Ka anu u mua o PCB ʻo ka hana ʻana e hoʻonohonoho a nānā i ka Layout PCB. Loaʻa i ka mea kanu hana PCB nā faila CAD mai ka hui hoʻolālā PCB. Ma muli o kā kēlā me kēia polokalamu CAD i kāna faila faila ʻokoʻa, hoʻohuli ka mea kanu PCB iā lākou i kahi ʻano i hoʻohui ʻia – Extended Gerber RS-274X a i ʻole Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

I kekahi o ka PCBS i hana ʻia i ka home, paʻi ʻia ka ʻōnaehana PCB ma ka pepa me ka hoʻohana ʻana i ka mīkini paʻi laser a laila hoʻololi ʻia i kahi papa kapa keleawe. Eia nō naʻe, i ke kaʻina paʻi, no ka mea ua prone ka mīkini paʻi i ka breakpoint deficit defence, pono e hoʻopihapiha i ka inika me ka peni aila.

Maikaʻi kahi hana liʻiliʻi, akā inā hoʻohuli ʻia kēia hemahema i ka hana ʻoihana, e hoʻoliʻiliʻi nui ia i ka hana pono. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Iecaianoaaiiuo papa

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. Hana like ʻia ka 4-layer PCB, akā me hoʻokahi pā nui a me nā kiʻi keleawe ʻelua.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Hoʻoikaika ke kiʻi ʻoniʻoni ke hōʻike ʻia i ka kukui, e hana ana i kahi kiʻi ʻoniʻoni ma luna o ka pepa keleawe o ka pā keleawe.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Hoʻohana ka Photosensitizer i ke kukui UV e hoʻowali i ke kiʻi paʻi kiʻi ma ka pepa keleawe. Hoʻoikaika ʻia ke kiʻi paʻi kiʻi ma lalo o ke kiʻi aniani moakaka, a ʻaʻole i hoʻokūpaʻa ʻia ke kiʻi paʻi kiʻi ma lalo o ke kiʻi opaque. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. I ka hoʻolālā PCB pepa o ka mīkini paʻi laser ma mua, ua uhi ʻia ke toner ʻeleʻele me ka pepa keleawe e paʻa ai. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

A laila holoi ʻia ke kiʻi ʻoniʻoni ʻole ʻia me ka lilina a uhi ʻia ke aniani keleawe koi ʻia e ka kiʻi hoʻōla.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Haehae i ke kiʻi ʻoniʻoni i hoola ʻia e hōʻike i ka pepa keleawe e pono ai no ka pōʻaiapili hoʻonohonoho PCB.

ʻIli a me ka nānā ʻana i ka una honua

Ua hana kūleʻa ʻia ka pā nui. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Ke kāomi ʻia ka papa nui me nā papa ʻē aʻe o PCB, ʻaʻole hiki ke hoʻololi ʻia, no laila he mea nui e nānā. Hoʻohālikelike ka mīkini me nā kiʻi hoʻonohonoho PCB e nānā i nā hewa.

ʻO nā papa mua ʻelua o nā papa PCB i hana ʻia

lineʻi

Eia mākou e pono ai i kahi mea maka hou i kapa ʻia ka pepa semi-cured (Prepreg), ʻo ia ka papa nui a me ka papa nui (PCB layer number & GT; 4), a me ka mea hoʻopili ma waena o ka pā nui a me ka pepa keleawe waho, akā hana pū kekahi i ka hoʻāpā.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. A laila wehe ʻia ka pā alumini pressurized. Hoʻokani pū ka pā alumini i ka hoʻokaʻawale ʻana i nā PCBS ʻokoʻa a me ka hōʻoia ʻana i ka pepa keleawe melemele ma ka papa waho o KA PCB. Uhi ʻia nā ʻaoʻao ʻelua o ka PCB me kahi papa o ka pepa keleawe keleawe paheʻe.

ʻepekema

Pehea ʻoe e hoʻohui ai i nā ʻehā o nā papa keleawe keleawe ʻole i loko o kahi PCB? Hoʻomaʻu mua ʻia ka PCB ma o nā lua, a laila metallized e alakaʻi i ka uila.

Hoʻohana ʻia ka mīkini ʻeli X-ray e huli i ka papa nui o ka papa o loko. E ʻike a ʻike ka mīkini i ke kūlana puka ma ka papa nui, a laila e hana i nā puka hoʻonohonoho no ka PCB e hōʻoia i ka hoʻoheheʻe ʻana ma waena o ka wahi o ka puka.

Place a sheet of aluminum on the punch machine and then place the PCB on top. ʻOiai he lohi ka hana ʻana o ka ʻeli ʻana, i mea e hoʻomaikaʻi ai i ka pono, e hoʻopili ʻia ʻo 1 i 3 mau papa PCB like no ka perforation e like me ka nui o nā papa PCB. ʻO ka mea hope loa, uhi ʻia ka PCB luna me kahi papa o ka aluminika, ka papa luna a me lalo o ka alumini i hiki ai ke wili ʻia i waho a i waho, ʻaʻole e haehae ka pepa keleawe ma ka PCB.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Hoʻokomo ʻia ka ʻūlū e ka kaomi ea, me ka huli ʻana o 150,000 revolutions i kēlā me kēia minuke, i lawa ke kiʻekiʻe e hōʻoia i ka paia puka ʻoluʻolu.

Hana maʻalahi ʻia ka mea hou o ka ʻeli e ka mīkini e like me ka papahana. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

I ke kaʻina laminating o mua, ua hoʻokuʻu ʻia ka epoxy i hoʻoheheʻe ʻia i waho o ka PCB, no laila pono e hemo. Hoʻokiʻoki ka mīkini wili palaoa make i ka periphery o ka PCB e like me nā koina XY pololei.

ʻO ka hoʻoue ʻana o ke keleawe ma ka paia pore

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. No laila, ʻo ka hana mua e hōʻiliʻili i kahi papa o nā mea conductive ma ka paia o ka lua, a hana i kahi kiʻi keleawe 1-micron ma ka ʻili PCB holoʻokoʻa, me ka paia o ka lua, ma o ka waiho ʻana o ka kemikō. ʻO ke kaʻina holoʻokoʻa, e like me ka mālama lāʻau a me ka hoʻomaʻemaʻe, kaohi ʻia e nā mīkini.

PCB paʻa

E hoʻomaʻemaʻe i ka PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. ʻAʻohe kiʻi ʻoniʻoni hiki ke electroplated, a ʻaʻohe kiʻi ʻoniʻoni, keleawe mua a laila ka plating tin. Ma hope o ka hemo ʻana o ke kiʻi ʻoniʻoni, lawe ʻia ka alkaline etching, a i ka hopena lawe ʻia ka tin. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

E hoʻopaʻa i ke kiʻi ʻoniʻoni PCB o nā papa luna a me lalo o ke kope kope ma o ka puka hoʻonohonoho, a kau i ka papa PCB ma waenakonu. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

E hoʻopaʻa i ka PCB a electroplate i ke keleawe. E like me ka mea i ʻōlelo ʻia ma mua, i mea e hōʻoia ai i ka lawaiʻa maikaʻi o ka uila, pono ke kiʻi ʻoniʻoni keleawe i ka paia puka i ka mānoanoa o 25 microns, no laila e kaomi ʻōnaehana ka ʻōnaehana holoʻokoʻa e hōʻoia i ka pololei.

PCB paʻa

Kaohi kamepiula a me ke keleawe uila

Ma hope o ka electroplated o ke kiʻi keleawe, hoʻonohonoho ka kamepiula no kahi papa o ka tini e hoʻonui hou ʻia.

Ma hope o ka hoʻokuʻu ʻana i ka papa PCB plated tin, e hōʻoia e hōʻoia i ka mānoanoa o ke keleawe a me ke keleawe.

ʻO ke kaha kiʻi PCB waho

A laila, hoʻopau kahi laina hui piha automated i ke kaʻina hana ʻoka. ʻO ka mea mua, hoʻomaʻemaʻe i ke kiʻi i hoola ʻia ma ka papa PCB.

Hoʻohana ʻia kahi alkali ikaika e hoʻomaʻemaʻe i ka pepa keleawe makemake ʻole ʻia e uhi ʻia e ia.

A laila wehe ʻia ka uhi tin ma ka pepa keleawe o ka hoʻolālā PCB me ka hopena tin stripping. After cleaning, 4 layers PCB layout is completed.