Use/characteristics of PCB materials and matters needing attention

ʻO kēia lā PCB Hoʻokomo ʻia ka substrate substrate o Cooper Foil, Reinforcement, resin a me nā mea ʻekolu ʻē aʻe, akā mai ka hoʻomaka ʻana o ke kaʻina alakaʻi Free, ua hoʻohui nui ʻia ka ʻehā mau mea hoʻopihapiha i nā papa PCB. E hoʻomaikaʻi i ke kūpaʻa wela o PCB.

Hiki iā mākou ke noʻonoʻo i ka pepa keleawe e like me nā kīʻaha koko o ke kino o ke kanaka, i hoʻohana ʻia e lawe i ke koko nui, i hiki i ka PCB ke pāʻani i ka hiki ke hana; Hiki ke noʻonoʻo ʻia ka hoʻoikaika ʻana ma ke ʻano he iwi kanaka, hoʻohana ʻia e kākoʻo a hoʻoikaika i ka PCB ʻaʻole e hiolo i lalo; ʻO Resin, ma ka ʻaoʻao ʻē aʻe, hiki ke noʻonoʻo ʻia ma ke ʻano he mākala o ke kino o ke kanaka, ka mea nui o PCB.

ʻO nā hoʻohana, nā ʻano a me nā mea e pono ai ka nānā ʻana o kēia mau mea PCB ʻehā i wehewehe ʻia ma lalo:

1. Pā pepa keleawe

Kaapuni Uila: he Kaapuni e alakaʻi i ka uila.

Laina hōʻailona: kahi helu e hoʻouna i kahi leka.

Vcc: ka lako lako mana, ka uila hana. ʻO ka volta hana o nā huahana uila mua loa i hoʻonohonoho ʻia ma ke ʻano he 12V. Me ka loli o ka ʻenehana a me ke koi o ka mālama uila, ua lilo ka volta hana i 5V a me 3V, a i kēia manawa ke neʻe nei i 1V, a ke piʻi aʻe nei hoʻi ke koi o ka pepa keleawe.

GND (Grounding) : Grounding ground. Hiki ke noʻonoʻo ʻia ʻo Vcc e like me ka hale kiaʻi wai i ka home, ke wehe mākou i ka piula, ma o ke kaomi wai (voltage hana) e kahe ka wai (uila), no ka mea, hoʻoholo ʻia ka hana o nā ʻāpana uila e ke kahe o nā uila; He ʻauwai kahi GND. ʻO ka wai i hoʻohana ʻia a hoʻohana ʻole ʻia paha e iho i lalo i ke kahawai. Inā ʻaʻole e hoʻomau ka kahe a kahe ka wai i kou home.

Heat Dissipation (ma muli o ke kiʻekiʻe o ke ʻano Conductivity): Ka haʻalele ʻana i ka wela. Ua lohe paha ʻoe i kekahi CPU lawa ka wela e hoʻolapalapa nā hua, ʻaʻole hoʻonui ʻia kēia, ʻo ka hapa nui o nā mea uila e hoʻopau i ka ikehu a hana i ka wela, i kēia manawa pono e hoʻolālā i kahi nui o nā pepa keleawe e hoʻokuʻu i ka wela i ka lewa ke loaʻa koke hiki, a i ʻole ʻaʻole hiki i ke kanaka wale ke hoʻomanawanui, ʻo nā wahi uila kekahi e ukali pū i ka mīkini.

Hoʻoikaika.

Ke koho ʻana i nā mea hoʻoikaika PCB, pono ke loaʻa i kēia mau hiʻohiʻona maikaʻi loa. Most of the PCB reinforcement materials we see are made of GF (Glass Fiber). If you look carefully, the material of Glass Fiber is a little like a very thin fishing line. Because of the following personality advantages, it is often used as the basic material of PCB.

ʻOʻoleʻa kiʻekiʻe: hana maʻalahi ʻole PCB e hoʻololi.

Kūlana Ana: ʻO ke kūlana Dimensional maikaʻi.

CTE haʻahaʻa: hāʻawi i ka haʻahaʻa o ka “rate hoʻonui pāhana” e pale ai i nā hoʻopili kaapuni i loko o ka PCB mai ka hemo ʻana a me ke kumu o ka holo pono ʻole.

ʻO Warpage haʻahaʻa: me ka hoʻoliʻiliʻi haʻahaʻa, ʻo ia hoʻi, ke pelu ʻana o ka papa haʻahaʻa, ka pelaha ʻana i ka pā.

Nā Kaulike Kiʻekiʻena: modulus o High Young

3. Pālua kēpau

Traditional FR4 boards are epoxy-dominated, LF (Lead Free)/HF (Halogen Free) boards are made of a variety of resins and different curing agents, making the cost of LF about 20%, HF about 45%.

Maʻalahi ka palu HF e haki a hoʻonui i ka lawe ʻana o ka wai, maʻalahi ka CAF i ka mānoanoa a me ka pā nui, pono e hoʻohana i ka lole olonā hāmama, ka lole olonā pālahalaha, a hoʻoikaika i nā mea i komo i loko o ka wai like.

Pono nā resins maikaʻi i kēia mau ʻano:

ʻO ke kūpaʻa wela maikaʻi. ʻO ka wili wela ʻelua a ʻekolu paha mau manawa ma hope o ka haki ʻole o ka pā, maikaʻi ke kūpaʻa wela.

Hōʻemi wai haʻahaʻa: Hōʻemi wai haʻahaʻa. ʻO ka omo wai ka kumu nui o ka pahū papa PCB.

ʻO ka pale ʻana i ka lapalapa ahi: pono e hoʻopau ʻia ka lapalapa.

Ka ikaika Peel: Me ka “ikaika haehae” kiʻekiʻe.

Tg kiʻekiʻe: Kahi kiʻekiʻe o ke aniani mokuʻāina. ʻAʻole maʻalahi ka hapa nui o nā mea me ke kiʻekiʻe Tg i ke komo ʻana i ka wai, a ʻo ke kumu kumu no ka pahū ʻole ʻana i ka papa ʻaʻole ia e lawe i ka wai, ma mua o Tg kiʻekiʻe.

ʻLelo ʻoe he mea nui ka Toughness. ʻO ka ʻoi aku ka paʻakikī, ʻo ka liʻiliʻi o ka pahū. Kapa ʻia ka ʻāʻī o ka pā i “ka haʻihaʻi o ka haki,” aʻo ka maikaʻi o nā mea, ʻo ka ʻoi aku ka maikaʻi o ka hiki ke kū i ka hopena a me ka hōʻino.

Nā waiwai dielectric: nā waiwai Dielectric kiʻekiʻe, ʻo ia hoʻi nā mea insulate.

4. Pūnaewele Hoʻopiha (pauka, mea hoʻopihapiha)

I ka wā mua o ke kuʻihao kēpau, ʻaʻole kiʻekiʻe ke kiʻekiʻe o ka mahana, a hiki ke hāpai ʻia ka papa PCB kumu. Mai ka wili ʻole ʻana kēpau, hoʻonui ka mahana, no laila ua hoʻohui ʻia ka pauka i ka papa PCB e kū ikaika i ka PCB i ka mahana.

Hoʻopili mua ʻia nā mea hoʻopihapiha e hoʻomaikaʻi i ka hoʻopuehu a me ka compactness.