PCB counter-copy board countermeasures

PCB ibhodi ibhodi ukuphunyezwa inkqubo yokuphunyezwa ngokwemiqathango elula, kukuqala ukuskena iibhodi zesekethe ikopi yebhodi, ukurekhoda iinkcukacha zamacandelo, kunye namacandelo asusiweyo ukwenza uluhlu lwezinto (BOM) kwaye ulungelelanise ukuthengwa kwezinto, umfanekiso wepleyiti engenanto iskenwa kwi-software processing. buyela kwifayile yomfanekiso webhodi yekopi yePCB, emva koko uthumele ifayile yePCB kumzi-mveliso wokwenza ipleyiti, Emva kokuba ibhodi yenziwe, izinto ezithengiweyo ziya kufakwa nge-welding kwibhodi ye-PCB eyenziwe, kwaye emva kokuvavanywa kwe-PCB kunye nokulungiswa kwe-debugging.

Amanyathelo athile ebhodi yokukopa yePCB:

Inyathelo lokuqala, fumana i-PCB, okokuqala ephepheni ukurekhoda onke amacandelo emodeli, iiparameter kunye nokuma, ngakumbi i-diode, ulwalathiso lombhobho amathathu, ulwalathiso lwe-IC. Kukulungele ukuthatha imifanekiso emibini yesimo se-ski ngekhamera yedijithali. Ngoku ibhodi yesekethe yePCB iqhubela phambili nangaphezulu ngaphezulu kwe-diode triode ezinye azihoyi ngokungaboni.

Isinyathelo sesibini, susa zonke iindawo zokukopisha ibhodi ye-multilayer, kwaye ususe i-tin kumngxuma we-PAD. Coca i-PCB ngotywala kwaye uyibeke kwiskena eskena iipikseli eziphakamileyo kancinci ukuze ufumane umfanekiso obukhali. Emva koko, polisha amanqwanqwa aphezulu kunye nezantsi kancinci ngephepha lomsonto wamanzi de ifilimu yobhedu ikhanye. Beka kwi-scanner, qalisa i-PHOTOSHOP, kwaye uhlambe iindawo ezihlukeneyo ngombala. Qaphela ukuba i-PCB kufuneka ibekwe ngokuthe tye kwaye ngokuthe nkqo kwiskena, kungenjalo umfanekiso ovavanyiweyo awunakusetyenziswa.

Inyathelo lesithathu, lungelelanisa umahluko kunye nomthunzi we-tovas, ukuze indawo ngefilimu yobhedu kunye nenxalenye ngaphandle kobhedu lwefilimu ngokungafaniyo, emva koko ujike umhlathana ube mnyama nomhlophe, jonga ukuba imigca icacile, ukuba akunjalo, phinda eli nyathelo. Ukuba icacile, gcina umfanekiso njengombala omnyama nomhlophe wefayile yeBMP top.bmp kunye bot.bmp. Ukuba kukho ingxaki ngomfanekiso, ungasebenzisa iPHEPHOPHOP ukuwulungisa nokulungisa.

Inyathelo lesine kukuguqula iifayile ezimbini ze-BMP zibe ziifayile ze-PROTEL ngokwahlukeneyo, kwaye ugqithise maleko mabini kwiPROTEL. Umzekelo, izikhundla ze-PAD kunye ne-VIA ezidlulile kumanqanaba amabini ngokuhambelana, zibonisa ukuba amanyathelo angaphambili enziwe kakuhle. Ukuba kukho nakuphi na ukuphambuka, phinda inyathelo lesithathu. Ke ngoko, ukukopisha ibhodi ye-PCB ngumsebenzi onomonde kakhulu, kuba ingxaki encinci iya kuchaphazela umgangatho kunye nenqanaba lokuthelekisa emva kokukopa kwebhodi.

Inyathelo 5, guqula TOP umaleko we-BMP uye kwi-TOP.PCB, qiniseka ukuguqula umaleko we-SILK, lo ngumaleko otyheli, emva koko ulandele umgca kwilayini ephezulu, kwaye ubeke isixhobo ngokomzobo wenyathelo 2. Cima umaleko weSILK emva kokupeyinta. Phinda ude ubekhona kuzo zonke izaleko.

Inyathelo 6, kwiPROTEL, tsalela umnxeba ngaphezulu. I-PCB kunye ne-bot. I-PCB, kwaye uzidibanise zibe mfanekiso mnye.

Inyathelo 7, sebenzisa umshicileli we-laser ukuprinta i-TOP LAYER kunye ne-BOTTOM LAYER kwifilimu ebonakalayo (1: 1 ratio), beka ifilimu kuloo PCB kwaye uthelekise ukuba ayilunganga, ukuba ilungile, ugqibile.

Ikopi yebhodi yoqobo yenziwe, kodwa yayenziwe ngesiqingatha kuphela. Yiba novavanyo nokuba, ukusebenza kwetekhnoloji ye-elektroniki kuvavanyo lwebhodi yokukopa kuyafana nebhodi yoqobo. Ukuba iyafana ke yenzekile.

sokumakishwa: Ukuba yibhodi enemigangatho emininzi kodwa ikwalungiswe ngononophelo ngaphakathi kumaleko angaphakathi, kwangaxeshanye phinda inyathelo lesithathu ukuya kwesihlanu lokukopa amanyathelo ebhodi, ewe, imifanekiso yemifanekiso yahlukile, ngokwe Inani leendlela zokuthatha isigqibo, ibhodi yokukopisha iphaneli ephindwe kabini ilula kakhulu kunebhodi yemigangatho emininzi, ibhodi yokukopa eyahlukeneyo ilungele ukungalungelelaniswa, Ke ibhodi yekopi yeebhodi ezininzi ikhathalela ngakumbi kwaye inyamekile (ngaphakathi kungena ngomngxunya hayi ngomngxunya kulungele iingxaki).

Ukukopa iphaneli kabini:

1. Skena umaleko ophezulu nangaphantsi webhodi yesekethe kwaye ugcine imifanekiso emibini ye-BMP.

2. Vula ikopi yesoftware QuickPC 2005, nqakraza “Ifayile” “Vula isiseko”, vula umfanekiso wokuskena. Yandisa isikrini nge-PAGEUP, bona iphedi, beka iphedi ngokwe-PP, jonga umgca ngokolayini we-PT …… Njengomzobo womntwana, zobe kwisoftware kwaye ucofe u “Gcina” ukwenza ifayile yeB2P.

3. Cofa u “Fayile” kunye no “Vula iMephu yeSiseko” ukuvula imephu yombala wokuskena kolunye uluhlu;

4. Cofa u- “File” no- “Open” ukuvula ifayile ebigcinwe ngaphambili ye-B2P. Siyabona ukuba ibhodi esandula ukukopishwa iphakanyisiwe kulo mfanekiso-ibhodi enye ye-PCB enemingxunya kwindawo enye, kodwa unxibelelwano lwesekethe lwahlukile. Ke sicinezela “uKhetho” – “Useto lweLayer” ukucima umboniso ophezulu kunye nesilika screen apha, sishiya kuphela iindawo ezininzi zemingxunya.

5. Umngxuma ongasentla ukwindawo efanayo nomngxuma kumfanekiso ongezantsi. Ngoku sinokulanda umgca ongezantsi njengoko sasisenza ebuntwaneni. Cofa u “Gcina” kwakhona – ifayile ye-B2P ngoku inayo idatha kumanqanaba aphezulu nasezantsi.

6. Cofa “ifayile” “Thumela ngaphandle kwifayile ye-PCB”, unokufumana ifayile ye-PCB enemigangatho emibini yedatha, unokutshintsha ibhodi okanye umzobo we-schematic okanye uthumele ngokuthe ngqo kwi-PCB plate factory ukuvelisa indlela yokukhuphela ibhodi ye-multilayer:

Ngapha koko, ibhodi yebhodi ezine ikopi iphindaphindwe ikopi yeepaneli ezimbini eziphindwe kabini, ezintandathu ziphindwe kabini ikopi iphindwe kabini iipaneli …… Imigangatho iyothusa kuba asiziboni iintambo ngaphakathi. Ibhodi ebanzi ephucukileyo, siyibona njani indalo yangaphakathi? – ezahluliweyo.

Ngoku zininzi iindlela zokwenza umaleko, kukho ukubola komhlwa, isixhobo esikhululayo, kodwa kulula ukugcoba kakhulu, ukulahleka kwedatha. Amava asixelela ukuba iphepha lesandpaper lelona lichanekileyo.

Xa sigqiba ukukopa umaleko ophezulu nowezantsi we-PCB, sihlala sisebenzisa i-sandpaper ukucola umaleko womgangatho kwaye sibonise umaleko wangaphakathi. Isandpaper yi-sandpaper eqhelekileyo ethengiswa kwivenkile yehardware, ihlala ibekwa kwi-PCB, emva koko ibambe isandpaper, ngokulinganayo ihlikihlwe kwi-PCB (ukuba ibhodi incinci, nayo ingabekwa kwi-sandpaper, ngomnwe omnye wokubamba i-PCB kukhuhlwano lwesandpaper). Inqaku kukuyilungelelanisa ukuze ilingane.

Isikrini sesilika kunye neoyile eluhlaza ngokubanzi ziyacinywa, ucingo lobhedu kunye nolusu lobhedu kufuneka zisulwe amatyeli aliqela. Ukuthetha nje ngokubanzi, ibhodi yeBluetooth inokucinywa kwimizuzu embalwa, malunga nenkumbulo yemizuzu elishumi; Ewe ngamandla amakhulu, kuthatha ixesha elincinci; Amandla eentyatyambo aya kuba nexesha elingaphezulu.

Isingqengqelo sesona sisicwangciso sixhaphakileyo esisetyenzisiweyo kulwabiwo okwangoku, kodwa nolona luqoqosho lukhulu. Singafumana iPCB elahliweyo ukuzama. Enyanisweni, akukho nzima ngokobuchwepheshe ukugaya ibhodi, kodwa kuyadika. Kuthatha umgudu othile, kwaye akukho mfuneko yakukhathazeka malunga nokusila ibhodi kwiminwe yakho.

Uphononongo lwesiphumo somzobo wePCB

Kwinkqubo yoyilo lwePCB, emva kokugqitywa koyilo lwesistim, umzobo wePCB kufuneka uqwalaselwe kwakhona ukuze kubonwe ukuba ubume benkqubo bufanelekile na nokuba isiphumo esisiso sinokufezekiswa. Ngokuqhelekileyo inokuphononongwa kule miba ilandelayo:

1. Ingaba i-system layout inokuqinisekisa i-wiring efanelekileyo okanye efanelekileyo, ingaba inokuqinisekisa i-wiring ethembekileyo, ingaba inokuqinisekisa ukuthembeka komsebenzi wesekethe. Ngethuba lokucwangcisa, kufuneka ube nokuqonda ngokubanzi kunye nokucwangciswa kwesalathiso somqondiso kunye namandla kunye nomhlaba womnatha.

2. Ingaba ubungakanani bebhodi eprintiweyo iyahambelana nobukhulu bemizobo yokucubungula, ingaba iyahlangabezana neemfuno zenkqubo yokuvelisa i-PCB, nokuba kukho iimpawu zokuziphatha. Eli nqaku lifuna ingqalelo ekhethekileyo, ezininzi ze-PCB zesekethe kunye ne-wiring ziyilwe kakuhle kakhulu, ingqiqo, kodwa ingayihoyi indawo echanekileyo yokudibanisa indawo, okubangela ukuyilwa kwesekethe ayikwazi ukudibaniswa nezinye iisekethe.

3. Akukho ngquzulwano phakathi kwamacandelo akwisithuba esine-dimensional ne-three-dimensional. Nika ingqalelo kubukhulu bokwenene besixhobo, ngakumbi ubude besixhobo. Kwi-weld-free layout yecandelo, ukuphakama ngokubanzi akunakudlula i-3mm.

4. Uyilo lwecandelo luxinene kwaye lucwangciswe kakuhle, lucwangciswe kakuhle, nokuba lilaphu lonke. Xa ubeka amacandelo, akufanele sicinge kuphela ulwalathiso kunye nohlobo lweempawu, kunye neendawo ezifuna ingqalelo okanye ukukhuselwa, kodwa kwakhona siqwalasele ukuxinana ngokubanzi koyilo lwesixhobo ukufezekisa ukuxinana okufanayo.

5. Ngaba amacandelo afuna ukutshintshwa rhoqo anokutshintshwa ngokulula? Ngaba ikulungele ukuba iplagi-in ibhodi ifakwe kwisixhobo? Kuyimfuneko ukuqinisekisa ukusebenziseka kunye nokuthembeka kokutshintshwa, ukudibanisa kunye nokufaka amacandelo aguqulwa rhoqo.