Primum gradum in PCB productio est ordinare et deprime PCB propositum. Planta fabricationis PCB accipit tabulas CAD e consilio societatis PCB. Cum uterque programmator CAD suam unicam formam habeat, PCB planta eas ad formam unicam convertit — Gerber RS-274X vel Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

In una e domo facta PCBS, in tabula PCB typis impressa est in charta laseris typographi adhibita, ac deinde ad tabulam aeneam coopertam. Attamen in processu typographico, quia typographus pronus est ad atramentum defectus fracturae, necesse est ut manually atramentum stylo oleo impleat.

Parva copia productionis bona est, sed si hic defectus ad productionem industriae transfertur, efficientiam productionis multum minuet. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Core tabula productio

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. Scapus 4-PCB similiter, sed cum una tantum lamina nucleus et duo membranae aeris.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Pelliculam solidat cum luci obnoxiam formans velum tutelae super bracteam cupream bracteae aeneae.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer utitur lucerna UV ad pelliculam photographicam in ffoyle aenea irradiandam. Pellicula photosensitiva sub velo perspicuo solidatur, et cinematographicum photographicum sub cinematographico opaco non solidatur. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. In charta PCB extensione laseris prioris typographi, nigra toneraria erat, claua aenea retinenda. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

Incuruata pellicula lixivio deinde eluitur, et requiritur circuitus claui aeris curato pellicula tegitur.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Core laminam artem et inspectionem

Media lamina feliciter facta est. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Core tabula cum aliis stratis PCB premitur, mutari non potest, ergo magni momenti est ad reprimendum. Apparatus automatice comparabit cum PCB delineationes ad errores compescendos.

Duo primi ordines PCB tabulae factae sunt

squamosusque

Hic opus est nova materia rudis dicta scheda semi-curata (Prepreg), quae est nucleus tabula et tabula nuclei (PCB iacuit numerus & GT; 4), et tenaces inter laminam nucleum et bractea aenea exteriorem, sed etiam in insulatione partes agit.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Tum lamina pressurized aluminium tollitur. Aluminium laminam etiam in diversis PCBS segregandis munere fungitur et in bracteolae aeris bracteae laevis in tegumento PCB versatur. Utraque PCB teguntur iacuit bracteolae aeris laevi.

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Quomodo coniungis quattuor laminis aeris bracteae non tangentes simul in PCB? PCB per foramina primum perforata, deinde metalla ad electricitatem ducendam.

Machina EXERCITATIO X-radius collocare solebat nucleum tabulae interioris tabulae. Machina statim inveniet et collocabit situm foraminis in nucleo tabulae, et deinde pone foramina in PCB ponendi ut haec exercitatio per centrum positio foraminis sit.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Cum EXERCITATIO est processus relative tardus, ad efficientiam emendandam, 1 ad 3 idem PCB tabulae ad perforationem secundum numerum PCB laminis reclinatae erunt. Summum denique PCB iacuit aluminium tegitur, summo et fundo stratis aluminii ita ut terebra cum in et extra, bracteolae aeris in PCB non disrumpat.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Frenum terebra pressionis aeris inpellitur, cum maxima gyrationis 150,000 revolutionum per minutas, quae satis alta est ad murum cavum lenis curandum est.

Subrogatio frenum exercitii a machina etiam ipso facto secundum propositum est. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

In processu laminating priore, liquefactum epoxy ad extra PCB extructum est, ut removeretur. Machina milling alea peripheriam PCB secat secundum rectas XY coordinatas.

Praecipitatio chemica aeris in pariete poro

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Primus igitur gradus est materiam conductivam in pariete foraminis accumulare, et 1-micron velum cupri in tota superficie PCB, incluso pariete foraminis, per depositionem chemicam formare. Totum processum, sicut curatio chemica et purgatio, machinis regitur.

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Mundatis PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Nulla velum electroplari potest, et nulla pellicula, primum aes et postea plumbi lamina. Moto velo sublato, alkalina etching effertur, et tandem stannum removetur. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Pone cinematographica PCB cinematographica superiorum et inferiorum stratorum photoscripti per foraminis positis, et pone PCB tabulam in medio. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Clamp the PCB and electroplate the copper. As mentioned before, in order to ensure that the hole has good electrical conductivity, the copper film electroplated on the hole wall must have a thickness of 25 microns, so the whole system will be automatically controlled by computer to ensure its accuracy.

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Computatrum imperium et electroplating aeris

Post cinematographicum aeneum electroplatum est, computatorium pro tenui strato stanneo rependit.

Post stannum tabulam PCB patella exoneratam, inspicias ut crassitudo aeris et stannei recta sit.

Exteriores PCB etching

Deinde, linea conventus automated completum processum etching absolvit. Primum, emundandum velum sanatum in PCB tabula.

Fortis alkali tunc invitis aeneis bracteis, quae ab eo tegitur, purgare solebant.

Tum stannum in bracteolis PCB bracteis aeneis obstringitur, solutione stanneo detracta. After cleaning, 4 layers PCB layout is completed.