Langkah kapisan saka PCB produksi yaiku ngatur lan mriksa Tata Letak PCB. Tanduran pabrikan PCB nampa file CAD saka perusahaan desain PCB. Amarga saben piranti lunak CAD duwe format file unik, pabrik PCB ngonversi dadi format gabungan – Extended Gerber RS-274X utawa Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

Ing salah sawijining PCBs sing digawe ing omah, tata letak PCB dicithak ing kertas nggunakake printer laser banjur ditransfer menyang papan klambi tembaga. Nanging, ing proses pencetakan, amarga printer gampang ngalami breakpoint kekurangan tinta, mula kudu isi tinta kanthi pena minyak kanthi manual.

Sakedhik produksi ora apa-apa, nanging yen cacat iki ditransfer menyang produksi industri, bakal nyuda efisiensi produksi. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

The film is then punched with counterpoint holes. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Produksi papan inti

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. PCB 4 lapis digawe padha, nanging mung nganggo siji plate inti lan rong film tembaga.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Film kasebut padhet nalika kena cahya, nggawe film protèktif liwat foil tembaga saka piring sing nganggo tembaga.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer nggunakake lampu UV kanggo nyinari film fotosensitif ing foil tembaga. Film fotosensitif dikuatake ing sangisore film transparan, lan film fotosensitif ora dipadhetake ing sangisore film buram. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. Ing tata letak PCB kertas printer laser sadurunge, toner ireng ditutupi foil tembaga supaya bisa ditahan. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

Film sing ora diombe banjur dicuci nganggo lye lan sirkuit foil tembaga sing dibutuhake ditutupi karo film sing wis mari.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Pengeboran piring inti lan pengawasan

Plat inti wis digawe kanthi sukses. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Sawise papan inti dipencet karo lapisan PCB liyane, ora bisa diowahi, mula penting banget kanggo mriksa. Mesin kasebut kanthi otomatis mbandhingake karo gambar layout PCB kanggo mriksa kesalahan.

Loro lapisan papan PCB pisanan digawe

laminasi

Here we need a new raw material called semi-cured sheet (Prepreg), which is the core board and core board (PCB layer number & GT; 4), lan adesif ing antarane piring inti lan foil tembaga njaba, nanging uga duwe peran kanggo insulasi.

The lower layer of copper foil and two layers of semi-solidified sheet have been in advance through the positioning hole and the lower iron plate fixed position, and then the good core plate is also put into the positioning hole, and finally in turn two layers of semi-solidified sheet, a layer of copper foil and a layer of pressure aluminum plate covered on the core plate.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Through the placement of the counterpoint needle, the two layers of iron plate counterpoint successfully, the machine as far as possible to compress the space between the iron plate, and then fixed with nails.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Banjur piring aluminium bertekanan dicopot. Plat aluminium uga duwe peran kanggo ngisolasi PCBS sing beda lan njamin foil tembaga sing lancar ing lapisan njaba PCB. Both sides of the PCB are covered with a layer of smooth copper foil.

ngebur

Kepiye sampeyan nyambungake papat lapisan foil tembaga sing ora ndemek ing PCB? PCB pisanan dibor liwat bolongan, banjur metallized kanggo listrik.

Mesin pengeboran sinar-X digunakake kanggo nemokake papan inti lapisan njero. Mesin kasebut kanthi otomatis bakal nemokake lan nemokake posisi bolongan ing papan inti, lan banjur nggawe bolongan posisi kanggo PCB kanggo mesthekake yen pengeboran ing ngisor iki liwat tengah posisi bolongan.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Amarga pengeboran minangka proses sing cukup alon, kanggo nambah efisiensi, papan PCB sing padha nganti 1 bakal ditumpuk kanggo perforasi miturut jumlah lapisan PCB. Pungkasan, PCB ndhuwur ditutupi lapisan aluminium, lapisan aluminium ndhuwur lan ngisor, supaya nalika latihan lan pengeboran, foil tembaga ing PCB ora bakal robek.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Bit pengeboran dipimpin tekanan udara, kanthi rotasi maksimal 150,000 révolusi per menit, sing cukup dhuwur kanggo mesthekake tembok bolongan sing alus.

Penggantian bit bor uga ditindakake kanthi otomatis miturut mesin. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

Ing proses laminasi sadurunge, epoxy lebur diekstrusi ing njaba PCB, mula prelu dicopot. Mesin panggilingan mati nglereni pinggiran PCB miturut koordinat XY sing bener.

Udan kimia tembaga ing tembok pori

Since almost all PCB designs use perforations to connect different layers of lines, a good connection requires a 25 micron copper film on the hole wall. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Mula, langkah pertama yaiku nglumpukake lapisan bahan konduktif ing tembok bolongan, lan mbentuk film tembaga 1-mikron ing kabeh permukaan PCB, kalebu tembok bolongan, liwat endapan kimia. Kabeh proses, kayata perawatan kimia lan reresik, dikontrol dening mesin.

PCB tetep

Resiki PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Ora ana film sing bisa electroplated, lan ora ana film, tembaga pisanan banjur plating timah. Sawise film dicopot, etching alkali dileksanakake, lan pungkasane dicabut timah. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Ndandani film layout PCB saka lapisan fotokopi ndhuwur lan ngisor liwat bolongan posisi, lan lebokake papan PCB ing tengah. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Clamp the PCB and electroplate the copper. As mentioned before, in order to ensure that the hole has good electrical conductivity, the copper film electroplated on the hole wall must have a thickness of 25 microns, so the whole system will be automatically controlled by computer to ensure its accuracy.

PCB tetep

Computer control and electroplating copper

After the copper film is electroplated, the computer arranges for a thin layer of tin to be replated.

After unloading the tin plated PCB board, check to ensure that the thickness of copper and tin plating is correct.

Etsa PCB njaba

Sabanjure, baris perakitan otomatis lengkap ngrampungake proses etching. First, clean off the cured film on the PCB board.

Alkali kuwat banjur digunakake kanggo ngresiki foil tembaga sing ora dikarepake sing ditutupi.

Banjur lapisan timah ing foil tembaga saka tata letak PCB dicopot nganggo solusi pelucutan timah. After cleaning, 4 layers PCB layout is completed.