PCB copy board technology implementation process in simple terms, is to first scan copy board circuit boards, record the details of the components, and components removed to make material list (BOM) and arrange the material purchasing, empty plate image is scanned into the software processing back into PCB copy board figure file, and then send a PCB file to plate plate making factory, Lẹhin ti a ti ṣe igbimọ naa, awọn paati ti o ra yoo jẹ welded si igbimọ PCB ti a ṣe, ati lẹhinna nipasẹ idanwo PCB ati n ṣatunṣe aṣiṣe.

PCB counter-copy board countermeasures

Specific steps of PCB copying board:

Igbesẹ akọkọ, gba PCB kan, ni akọkọ lori iwe lati ṣe igbasilẹ gbogbo awọn paati ti awoṣe, awọn aye, ati ipo, ni pataki diode, itọsọna pipe mẹta, itọsọna ogbontarigi IC. O dara julọ lati ya awọn aworan meji ti ipo siki pẹlu kamẹra oni -nọmba kan. Bayi igbimọ Circuit PCB jẹ ilọsiwaju siwaju ati siwaju sii loke ẹrọ ẹlẹnu meji diẹ ninu awọn ko ṣe akiyesi si nirọrun ko le rii.

The second step, remove all the multilayer board copying parts, and remove the tin in the PAD hole. Wẹ PCB pẹlu oti ati gbe sinu ẹrọ iwoye ti o ṣe awari ni awọn piksẹli ti o ga diẹ lati gba aworan didasilẹ. Lẹhinna, ṣe didan awọn fẹlẹfẹlẹ oke ati isalẹ fẹẹrẹfẹ pẹlu iwe yarn omi titi fiimu idẹ yoo danmeremere. Fi wọn sinu ẹrọ ọlọjẹ, bẹrẹ PHOTOSHOP, ki o fẹlẹ fẹlẹfẹlẹ meji lọtọ ni awọ. Akiyesi pe PCB gbọdọ wa ni gbe nta ati ni inaro ninu ẹrọ iwoye, bibẹẹkọ aworan ti o ṣayẹwo ko le ṣee lo.

Igbesẹ kẹta, ṣatunṣe itansan ati iboji ti kanfasi, nitorinaa apakan pẹlu fiimu idẹ ati apakan laisi fiimu fiimu idẹ ni agbara, ati lẹhinna yi ipin -si dudu ati funfun, ṣayẹwo boya awọn laini ko o, ti ko ba ṣe, tun ṣe igbesẹ yii. Ti o ba jẹ ko o, fi aworan pamọ bi dudu ati funfun awọn faili ọna kika BMP top.bmp ati bot.bmp. Ti iṣoro ba wa pẹlu aworan naa, o le lo PHOTOSHOP lati tunṣe ati tunṣe.

Igbesẹ kẹrin ni lati yi awọn faili BMP meji pada si awọn faili PROTEL lẹsẹsẹ, ati gbe awọn fẹlẹfẹlẹ meji sinu PROTEL. Fun apẹẹrẹ, awọn ipo ti PAD ati VIA ti o ti kọja awọn fẹlẹfẹlẹ meji ni ipilẹ ṣe deede, n tọka pe awọn igbesẹ iṣaaju ti ṣe daradara. Ti iyatọ eyikeyi ba wa, tun igbesẹ kẹta ṣe. Nitorinaa, didaakọ igbimọ PCB jẹ iṣẹ alaisan pupọ, nitori iṣoro kekere kan yoo ni ipa lori didara ati alefa ibaamu lẹhin didaakọ igbimọ.

Igbesẹ 5, yipada BMP TOP Layer si TOP.PCB, rii daju lati yi ipele SILK pada, iyẹn ni fẹlẹfẹlẹ ofeefee, lẹhinna o tọpa laini lori ipele TOP, ki o gbe ẹrọ naa ni ibamu si yiya ti igbesẹ 2. Pa Layer SILK lẹhin kikun. Tun ṣe titi gbogbo awọn fẹlẹfẹlẹ yoo fa.

Igbesẹ 6, ni PROTEL, pe ni oke. PCB ati bot. PCB, ki o darapọ wọn sinu eeya kan.

Igbesẹ 7, lo ẹrọ itẹwe lesa lati tẹ TOP LAYER ati BOTTOM LAYER si fiimu titan (ipin 1: 1), fi fiimu sori PCB yẹn ki o ṣe afiwe ti o ba jẹ aṣiṣe, ti o ba tọ, o ti ṣe.

A ṣẹda ẹda ti igbimọ atilẹba, ṣugbọn o ti ṣe idaji nikan. Ni idanwo paapaa, iṣẹ -ṣiṣe imọ -ẹrọ itanna ti o ṣe idanwo igbimọ ẹda jẹ bakanna bi igbimọ atilẹba. Ti o ba jẹ kanna lẹhinna o ti ṣe gaan.

ifesi: Ti o ba jẹ igbimọ ti ọpọlọpọ-fẹlẹfẹlẹ ṣugbọn tun farabalẹ didan si inu ti fẹlẹfẹlẹ inu, ni akoko kanna tun ṣe kẹta si igbesẹ karun ti didaakọ awọn igbesẹ igbimọ, nitoribẹẹ, awọn aworan ti orukọ yatọ, ni ibamu si nọmba ti awọn fẹlẹfẹlẹ lati pinnu, igbimọ didaakọ gbogboogbo meji ti o rọrun pupọ ju igbimọ olona-fẹlẹfẹlẹ lọ, igbimọ didaakọ ọpọlọpọ-fẹlẹfẹlẹ jẹ aiṣedeede, Nitorinaa ọkọ igbimọ ẹda pupọ lati ṣọra ni pataki ati ṣọra (ti inu nipasẹ iho ati kii ṣe nipasẹ iho jẹ eewu si awọn iṣoro).

Ọna didaakọ nronu meji:

1. Scan the upper and lower layers of the circuit board and save two BMP pictures.

2. Open the copy software QuickPC 2005, click “File” “Open base”, open a scan picture. Mu iboju pọ si pẹlu PAGEUP, wo paadi, gbe paadi ni ibamu si PP, wo laini ni ibamu si laini PT …… Gẹgẹ bi yiya ọmọde, fa ninu sọfitiwia ki o tẹ “Fipamọ” lati ṣe agbejade faili B2P kan.

3. Tẹ “Faili” ati “Open Map Map” lati ṣii maapu awọ ọlọjẹ ti fẹlẹfẹlẹ miiran;

4. Tẹ “Faili” ati “Ṣi” lati ṣii faili B2P ti o ti fipamọ tẹlẹ. A le rii pe igbimọ tuntun ti o dakọ jẹ fifa lori aworan yii – igbimọ PCB kanna pẹlu awọn iho ni ipo kanna, ṣugbọn awọn asopọ Circuit yatọ. Nitorinaa a tẹ “Awọn aṣayan” – “Awọn Eto Layer” lati pa laini oke ifihan ati iboju siliki nibi, nlọ awọn fẹlẹfẹlẹ ọpọ ti awọn iho nikan.

5. The hole on the top is in the same position as the hole on the bottom picture. Now we can trace the line on the bottom as we did in childhood. Tẹ “Fipamọ” lẹẹkansi – faili B2P ni bayi ni data ni awọn ipele oke ati isalẹ.

6. Click “file” “Export to PCB file”, you can get a PCB file with two layers of data, you can change the board or schematic diagram or directly send to PCB plate factory to produce multilayer board copying method:

Ni otitọ, igbimọ ẹda ọkọ mẹrin naa jẹ ẹda daakọ awọn paneli meji meji, mẹfa jẹ tun daakọ awọn paneli meji meji …… Awọn fẹlẹfẹlẹ jẹ ibanujẹ nitori a ko le rii wiwirin inu. Igbimọ multilayer ti o fafa, bawo ni a ṣe rii agbaye inu rẹ? – siwa.

Ni bayi awọn ọna lọpọlọpọ wa lati fẹlẹfẹlẹ, ipata ipọnju wa, fifọ ọpa, ṣugbọn o rọrun lati fẹlẹfẹlẹ pupọ, pipadanu data. Iriri sọ fun wa pe iwe iyanrin jẹ deede julọ.

Nigba ti a ba pari didaakọ oke ati isalẹ ti PCB, a lo igbagbogbo sandpaper lati lọ kuro ni ipele oju -ilẹ ki o ṣafihan fẹlẹfẹlẹ ti inu. Sandpaper jẹ iwe iyanrin lasan ti a ta ni ile itaja ohun elo, nigbagbogbo gbe sori PCB, ati lẹhinna mu iwe iyanrin naa, boṣeyẹ rubbed lori PCB (ti igbimọ naa ba kere, tun le gbe sori sandpaper, pẹlu ika kan lati di PCB mu lori edekoyede sandpaper). Koko -ọrọ ni lati jẹ ki o jẹ ki o jẹ deede.

Iboju siliki ati epo alawọ ewe ni a parun ni gbogbogbo, okun waya idẹ ati awọ idẹ yẹ ki o parun ni igba pupọ. Ni gbogbogbo, igbimọ Bluetooth le parẹ ni iṣẹju diẹ, nipa iranti iṣẹju mẹwa; Nitoribẹẹ, pẹlu agbara nla, o gba akoko ti o dinku; Ododo agbara yoo ni akoko diẹ diẹ sii.

Awo ọlọ jẹ ero ti o wọpọ julọ ti a lo ni isọdi ni lọwọlọwọ, ṣugbọn paapaa eto -ọrọ -aje julọ. We can find a discarded PCB to try. In fact, it is not technically difficult to grind the board, but it is a bit boring. It takes some effort, and there is no need to worry about grinding the board to your fingers.

PCB diagram effect review

In the process of PCB layout, after the system layout is completed, the PCB diagram should be reviewed to see whether the system layout is reasonable and whether the optimal effect can be achieved. It can usually be examined from the following aspects:

1. Whether the system layout can ensure the reasonable or optimal wiring, whether it can ensure the reliable wiring, whether it can ensure the reliability of the circuit work. During the layout, you need to have an overall understanding and planning of the signal direction and the power and ground network.

2. Whether the size of the printed board is consistent with the size of the processing drawings, whether it meets the requirements of PCB manufacturing process, and whether there are behavioral marks. This point needs special attention, many PCB circuit layout and wiring are designed very beautiful, reasonable, but neglect the precise positioning of the positioning connector, resulting in the design of the circuit can not be connected with other circuits.

3. There is no conflict between components in two-dimensional and three-dimensional space. Pay attention to the actual size of the device, especially the height of the device. In the weld-free layout of the component, the height generally cannot exceed 3mm.

4. Component layout is dense and orderly, neatly arranged, whether all cloth. When laying out components, we should not only consider the direction and type of signals, and the areas that need attention or protection, but also consider the overall density of the device layout to achieve uniform density.

5. Can the components that need to be replaced frequently be easily replaced? Is it convenient for the plug-in board to be inserted into the equipment? It is necessary to ensure the convenience and reliability of replacing, connecting and inserting frequently changed components.