Izinyathelo zokuphikisa zebhodi ze-PCB eziphikisayo

PCB ukukopisha inqubo yokusetshenziswa kobuchwepheshe bebhodi ngamagama alula, ukuskena kuqala amabhodi wesekethe webhodi, ukurekhoda imininingwane yezingxenye, kanye nezingxenye ezisusiwe ukwenza uhlu lwezinto ezibonakalayo (BOM) futhi uhlele ukuthengwa kwezinto ezibonakalayo, isithombe sepuleti esingenalutho siskenwa ekucubunguleni isofthiwe. buyela kufayela lesibalo sebhodi lekhophi le-PCB, bese uthumela ifayela le-PCB efektri yokwenza amapuleti, Ngemuva kokuthi ibhodi lenziwe, izingxenye ezithengiwe zizofakwa ebhodini le-PCB elenziwe, bese kuthi ngokuhlolwa kwe-PCB nokulungisa iphutha.

Izinyathelo eziqondile zebhodi lokukopisha le-PCB:

Isinyathelo sokuqala, thola i-PCB, okokuqala ephepheni ukurekhoda zonke izingxenye zemodeli, amapharamitha, kanye nokuma, ikakhulukazi i-diode, isiqondisi samapayipi amathathu, isiqondisi se-IC notch. Kungcono ukuthatha izithombe ezimbili zesimo se-ski ngekhamera yedijithali. Manje ibhodi lesifunda le-PCB selithuthuke kakhulu ngaphezu kwe-diode triode abanye abanaki umane bangaboni.

Isinyathelo sesibili, susa zonke izingxenye zokukopisha zebhodi le-multilayer, bese ukhipha ithini emgodini we-PAD. Hlanza i-PCB ngotshwala bese uyifaka kuskena eskena amaphikseli aphakeme kancane ukuthola isithombe esibukhali. Bese, pholisha izingqimba ezingenhla nezingezansi kancane ngephepha lentambo yamanzi kuze kube yilapho ifilimu yethusi icwebezela. Bafake kuskena, qala i-PHOTOSHOP, bese uxubha izingqimba zombili ngokwehlukana ngombala. Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile ku-scanner, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe.

Isinyathelo sesithathu, lungisa ukugqama nomthunzi wendwangu, ukuze ingxenye enefilimu yethusi nengxenye ngaphandle kokuqhathaniswa kwefilimu yethusi ngokuqinile, bese uphendulela isigatshana kokumnyama nokumhlophe, hlola ukuthi ngabe imigqa icacile, uma kungenjalo, phinda lesi sinyathelo. Uma kucacile, gcina isithombe njengamafomethi wefomethi ye-BMP emnyama namhlophe top.bmp kanye bot.bmp. Uma kunenkinga ngesithombe, ungasebenzisa i-PHOTOSHOP ukuyilungisa nokusilungisa.

Isinyathelo sesine ukuguqula amafayela amabili we-BMP abe amafayela we-PROTEL ngokulandelana, futhi adlulise izingqimba ezimbili zibe yi-PROTEL. Isibonelo, izikhundla ze-PAD ne-VIA ezidlulise lezi zingqimba ezimbili ngokuyisisekelo ziyafana, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma kukhona ukuphambuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopishwa kwebhodi le-PCB kungumsebenzi onesineke kakhulu, ngoba inkinga encane izothinta ikhwalithi kanye nezinga elifanayo ngemuva kokukopisha kwebhodi.

Isinyathelo 5, guqula isendlalelo se-TOP BMP siye ku-TOP.PCB, qiniseka ukuguqula ungqimba lwe-SILK, leso ungqimba oluphuzi, bese ulandela umugqa kusendlalelo se-TOP, bese ubeka idivayisi ngokusho komdwebo wesinyathelo 2. Susa ungqimba lwe-SILK ngemuva kokupenda. Phinda kuze kudwetshwe zonke izendlalelo.

Isinyathelo 6, ku-PROTEL, shayela phezulu. I-PCB ne-bot. I-PCB, bese uwahlanganisa abe munye.

Isinyathelo 7, sebenzisa iphrinta ye-laser ukuphrinta i-TOP LAYER ne-BOTTOM LAYER kwifilimu esobala (1: 1 ratio), faka ifilimu kuleyo PCB bese uqhathanisa uma ingalungile, uma ilungile, usuqedile.

Ikhophi yebhodi lokuqala yadalwa, kepha kwenziwa uhhafu kuphela. Yiba nokuhlolwa, nokusebenza kobuchwepheshe be-elekthronikhi okuhlola ibhodi lokukopisha kuyafana nebhodi lokuqala. Uma kuyefana-ke kusuke sekwenziwe ngempela.

bathi: Uma kuyibhodi enezingqimba eziningi kodwa futhi ipholishwe ngokucophelela ngaphakathi ngaphakathi kwesendlalelo sangaphakathi, ngasikhathi sinye phinda isinyathelo sesithathu kuya kwesesihlanu sokukopisha izinyathelo zebhodi, kunjalo, imidwebo yegama ihlukile, ngokusho inani lezendlalelo okufanele zithathe isinqumo, ibhodi yokukopisha iphaneli ephindwe kabili ilula kakhulu kunebhodi enezendlalelo eziningi, ibhodi lokukopisha elinemigqa eminingi livame ukungahambi kahle, Ngakho-ke ibhodi yamakhophi ebhodi ye-multilayer kufanele iqaphelisise futhi iqaphele (okungaphakathi kwembobo hhayi ngomgodi kuthanda ukuba nezinkinga).

Iphaneli ekopisha indlela:

1. Skena izingqimba ezingenhla nezingezansi zebhodi lesekhethi bese ugcina izithombe ezimbili ze-BMP.

2. Vula isofthiwe yokukopisha i-QuickPC 2005, chofoza okuthi “Fayela” “Isisekelo esivulekile”, vula isithombe sokuskena. Khulisa isikrini nge-PAGEUP, bheka iphedi, beka iphedi ngokuya nge-PP, bona umugqa ngokuya ngomugqa we-PT …… Njengomdwebo wengane, yidonse kusoftware bese uqhafaza ku- “Save” ukwenza ifayili le-B2P.

3. Chofoza u- “File” ne- “Open Base Map” ukuvula ibalazwe lemibala yokuskena yolunye ungqimba;

4. Chofoza u- “File” no- “Open” ukuze uvule ifayela le-B2P ebeligcinwe ngaphambilini. Siyabona ukuthi ibhodi elisanda kukopishwa liphakanyiswe kulesi sithombe – ibhodi elifanayo le-PCB elinezimbobo endaweni efanayo, kepha ukuxhumana kwesifunda kuhlukile. Ngakho-ke sicindezela “Izinketho” – “Izendlalelo Zesendlalelo” ukucisha umugqa ophezulu wokubonisa nesikrini sikasilika lapha, sishiya izingqimba eziningi zemigodi.

5. Imbobo engaphezulu isendaweni efanayo nembobo esesithombeni esingezansi. Manje sesingakwazi ukulandelela umugqa ongezansi njengoba senza ebuntwaneni. Chofoza u- “Save” futhi – ifayela le-B2P manje selinedatha emazingeni aphezulu naphansi.

6. Chofoza “ifayela” “Thekelisa kufayela le-PCB”, ungathola ifayela le-PCB elinezendlalelo ezimbili zedatha, ungashintsha ibhodi noma umdwebo wohlelo noma uthumele ngokuqondile efekthri yepuleti le-PCB ukuze ukhiqize indlela yokukopisha yebhodi lezinhlaka eziningi:

Eqinisweni, amabhodi amakhophi amane ebhodi aphindaphindiwe ukukopisha amaphaneli amabili aphindwe kabili, ayisithupha aphindaphindwa ukukopishwa amapaneli amathathu aphindwe kabili …… Izendlalelo ziyesabeka ngoba asikwazi ukubona izintambo ngaphakathi. Ibhodi elinemicu eminingi eyinkimbinkimbi, siyibona kanjani indawo yonke yayo yangaphakathi? – egqinsiwe.

Manje kunezindlela eziningi zokubeka, kukhona ukugqwala kwe-potion, ukukhishwa kwethuluzi, kepha kulula ukubeka ungqimba kakhulu, ukulahleka kwedatha. Okuhlangenwe nakho kusitshela ukuthi i-sandpaper iyona enembile kunazo zonke.

Lapho siqeda ukukopisha ungqimba ophezulu nangaphansi we-PCB, imvamisa sisebenzisa i-sandpaper ukugaya ungqimba olungaphezulu futhi sikhombise ungqimba lwangaphakathi. I-sandpaper yi-sandpaper ejwayelekile edayiswa esitolo se-hardware, imvamisa ibekwa ku-PCB, bese ibamba i-sandpaper, ngokulinganayo ihlikihliwe ku-PCB (uma ibhodi lincane, futhi lingabekwa ku-sandpaper, ngomunwe owodwa wokubamba i-PCB ku-sandpaper friction). Iphuzu ukuthi ulisheleleze ukuze lilingane.

Isikrini sikasilika namafutha aluhlaza ngokuvamile kuyasulwa, ucingo lwesethusi nesikhumba sethusi kufanele kusulwe kaningana. Ngokuvamile, ibhodi ye-bluetooth ingasulwa ngemizuzu embalwa, inkumbulo yemizuzu eyishumi; Vele, ngamandla amakhulu, kuthatha isikhathi esincane; Imbali yamandla izoba nesikhathi esithe xaxa.

IMill plate wuhlelo olujwayeleke kakhulu olusetshenziswa ekwakheni ibhande njengamanje, kepha futhi lungumnotho kakhulu. Singathola i-PCB elahliwe ukuze siyizame. Eqinisweni, akunzima ngokobuchwepheshe ukugaya ibhodi, kodwa kuyadina kancane. Kuthatha umzamo othile, futhi asikho isidingo sokukhathazeka ngokugaya ibhodi eminweni yakho.

Ukubuyekezwa komphumela womdwebo we-PCB

Enqubweni yokwakheka kwe-PCB, ngemva kokuqedwa kwesakhiwo sohlelo, umdwebo we-PCB kufanele ubuyekezwe ukuze kubonakale ukuthi ingabe ukwakheka kwesistimu kunengqondo kanye nokuthi umphumela olungile ungafinyelelwa yini. Ngokuvamile ingahlolwa kusukela ezicini ezilandelayo:

1. Kungakhathaliseki ukuthi ukuhlelwa kwesistimu kungaqinisekisa i-wiring enengqondo noma efanele, kungakhathaliseki ukuthi ingaqinisekisa i-wiring ethembekile, kungakhathaliseki ukuthi ingaqinisekisa ukwethembeka komsebenzi wesifunda. Ngesikhathi sokuhlela, udinga ukuqonda okuphelele nokuhlela isiqondiso sesignali kanye namandla nenethiwekhi yomhlabathi.

2. Ukuthi usayizi webhodi eliphrintiwe uyahambisana nosayizi wemidwebo ecutshungulwayo, noma ngabe iyahlangabezana yini nezidingo zenqubo yokukhiqiza ye-PCB, nokuthi akhona yini izimpawu zokuziphatha. Leli phuzu lidinga ukunakwa okukhethekile, ukuhlelwa kwesekethe ye-PCB eminingi kanye nezintambo zenzelwe okuhle kakhulu, okunengqondo, kodwa ukunganaki ukuma okuqondile kwesixhumi sokumisa, okuholela ekwakhiweni kwesekethe akukwazi ukuxhunywa nezinye izifunda.

3. Akukho ukungqubuzana phakathi kwezingxenye endaweni enezinhlangothi ezimbili nezintathu. Naka usayizi wangempela wedivayisi, ikakhulukazi ubude bedivayisi. Kusakhiwo esingenayo i-weld sengxenye, ubude ngokuvamile abukwazi ukudlula u-3mm.

4. Ukwakheka kwengxenye kuminyene futhi kuhlelekile, kuhlelwe ngobunono, noma ngabe iyindwangu yonke. Lapho sibeka izingxenye, akufanele sicabangele kuphela isiqondiso nohlobo lwamasignali, nezindawo ezidinga ukunakwa noma ukuvikelwa, kodwa futhi sicabangele ukuminyana okuphelele kwesakhiwo sedivayisi ukuze sifinyelele ukuminyana okufanayo.

5. Ingabe izingxenye ezidinga ukushintshwa njalo zingashintshwa kalula? Ingabe kufanelekile ukuthi i-plug-in board ifakwe emishinini? Kuyadingeka ukuqinisekisa ukunethezeka nokuthembeka kokufaka esikhundleni, ukuxhuma nokufaka izingxenye ezishintshwa njalo.