L – ewwel pass ta ‘ PCB produzzjoni hija li torganizza u tiċċekkja l-Layout tal-PCB. L-impjant tal-fabbrikazzjoni tal-PCB jirċievi l-fajls CAD mill-kumpanija tad-disinn tal-PCB. Peress li kull softwer CAD għandu l-format tal-fajl uniku tiegħu stess, l-impjant tal-PCB jikkonvertihom f’format unifikat – Extended Gerber RS-274X jew Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

F’wieħed mill-PCBS magħmul id-dar, it-tqassim tal-PCB huwa stampat fuq karta bl-użu ta ‘laser printer u mbagħad trasferit għal bord miksi bir-ram. Madankollu, fil-proċess tal-istampar, minħabba li l-istampatur huwa suxxettibbli għal breakpoint ta ‘defiċjenza tal-linka, huwa meħtieġ li timla l-linka manwalment b’pinna taż-żejt.

Ammont żgħir ta ‘produzzjoni huwa tajjeb, imma jekk dan id-difett jiġi ttrasferit għal produzzjoni industrijali, dan inaqqas ħafna l-effiċjenza tal-produzzjoni. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Produzzjoni tal-bord ewlieni

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. Il-PCB b’4 saffi huwa magħmul bl-istess mod, iżda bi pjanċa tal-qalba waħda biss u żewġ films tar-ram.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Il-film jissolidifika meta jkun espost għad-dawl, u jifforma film protettiv fuq il-fojl tar-ram tal-pjanċa miksija bir-ram.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer juża lampa UV biex jirradja l-film fotosensittiv fuq fojl tar-ram. Il-film fotosensittiv huwa ssolidifikat taħt il-film trasparenti, u l-film fotosensittiv mhux solidifikat taħt il-film opak. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. Fit-tqassim tal-PCB tal-karta tal-laser printer preċedenti, it-toner iswed kien mgħotti bil-fojl tar-ram biex jinżamm. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

Il-film mhux ikkurat imbagħad jinħasel bil-lye u ċ-ċirkwit meħtieġ tal-fojl tar-ram huwa kopert mill-film ikkurat.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Tħaffir u spezzjoni tal-pjanċa tal-qalba

Il-pjanċa tal-qalba saret b’suċċess. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Ladarba l-bord tal-qalba jiġi ppressat ma ‘saffi oħra ta’ PCB, ma jistax jiġi modifikat, għalhekk huwa importanti ħafna li tivverifika. Il-magna awtomatikament tqabbel mad-disinji tat-tqassim tal-PCB biex tivverifika l-iżbalji.

L-ewwel żewġ saffi tal-bordijiet tal-PCB saru

laminat

Hawnhekk għandna bżonn materja prima ġdida msejħa folja semi-vulkanizzata (Prepreg), li hija l-bord ewlieni u l-bord ewlieni (numru tas-saff tal-PCB & GT; 4), u l-kolla bejn il-pjanċa tal-qalba u l-fojl tar-ram ta ‘barra, iżda għandha wkoll rwol fl-insulazzjoni.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Imbagħad il-pjanċa tal-aluminju taħt pressjoni titneħħa. Il-pjanċa tal-aluminju għandha wkoll rwol fl-iżolament ta ‘PCBS differenti u fl-iżgurar tal-fojl tar-ram bla xkiel fuq is-saff ta’ barra tal-PCB. Iż-żewġ naħat tal-PCB huma mgħottija b’saff ta ‘fojl tar-ram lixx.

tħaffir

Kif tikkonnettja l-erba ‘saffi ta’ fojl tar-ram li ma jmissux flimkien f’BPC? Il-PCB huwa l-ewwel imtaqqab minn toqob, imbagħad metallizzat biex imexxi l-elettriku.

Il-magna tat-tħaffir tar-raġġi X tintuża biex issib il-bord ewlieni tas-saff ta ‘ġewwa. Il-magna awtomatikament issib u ssib il-pożizzjoni tat-toqba fuq il-bord tal-qalba, u mbagħad tagħmel toqob għall-ippożizzjonar għall-PCB biex tiżgura li t-tħaffir li ġej jgħaddi miċ-ċentru tal-pożizzjoni tat-toqba.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Billi t-tħaffir huwa proċess relattivament bil-mod, sabiex tittejjeb l-effiċjenza, 1 sa 3 bordijiet identiċi tal-PCB se jkunu f’munzelli flimkien għall-perforazzjoni skond in-numru ta ‘saffi tal-PCB. Fl-aħħarnett, il-PCB ta ‘fuq huwa mgħotti b’saff ta’ aluminju, is-saffi ta ‘fuq u ta’ isfel ta ‘aluminju sabiex meta l-drill iħaffer’ il ġewwa u ‘l barra, il-fojl tar-ram fuq il-PCB ma jinqatax.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Il-bit drill huwa mmexxi mill-pressjoni ta ‘l-arja, b’rotazzjoni massima ta’ 150,000 dawra kull minuta, li hija għolja biżżejjed biex tiżgura ħajt ta ‘toqba lixxa.

Is-sostituzzjoni tal-bit drill issir ukoll awtomatikament mill-magna skont il-programm. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

Fil-proċess ta ‘laminar preċedenti, l-epossi mdewba ġiet estruża għal barra tal-PCB, u għalhekk kellha titneħħa. Il-magna tat-tħin die tnaqqas il-periferija tal-PCB skond il-koordinati XY korretti.

Preċipitazzjoni kimika tar-ram fuq il-ħajt tal-pori

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Għalhekk, l-ewwel pass huwa li takkumula saff ta ‘materjal konduttiv fuq il-ħajt tat-toqba, u tifforma film tar-ram ta’ 1 mikron fuq il-wiċċ kollu tal-PCB, inkluż il-ħajt tat-toqba, permezz ta ‘depożizzjoni kimika. Il-proċess kollu, bħat-trattament kimiku u t-tindif, huwa kkontrollat ​​minn magni.

PCB fiss

Naddaf il-PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. M’hemm l-ebda film jista ‘jkun electroplated, u m’hemm l-ebda film, l-ewwel ram u mbagħad kisi tal-landa. Wara li jitneħħa l-film, isir inċiżjoni alkalina, u finalment titneħħa l-landa. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Waħħal il-film tat-tqassim tal-PCB tas-saffi ta ‘fuq u t’isfel tal-fotokopja mit-toqba tal-pożizzjonament, u poġġi l-bord tal-PCB fin-nofs. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Ikklampja l-PCB u electroplate-ram. Kif imsemmi qabel, sabiex jiġi żgurat li t-toqba jkollha konduttività elettrika tajba, il-film tar-ram electroplated fuq il-ħajt tat-toqba għandu jkollu ħxuna ta ’25 mikron, għalhekk is-sistema kollha tkun awtomatikament ikkontrollata mill-kompjuter biex tkun żgurata l-eżattezza tagħha.

PCB fiss

Kontroll tal-kompjuter u electroplating tar-ram

Wara li l-film tar-ram jiġi electroplated, il-kompjuter jirranġa biex saff irqiq ta ‘landa jiġi replated.

Wara li ħatt il-bord tal-PCB miksi bil-landa, iċċekkja biex tiżgura li l-ħxuna tar-ram u l-kisi tal-landa hija korretta.

Inċiżjoni fuq barra tal-PCB

Sussegwentement, linja ta ‘assemblaġġ awtomatizzata kompluta tlesti l-proċess ta’ inċiżjoni. L-ewwel, naddaf il-film vulkanizzat fuq il-bord tal-PCB.

Imbagħad jintuża alkali qawwi biex jitnaddaf fojl tar-ram mhux mixtieq li jkun kopert minnu.

Imbagħad il-kisi tal-landa fuq il-fojl tar-ram tat-tqassim tal-PCB jitneħħa b’soluzzjoni ta ‘tqaxxir tal-landa. After cleaning, 4 layers PCB layout is completed.