第一步 PCB 生產是組織和檢查PCB Layout。 PCB 製造廠從 PCB 設計公司接收 CAD 文件。 由於每個 CAD 軟件都有自己獨特的文件格式，PCB 工廠將它們轉換為統一格式 — Extended Gerber RS-274X 或 Gerber X2。 Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

在其中一款自製PCBS中，使用激光打印機將PCB佈局打印在紙上，然後轉移到覆銅板上。 但是在打印過程中，由於打印機容易出現缺墨斷點，需要用油筆手動補墨。

少量生產是好的，但是如果把這個缺陷轉移到工業生產上，就會大大降低生產效率。 Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

核心板生產

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. 4層PCB製作類似，但只有一塊芯板和兩層銅膜。

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. 該膜在曝光時固化，在覆銅板的銅箔上形成保護膜。

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

光敏劑使用紫外線燈照射銅箔上的感光膜。 透明膜下光敏膜固化，不透明膜下光敏膜不固化。 The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. 在之前激光打印機的紙質PCB佈局中，黑色碳粉被銅箔覆蓋，以保留下來。 In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

然後用鹼液洗掉未固化的薄膜，並用固化薄膜覆蓋所需的銅箔電路。

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

核心板鑽孔和檢查

芯板製作成功。 Then make the opposite hole in the core plate for easy alignment with other raw materials.

核心板一旦與其他PCB層壓在一起，就無法修改，所以檢查很重要。 機器會自動與PCB佈局圖進行比對，檢查錯誤。

前兩層PCB板已經做好了

層壓

Here we need a new raw material called semi-cured sheet (Prepreg), which is the core board and core board (PCB layer number & GT; 4）、芯板與外層銅箔之間的粘合劑，還起到絕緣作用。

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. 然後取出加壓鋁板。 鋁板還起到隔離不同PCBS和保證PCB外層銅箔光滑的作用。 Both sides of the PCB are covered with a layer of smooth copper foil.

鑽孔

如何將 PCB 中的四層非接觸銅箔連接在一起？ PCB首先鑽通孔，然後金屬化以導電。

X光鑽孔機用於定位內層芯板。 機器會自動在核心板上尋找並定位孔位，然後為PCB打出定位孔，確保後續鑽孔通過孔位的中心。

Place a sheet of aluminum on the punch machine and then place the PCB on top. 由於鑽孔是一個相對較慢的過程，為了提高效率，會根據PCB層數將1至3塊相同的PCB板堆疊在一起進行穿孔。 最後在最上面的PCB上覆蓋一層鋁，上下兩層都是鋁，這樣鑽進鑽出時，PCB上的銅箔不會撕裂。

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. 鑽頭由氣壓驅動，每分鐘最大旋轉150,000萬轉，足夠高，確保孔壁光滑。

鑽頭的更換也是由機器根據程序自動完成的。 The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

在之前的層壓過程中，熔化的環氧樹脂被擠出到PCB的外面，因此需要將其去除。 模具銑床根據正確的XY坐標切割PCB外圍。

銅在孔壁上的化學沉澱

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. 因此，第一步是在孔壁上堆積一層導電材料，通過化學沉積在包括孔壁在內的整個PCB表面形成1微米的銅膜。 整個過程，如化學處理和清潔，均由機器控制。

固定PCB

清潔印刷電路板

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. 沒有膜可以電鍍，也沒有膜，先鍍銅再鍍錫。 去除薄膜後，進行鹼性蝕刻，最後去除錫。 The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

通過定位孔固定上下兩層影印的PCB佈局膜，中間放置PCB板。 The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Clamp the PCB and electroplate the copper. As mentioned before, in order to ensure that the hole has good electrical conductivity, the copper film electroplated on the hole wall must have a thickness of 25 microns, so the whole system will be automatically controlled by computer to ensure its accuracy.

固定PCB

Computer control and electroplating copper

After the copper film is electroplated, the computer arranges for a thin layer of tin to be replated.

After unloading the tin plated PCB board, check to ensure that the thickness of copper and tin plating is correct.

外PCB蝕刻

Next, a complete automated assembly line completes the etching process. First, clean off the cured film on the PCB board.

A strong alkali is then used to clean off unwanted copper foil that is covered by it.

然後用脫錫液去除PCB佈局銅箔上的錫塗層。 After cleaning, 4 layers PCB layout is completed.