warpage: le Low deformation, ke hore, Low poleiti kobang, poleiti warping.

Modules e phahameng: Modulus ea Young Young

3. Matsoho a Resin

Traditional FR4 boards are epoxy-dominated, LF (Lead Free)/HF (Halogen Free) boards are made of a variety of resins and different curing agents, making the cost of LF about 20%, HF about 45%.

Letlapa la HF le bonolo ho petsoha le ho eketsa ho monya metsi, poleiti e tenya le e kholo e sekametse ho CAF, ho hlokahala hore ho sebelisoe lesela le bulehileng la fiber, lesela le sephara la fiber, le ho matlafatsa thepa e nang le qoeliso e tšoanang.

Lithaba tse ntle li tlameha ho ba le maemo a latelang:

Khanyetso e Ntle ea Mocheso. Mocheso tjheseletsa makhetlo a mabeli ho isa ho a mararo kamora poleiti e ke ke ea phatloha, ke mocheso o motle oa ho hanyetsa.

Ho monya metsi a tlase: Ho monya metsi a tlase. Ho monya metsi ke sesosa se ka sehloohong sa ho phatloha ha boto ea PCB.

Flame Retardance: E tlameha ho fokotsoa ke lelakabe.

Matla a Peel: Ka “Matla a meokho” a phahameng.

High Tg: Ntlha ea phetoho ea boemo bo phahameng ea khalase. Lisebelisoa tse ngata tse nang le Tg e phahameng ha li bonolo ho monya metsi, mme lebaka la mantlha la ho se phatlohe ha boto ha se ho monya metsi, ho fapana le ho ba le Tg e phahameng.

U itse ho tiea ho monate. Ha boima bo le boholo, boto ha e phatlohe haholo. Thata ea poleiti e bitsoa “matla a ho robeha,” ‘me ha thepa e le betere, e tla khona ho mamella tšusumetso le tšenyo.

Thepa ea motlakase: Matla a phahameng a dielectric, ke hore, li sireletsang serameng.

Sistimi ea Fillers (phofo, filler)

Mothating oa pele oa ho tjheseletsa loto, mocheso o ne o se holimo haholo, ‘me boto ea pele ea PCB e ne e ntse e mamelleha. Ho tloha ka ho etella pele ntle le mocheso, mocheso o ile oa eketseha, ka hona phofo e ile ea eketsoa ho board ea PCB ho etsa hore PCB e mamelle mocheso ka matla.

Li-filler li lokela ho kopanngoa pele ho ntlafatsa ho hasana le ho kopana.

Khanyetso e Ntle ea Mocheso. Mocheso tjheseletsa makhetlo a mabeli ho isa ho a mararo kamora poleiti e ke ke ea phatloha, ke mocheso o motle oa ho hanyetsa.

Ho monya metsi a tlase: Ho monya metsi a tlase. Ho monya metsi ke sesosa se ka sehloohong sa ho phatloha ha boto ea PCB.

Flame Retardance: E tlameha ho fokotsoa ke lelakabe.

Ho satalla ho phahameng: E ​​etsa hore PCB e se bonolo ho holofala.

CTE e tlase: e fana ka “sekhahla sa katoloso ea mocheso” se tlase ho thibela mabitso a balebeli ba potoloho kahare ho PCB hore e khaole ebe e baka ho hloleha.

Bophahamo ba botsitso: Ho ba le botsitso bo botle.

Tlaase Warpage: le Low deformation, ke hore, Low poleiti kobang, poleiti warping.

Ka lebaka la ho se tenyetsehe phahameng le toughness phahameng tsa phofo, ho cheka PCB ke ho le thata.

Modulus High: Modulus e monyane

Boipheliso ba mocheso (ka lebaka la Matla a phahameng a mocheso): Phokotso ea mocheso.