Use/characteristics of PCB materials and matters needing attention

Namuhla PCB i-substrate substrate yakhiwe nge-Cooper Foil, i-Reinforcement, i-resin nezinye izinto ezintathu eziyinhloko, kepha selokhu kwaqala inqubo ye-Lead Free, i-powder yesine ye-Fillers yengezwe kakhulu ebhodini le-PCB. Ukwenza ngcono ukumelana nokushisa kwe-PCB.

Singacabanga ngefilili yethusi njengemithambo yegazi yomzimba womuntu, esetshenziselwa ukuhambisa igazi elibalulekile, ukuze i-PCB idlale ikhono lomsebenzi; Ukuqinisa kungacatshangwa njengamathambo abantu, asetshenziselwa ukuxhasa nokuqinisa i-PCB ngeke iwe phansi; I-resin, ngakolunye uhlangothi, ingacatshangwa njengesihlunu somzimba womuntu, ingxenye eyinhloko ye-PCB.

Ukusetshenziswa, izici nezindaba ezidinga ukunakwa kwalezi zinto ezine ze-PCB zichazwe ngezansi:

1. Ucwecwe Lethusi

Isekethe kagesi: isekethe elihambisa ugesi.

Umugqa wesiginali: inombolo ethumela umlayezo.

I-Vcc: ungqimba lokuphakelwa kwamandla, i-voltage yokusebenza. Amandla kagesi okusebenza emikhiqizo yakudala kagesi abekiwe njenge-12V. Ngokuvela kobuchwepheshe kanye nemfuneko yokonga ugesi, i-voltage esebenza kancane yaba yi-5V ne-3V, futhi manje ihamba kancane iya ku-1V, futhi imfuneko yocingo lwethusi nayo iya ngokuya iphakama.

GND (Grounding) : Grounding ground. I-Vcc ingacatshangwa njengombhoshongo wamanzi ekhaya, lapho sivula umpompi, ngokusebenzisa ingcindezi yamanzi (i-voltage yokusebenza) kuzoba nokuphuma kwamanzi (i-elekthronikhi), ngoba isenzo sezingxenye zikagesi sinqunywa ukuhamba kwama-electron; I-GND ingumsele. Onke amanzi asetshenzisiwe noma angasetshenziswanga aya emseleni. Ngaphandle kwalokho umpompi uzoqhubeka ukhipha futhi ikhaya lakho ligcwale amanzi.

Ukushabalalisa Ukushisa (ngenxa Yokusebenza Okushisayo Okuphezulu): Ukushabalalisa Ukushisa. Uke wezwa ngamanye ama-CPU ashisa ngokwanele ukubilisa amaqanda, lokhu akwenzi ihaba, iningi lezinto ze-elekthronikhi lizodla amandla futhi likhiqize ukushisa, ngalesi sikhathi kudingeka ukuthi kwakhiwe indawo enkulu yocwecwe lwethusi ukukhipha ukushisa emoyeni ngokushesha lapho kungenzeka, ngaphandle kwalokho hhayi umuntu kuphela ongeke akubekezelele, ngisho nezingxenye zikagesi nazo zizolandela umshini.

Ukuqiniswa.

Lapho ukhetha okokuqinisa kwe-PCB, kufanele kube nezici ezinhle kakhulu ezilandelayo. Iningi lezinto zokuqinisa ze-PCB esizibonayo zenziwe nge-GF (Glass Fiber). Uma ubheka ngokucophelela, okokusebenza kwe-Glass Fiber kufana nomugqa wokudoba omncane kakhulu. Ngenxa yezinzuzo zobuntu ezilandelayo, kuvame ukusetshenziswa njengezinto eziyisisekelo ze-PCB.

Ukuqina Okuphezulu: Kwenza i-PCB kungabi lula ukuyikhubaza.

Ukuqina Kobukhulu: Ukuzinza okuhle kobukhulu.

I-CTE ephansi: inikeza okuphansi “isilinganiso sokunwetshwa okushisayo” ukuvimbela oxhumana nabo besekethe abangaphakathi kwe-PCB ukuthi banganqamuki futhi babangele ukwehluleka.

I-Warpage ephansi: nge-deformation ephansi, okungukuthi, i-plate ephansi eguqa, i-plate warping.

Amamojula aphezulu: Imodyuli ephakeme ka-Young

3. I-Resin Matrix

Traditional FR4 boards are epoxy-dominated, LF (Lead Free)/HF (Halogen Free) boards are made of a variety of resins and different curing agents, making the cost of LF about 20%, HF about 45%.

Ipuleti le-HF kulula ukuqhekeka futhi lenyuse ukumuncwa kwamanzi, ipuleti eliwugqinsi futhi elikhulu livame ukuba yi-CAF, kuyadingeka ukusebenzisa indwangu evulekile yefayibha, indwangu yefibre eyisicaba, nokuqinisa impahla equkethe ukucwiliswa okufanayo.

Izinhlaka ezinhle kufanele zibe nale mibandela elandelayo:

Ukumelana Okuhle Kokushisa. Ukushisa okushisayo izikhathi ezimbili kuya kwezintathu ngemuva kokuthi ipuleti lingeke liqhume, kuhle ukumelana nokushisa.

Ukumunca Amanzi Aphansi: Ukumuncwa Kwamanzi Aphansi. Ukumuncwa kwamanzi kuyimbangela enkulu yokuqhuma kwebhodi le-PCB.

I-Flame Retardance: Kumele i-Flame ihlehliswe.

Amandla Peel: Ngamandla “wezinyembezi” aphezulu.

High Tg: ingilazi High isimo inguquko iphuzu. Iningi lezinto ezine-Tg ephezulu akulula ukumunca amanzi, futhi isizathu esiyisisekelo sokungaqhumisi ibhodi akusikho ukumunca amanzi, kunokuba kube yi-Tg ephezulu.

Uthe ukuqina kuhle. Ubunzima obukhulu, lapho ibhodi iqhuma kancane. Ukuqina kwepuleti kubizwa ngokuthi “amandla okuphuka,” futhi uma ngabe impahla ingcono, izokwazi kangcono ukumelana nomthelela nomonakalo.

Izakhiwo ze-dielectric: Izakhiwo eziphezulu ze-Dielectric, okungukuthi izinto zokuvikela.

Uhlelo lwe-Fillers (powder, filler)

Esigabeni sokuqala sokushisela ngomthofu, izinga lokushisa belingaphakeme kakhulu, futhi ibhodi lokuqala le-PCB belisabekezeleleka. Kusukela welding lead-free, izinga lokushisa lenyuka, ngakho-ke powder wanezelwa ibhodi PCB ukwenza PCB ukumelana ngokuqinile lokushisa.

Ama-filler kufanele ahlanganiswe kuqala ukwenza ngcono ukusabalalisa nokuxinana.