Prvi korak od PCB proizvodnja je organizirati i provjeriti raspored PCB -a. Postrojenje za izradu PCB -a prima CAD datoteke od tvrtke za dizajn PCB -a. Budući da svaki CAD softver ima svoj jedinstveni format datoteke, PCB tvornica ih pretvara u jedinstveni format-Extended Gerber RS-274X ili Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

U jednom od domaćih PCBS-a raspored PCB-a ispisuje se na papiru laserskim pisačem, a zatim se prenosi na ploču obloženu bakrom. Međutim, u procesu ispisa, jer je pisač sklon točki prekida nedostatka tinte, potrebno je ručno napuniti tintu olovkom.

Mala količina proizvodnje je u redu, ali ako se ovaj nedostatak prenese u industrijsku proizvodnju, to će uvelike smanjiti učinkovitost proizvodnje. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Proizvodnja jezgrenih ploča

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. Četveroslojni PCB izrađen je slično, ali sa samo jednom jezgrom i dva bakrena filma.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Film se stvrdne pri izlaganju svjetlosti, tvoreći zaštitni film preko bakrene folije ploče obložene bakrom.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Fotosenzibilizator koristi UV svjetiljku za zračenje fotoosjetljivog filma na bakrenoj foliji. Fotoosjetljivi film učvršćuje se ispod prozirnog filma, a fotoosjetljivi film ne očvršćava ispod neprozirnog filma. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. U rasporedu PCB -a na papiru prethodnog laserskog pisača, crni toner bio je prekriven bakrenom folijom kako bi se zadržao. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

Neočvrsli film zatim se ispire lugom, a potrebni krug bakrene folije prekriva očvrsli film.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Otkinite očvrsli fotoosjetljivi film kako biste otkrili bakrenu foliju potrebnu za krug rasporeda PCB -a.

Bušenje i pregled jezgrenih ploča

Jezgrena ploča uspješno je izrađena. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Nakon što se jezgrena ploča pritisne s drugim slojevima PCB -a, ne može se mijenjati, pa je vrlo važno provjeriti. Stroj će se automatski usporediti s crtežima izgleda PCB -a radi provjere pogrešaka.

Napravljena su prva dva sloja PCB ploča

na listiće

Ovdje nam je potrebna nova sirovina koja se naziva polustvrdnuti lim (Prepreg), a to je jezgra i ploča jezgre (broj sloja PCB-a & GT; 4), i ljepilo između jezgre ploče i vanjske bakrene folije, ali također igra ulogu u izolaciji.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Zatim se skida aluminijska ploča pod tlakom. Aluminijska ploča također igra ulogu u izolaciji različitih PCBS -a i osiguravanju glatke bakrene folije na vanjskom sloju PCB -a. Obje strane PCB -a prekrivene su slojem glatke bakrene folije.

bušenje

Kako spojiti četiri sloja bakrene folije koja ne dodiruju zajedno u PCB? PCB se prvo buši kroz rupe, zatim metalizira radi provođenja električne energije.

Stroj za bušenje rendgenskim zrakama koristi se za lociranje jezgre unutarnjeg sloja. Stroj će automatski pronaći i locirati položaj rupa na ploči jezgre, a zatim će napraviti rupe za pozicioniranje za PCB kako bi se osiguralo da je sljedeće bušenje kroz središte položaja rupe.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Budući da je bušenje relativno spor proces, kako bi se poboljšala učinkovitost, 1 do 3 identične ploče PCB -a bit će složene zajedno radi perforiranja prema broju slojeva PCB -a. Konačno, gornja PCB ploča prekrivena je slojem aluminija, gornji i donji sloj aluminija tako da se prilikom bušenja bušilica unutra i van bakrena folija na PCB -u neće puknuti.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Svrdlo se pokreće tlakom zraka, s maksimalnim zakretanjem od 150,000 okretaja u minuti, što je dovoljno visoko da osigura glatki zid rupa.

Zamjenu svrdla također vrši automatski stroj prema programu. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

U prethodnom postupku laminiranja, rastopljeni epoksid ekstrudiran je izvan PCB -a, pa ga je trebalo ukloniti. Stroj za glodanje prerezuje periferiju PCB -a prema ispravnim XY koordinatama.

Kemijsko taloženje bakra na stijenci pora

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Stoga je prvi korak nakupljanje sloja vodljivog materijala na stijenci rupe i kemijskim taloženjem formirati bakreni film od 1 mikrona na cijeloj površini PCB-a, uključujući stijenku rupe. Cijeli proces, poput kemijske obrade i čišćenja, kontroliraju strojevi.

Fiksna PCB

Očistite PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Ne postoji film koji se može galvanizirati, niti film, prvo bakrena, a zatim limena oplata. Nakon uklanjanja filma provodi se alkalno jetkanje i na kraju se uklanja kositar. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Učvrstite film za postavljanje PCB -a gornjeg i donjeg sloja fotokopije kroz otvor za pozicioniranje, a PCB ploču stavite u sredinu. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Pričvrstite PCB i galvanizirajte bakar. Kao što je već spomenuto, kako bi se osiguralo da rupa ima dobru električnu vodljivost, bakreni film galvaniziran na stijenci rupe mora imati debljinu od 25 mikrona, pa će cijeli sustav automatski biti kontroliran računalom kako bi se osigurala njegova točnost.

Fiksna PCB

Računalno upravljanje i galvaniziranje bakra

Nakon što je bakreni film galvaniziran, računalo organizira da se zamijeni tanki sloj kositra.

Nakon istovara limene ploče, provjerite je li debljina bakrene i limene oplate ispravna.

Vanjsko jetkanje PCB -a

Zatim, potpuna automatizirana montažna linija dovršava proces jetkanja. Prvo očistite stvrdnuti film s ploče PCB -a.

Jaka lužina tada se koristi za čišćenje neželjene bakrene folije koja je njome prekrivena.

Zatim se limena prevlaka s bakrene folije s rasporedom PCB -a uklanja otopinom za skidanje kositra. After cleaning, 4 layers PCB layout is completed.