Use/characteristics of PCB materials and matters needing attention

Namhlanje PCB zeendawana zeendawana yenziwe yi Cooper ngefoyile, yomeleza, nentlaka kunye nezinye izinto ezintathu eziphambili, kodwa ukusukela inkqubo Free Lead yaqala, umgubo ezine fillers ziye ngamandla zongezwa kwibhodi PCB. Ukuphucula ubushushu ukumelana PCB.

Sinokucinga ngefoyile yobhedu njengemithambo yegazi yomzimba womntu, esetyenziselwa ukuhambisa igazi elibalulekileyo, ukuze i-PCB idlale isakhono somsebenzi; Ukomeleza kunokucingelwa njengamathambo abantu, asetyenziselwa ukuxhasa nokomeleza i-PCB ayizukuwa; I-Resin, kwelinye icala, inokucingwa njengesihlunu somzimba womntu, eyona nto iphambili kwi-PCB.

Ukusetyenziswa, iimpawu kunye nemicimbi efuna ingqalelo yezi zinto zine ze-PCB zichaziwe apha ngezantsi:

1. Ifoyile yeCopper

Isekethe yombane: Isekethe eqhuba umbane.

Umgca wesiginali: inani elithumela umyalezo.

Vcc: umaleko wonikezelo lwamandla, ombane osebenzayo. Umbane osebenzayo weemveliso zokuqala zekhompyuter ubuninzi babekwa njenge-12V. Ngokuvela kobuchwephesha kunye nemfuno yokonga umbane, i-voltage yokusebenza ngokuthe ngcembe yaba yi-5V kunye ne-3V, kwaye ngoku iya ngokuthe ngcembe isiya kwi-1V, kwaye imfuno yefoyile yobhedu nayo iya isiya phezulu.

GND (Grounding) : Grounding ground. I-Vcc inokucingelwa njengenqaba yamanzi ekhayeni, xa sivula itephu, ngoxinzelelo lwamanzi (amandla ombane) kuya kuba nokuphuma kwamanzi (i-elektroniki), kuba isenzo samalungu e-elektroniki simiselwa kukuhamba kwee-elektroni; I-GND ngumsele. Onke amanzi asetyenzisiweyo okanye angasetyenziswanga aya kulaa manzi. Ngaphandle koko impompo ibiza kuqhubeka nokufunxa kwaye nekhaya lakho liza kukhukula.

Ukutshatyalaliswa kobushushu (ngenxa yokuSebenza okuphezulu kobushushu): Ukusasaza ubushushu. Ngaba ukhe weva nge-CPU eshushu ngokwaneleyo ukubilisa amaqanda, oku akubaxwa, uninzi lwezinto ze-elektroniki ziya kudla amandla kwaye zenze ubushushu, ngeli xesha kufuneka uyile indawo enkulu yobhedu ukuze ikhuphe ubushushu emoyeni ngokukhawuleza kunokwenzeka, ngaphandle koko ayingobantu kuphela abangakwaziyo ukunyamezela, nkqu namalungu e-elektroniki nawo aya kulandela umatshini.

Ukomeleza.

Xa ukhetha izinto zokuqinisa i-PCB, kufuneka ibenezi mpawu zilandelayo. Uninzi lwezinto zokuqinisa ze-PCB esizibonayo zenziwe nge-GF (iFayibha yeGlasi). Ukuba ujonga ngononophelo, imathiriyeli yeGlass Fibre ifana nentambo yokuloba ebhityileyo. Ngenxa yezi zinto zilandelayo zobuntu, ihlala isetyenziswa njengezinto ezisisiseko zePCB.

Ukuqina okuphezulu: Yenza i-PCB ukuba kungabi lula ukuyilungisa.

Uzinzo loDimension: Uzinzo oluhle lobukhulu.

I-CTE ephantsi: ibonelela “ngeqondo lokunyusa i-thermal” elisezantsi ukuthintela abafowunelwa besekethe ngaphakathi kwePCB kunqamko kwaye kubangele ukusilela.

Imfazwe ephantsi: kunye ne-Low deformation, oko kukuthi, ukugoba kweplate ephantsi, ukugoba kweplate.

Iimodyuli eziPhakamileyo: Iimodyuli eziMncinci eziPhakamileyo

3. nentlaka Matrix

Traditional FR4 boards are epoxy-dominated, LF (Lead Free)/HF (Halogen Free) boards are made of a variety of resins and different curing agents, making the cost of LF about 20%, HF about 45%.

Ipleyiti ye-HF kulula ukuyityhoboza kunye nokwandisa ukufunxwa kwamanzi, ipleyiti eshinyeneyo nenkulu ithambekele kwiCAF, kubalulekile ukusebenzisa ilaphu lefayibha evulekileyo, ilaphu lefayibha tyaba, kunye nokomeleza umbandela oqukethe ukuntywiliselwa okufanayo.

Ii-resins ezilungileyo kufuneka zibe nale miqathango ilandelayo:

Ukumelana nobushushu obuhle. Ubushushu ukuwelda amatyeli amabini okanye amathathu emva kokuba ipleyiti ingagqabhuki, kukumelana nobushushu okuhle.

Ukufunxa amanzi amancinci: Ukufunxa amanzi aphantsi. Ukufunxwa kwamanzi ngoyena nobangela wokuqhuma kwebhodi yePCB.

Ukudodobalisa ilangatye: Kufuneka kube kulibazisekile kwiLangatye.

Amandla ePeel: Ngamandla “eenyembezi” aphezulu.

Iphakamileyo yeTg: Indawo yokutshintsha kweglasi ephezulu. Uninzi lwezixhobo ezine-Tg ephezulu akukho lula ukufunxa amanzi, kwaye esona sizathu sokungaqhushumbisi kwebhodi ayisiyiyo ukufunxwa kwamanzi, kunokuba ibe yi-Tg ephezulu.

Uthe ubungqingili bukhulu. Ubunzima bokuqina, kokungaphantsi kokuqhushumba ebhodini. Ukuqina kweplate kuthiwa “kukuqhekeka kwamandla,” kwaye okungcono izinto, kokukhona kuya kuba ngcono ukumelana nefuthe kunye nomonakalo.

Iipropati ze-dielectric: Iipropati eziphezulu zeDielectric, okt izinto zokwambathisa.

4. Inkqubo yokugcwalisa (umgubo, ukuzalisa)

Kwinqanaba lokuqala le-welding ekhokelayo, iqondo lobushushu lalingekho phezulu kakhulu, kwaye ibhodi ye-PCB yoqobo yayisanyamezeleka. Ukususela welding lead-free, ubushushu landa, ngoko umgubo kongezwa kwibhodi PCB ukwenza PCB ukumelana ngamandla lobushushu.

Iifiller kufuneka zidityaniswe kuqala ukuphucula ukusasazeka kunye nokuxinana.