Premye etap la nan Pkb pwodiksyon se yo òganize epi tcheke Layout PCB la. Plant fabrikasyon PCB la resevwa dosye CAD yo nan konpayi konsepsyon PCB la. Depi chak lojisyèl CAD gen pwòp fòma inik li yo, plant PCB la konvèti yo nan yon fòma inifye – Pwolonje Gerber RS-274X oswa Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

Nan youn nan PCBS yo te fè lakay yo, se Layout PCB la enprime sou papye lè l sèvi avèk yon enprimant lazè ak Lè sa a transfere nan yon tablo kwiv-rekouvèr. Sepandan, nan pwosesis enprime a, paske enprimant lan gen tandans pou defisyans lank, li nesesè manyèlman ranpli lank la ak yon plim lwil oliv.

Yon ti kantite pwodiksyon an amann, men si defo sa a transfere nan pwodiksyon endistriyèl, li pral redwi anpil efikasite pwodiksyon an. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Nwayo tablo pwodiksyon an

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. 4-kouch PCB la fèt menm jan, men ak yon sèl plak debaz ak de fim kwiv.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Fim nan solidifye lè ekspoze a limyè, fòme yon fim pwoteksyon sou FOIL an kwiv nan plak la kwiv-rekouvèr.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer itilize lanp UV iradyasyon fim nan photosensitive sou FOIL kwiv. Fim nan fotosansibilize solidifye anba fim nan transparan, ak fim nan fotosansibl pa solidifye anba fim nan opak. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. Nan layout PCB papye enprimant lazè anvan an, toner nwa a te kouvri ak papye kwiv pou kenbe. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

Se fim nan geri Lè sa a, lave lwen ak lesiv ak sikwi a FOIL kwiv yo mande yo kouvri pa fim nan geri.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Nwayo plak perçage ak enspeksyon

Te plak debaz la te fè avèk siksè. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Yon fwa ke tablo debaz la bourade ak lòt kouch PCB, li pa ka modifye, kidonk li trè enpòtan pou tcheke. Machin nan pral otomatikman konpare ak desen Layout PCB yo tcheke erè.

De premye kouch tablo PCB yo te fèt

laminated

Isit la nou bezwen yon nouvo materyèl bwit yo rele semi-geri fèy (Prepreg), ki se tablo debaz la ak tablo debaz (PCB kouch nimewo & GT; 4), ak adezif ki genyen ant plak debaz la ak FOIL an kwiv ekstèn, men tou, jwe yon wòl nan izolasyon.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Lè sa a, se plak la aliminyòm presyon retire. Plak aliminyòm lan jwe yon wòl tou nan izole diferan PCBS epi asire papye kwiv lis la sou kouch ekstèn PCB la. Tou de bò PCB yo kouvri ak yon kouch papye kòb kwiv mete lis.

perçage

Ki jan ou konekte kat kouch ki pa manyen nan fèy kwiv ansanm nan yon PCB? Se PCB la premye komanse fouye nan twou, Lè sa a, metalize fè elektrisite.

Se machin nan perçage X-ray itilize jwenn tablo debaz nan kouch enteryè a. Machin nan pral otomatikman jwenn ak lokalize pozisyon twou a sou tablo debaz la, ak Lè sa a, fè twou pwezante pou PCB la asire ke perçage sa a se nan sant la nan pozisyon an twou.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Kòm perçage se yon pwosesis relativman dousman, yo nan lòd yo amelyore efikasite, 1 a 3 ankadreman PCB ki idantik yo pral anpile ansanm pou pèforasyon selon kantite kouch PCB. Finalman, PCB an tèt la kouvri ak yon kouch aliminyòm, kouch anwo ak anba aliminyòm pou lè egzèsis la fè egzèsis nan ak soti, FOIL an kwiv sou PCB a pa pral chire.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Se ti jan nan fè egzèsis kondwi pa presyon lè a, ak yon wotasyon maksimòm de 150,000 revolisyon pou chak minit, ki se wo ase asire yon miray twou lis.

Se ranplasman nan ti jan nan fè egzèsis tou fè otomatikman pa machin nan dapre pwogram nan. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

Nan pwosesis laminasyon anvan an, epoksidik la fonn te sòti nan deyò PCB la, kidonk li te bezwen retire li. Machin nan fraisage mouri koupe periferik la nan PCB la dapre kowòdone yo XY kòrèk.

Presipitasyon chimik kwiv sou miray pò a

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Se poutèt sa, premye etap la se akimile yon kouch materyèl kondiktif sou miray la twou, ak fòme yon fim kòb kwiv mete 1-Micron sou tout sifas la PCB, ki gen ladan miray ranpa a nan twou, nan depozisyon chimik. Pwosesis la an antye, tankou tretman chimik ak netwayaj, se kontwole pa machin.

PCB fiks

Netwaye PCB la

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Pa gen okenn fim ka electroplated, e pa gen okenn fim, premye kòb kwiv mete ak Lè sa a, fèblan plating. Apre yo fin fim nan retire, alkalin grave te pote soti, epi finalman fèblan yo retire li. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Ranje fim nan Layout PCB nan kouch yo anwo ak pi ba nan fotokopi nan twou a pwezante, li mete tablo a PCB nan mitan an. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Kranpon PCB la ak electroplate kwiv la. Kòm mansyone anvan, yo nan lòd yo asire ke twou a gen bon konduktivite elektrik, fim nan kòb kwiv mete galvanize sou miray la twou dwe gen yon epesè nan 25 mikron, se konsa tout sistèm lan pral otomatikman kontwole pa òdinatè asire presizyon li yo.

PCB fiks

Kontwòl òdinatè ak kwiv galvanoplastie

Apre fim nan kòb kwiv mete electroplated, òdinatè a fè aranjman pou yon kouch mens nan fèblan dwe replated.

Aprè dechaje tablo eten an plake PCB, tcheke pou asire ke epesè kòb kwiv mete ak eten an kòrèk.

Eksteryè PCB grave

Next, yon liy konplè asanble otomatik konplete pwosesis la grave. Premyèman, netwaye fim nan geri sou tablo PCB la.

Yon alkali fò se Lè sa a, itilize nan pwòp koupe papye kwiv vle ki kouvri pa li.

Lè sa a, kouch la fèblan sou FOIL an kwiv nan Layout PCB yo retire ak fèblan solisyon nidite. After cleaning, 4 layers PCB layout is completed.