U primu passu di PCB a produzzione hè di urganizà è verificà u Layout di PCB. U stabilimentu di fabbricazione di PCB riceve i fugliali CAD da a cumpagnia di cuncepimentu PCB. Siccomu ogni software CAD hà u so propiu furmatu di fugliale unicu, a pianta PCB li cunverte in un furmatu unificatu – Extended Gerber RS-274X o Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

In unu di i PCBS fatti in casa, u layout di PCB hè stampatu nantu à carta cù una stampante laser è poi trasferitu à un pannellu rivestitu di rame. Tuttavia, in u prucessu di stampa, perchè a stampante hè propensa à u puntu di interruzzione di carenza di inchiostru, hè necessariu riempie manualmente l’inchiostru cù una penna à oliu.

Una piccula quantità di pruduzzione hè bella, ma se stu difettu hè trasferitu à a produzzione industriale, riduce assai l’efficienza di a produzzione. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Pruduzione core board

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. U PCB di 4 strati hè fattu di manera simile, ma cù una sola placca di core è dui filmi di ramu.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. The film solidifies when exposed to light, forming a protective film over the copper foil of the copper-clad plate.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer uses UV lamp to irradiate the photosensitive film on copper foil. The photosensitive film is solidified under the transparent film, and the photosensitive film is not solidified under the opaque film. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. In the paper PCB layout of the previous laser printer, the black toner was covered with copper foil to be retained. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

U filmu micca guaritu hè tandu lavatu cù lisciu è u circuitu di lamina di rame necessariu hè cupartu da u film guaritu.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Perforazione è ispezione di a piastra di core

A piastra di core hè stata fatta cù successu. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Una volta chì u bordu core hè pressatu cù altri strati di PCB, ùn pò micca esse mudificatu, dunque hè assai impurtante di verificà. A macchina si confronterà automaticamente cù i disegni di layout di PCB per verificà l’errori.

I primi dui strati di tavule PCB sò stati fatti

laminato

Here we need a new raw material called semi-cured sheet (Prepreg), which is the core board and core board (PCB layer number & GT; 4), and the adhesive between the core plate and the outer copper foil, but also plays a role in insulation.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Allora a piastra d’aluminiu pressurizatu hè rimossa. A piastra d’aluminiu ghjoca ancu un rolu in l’isolamentu di diversi PCBS è assicurendu a lamina di rame liscia nantu à u stratu esterno di u PCB. Both sides of the PCB are covered with a layer of smooth copper foil.

forage

How do you connect the four non-touching layers of copper foil together in a PCB? U PCB hè prima foratu attraversu fori, dopu metallizatu per cunduce l’electricità.

A macchina di perforazione à raggi X hè aduprata per situà u bordu di core di u stratu internu. A macchina truverà è localizerà automaticamente a pusizione di u foru nantu à u bordu di core, è poi farà fori di posizionamentu per u PCB per assicurà chì a seguente perforazione sia attraversu u centru di a pusizione di u foru.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Cum’è a perforazione hè un prucessu relativamente lentu, per migliurà l’efficienza, da 1 à 3 schede PCB identiche saranu accatastate inseme per perforazione secondu u numeru di strati PCB. Finally, the top PCB is covered with a layer of aluminum, the top and bottom layers of aluminum so that when the drill drills in and out, the copper foil on the PCB will not tear.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. U foru hè guidatu da a pressione di l’aria, cù una rotazione massima di 150,000 rivoluzioni per minutu, chì hè abbastanza alta per assicurà un muru di foru lisciu.

U rimpiazzamentu di u foru hè ancu fattu automaticamente da a macchina secondu u prugramma. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

In u prucedimentu di laminazione precedente, l’epoxy fusu hè statu extrudutu à l’esternu di u PCB, perciò era necessariu esse rimossu. A fresatrice die taglia a periferia di u PCB secondu e coordinate XY currette.

Precipitazione chimica di ramu nantu à u muru di i pori

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Dunque, u primu passu hè di accumulà un stratu di materiale cunduttivu nantu à u muru di u foru, è formà una pellicula di rame di 1 micron nantu à tutta a superficie di u PCB, cumpresu u muru di u foru, attraversu a deposizione chimica. Tuttu u prucessu, cum’è u trattamentu chimicu è a pulizia, hè cuntrullatu da e macchine.

Fixed PCB

Pulite u PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Ùn ci hè micca film chì pò esse electroplated, è ùn ci hè nimu film, prima di ramu e poi stagnatura. Dopu chì a film hè stata rimossa, a gravure alcalina hè effettuata, è infine u stagnu hè eliminatu. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Riparà u filmu di dispusizione PCB di i strati superiori è inferiori di fotocopia attraversu u foru di pusizionamentu, è mette a tavula PCB à mezu. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Clamp the PCB and electroplate the copper. As mentioned before, in order to ensure that the hole has good electrical conductivity, the copper film electroplated on the hole wall must have a thickness of 25 microns, so the whole system will be automatically controlled by computer to ensure its accuracy.

Fixed PCB

Computer control and electroplating copper

After the copper film is electroplated, the computer arranges for a thin layer of tin to be replated.

After unloading the tin plated PCB board, check to ensure that the thickness of copper and tin plating is correct.

Incisione PCB esterna

Next, a complete automated assembly line completes the etching process. First, clean off the cured film on the PCB board.

A strong alkali is then used to clean off unwanted copper foil that is covered by it.

Allora u revestimentu di stagnu nantu à u fogliu di rame di u layout di PCB hè eliminatu cù una soluzione di spugliatura di stagnu. After cleaning, 4 layers PCB layout is completed.