Mataki na farko na PCB production is to organize and check the PCB Layout. Kamfanin ƙirƙirar PCB yana karɓar fayilolin CAD daga kamfanin ƙirar PCB. Tunda kowane software na CAD yana da tsarin fayil ɗin sa na musamman, shuka PCB yana canza su zuwa tsari ɗaya-Extended Gerber RS-274X ko Gerber X2. Then the engineer of the factory will check whether the PCB layout conforms to the production process, whether there are any defects and other problems.

A cikin ɗayan PCBS na gida, ana buga tsarin PCB akan takarda ta amfani da firinta na laser sannan a canza shi zuwa allon da aka lulluɓe da tagulla. Koyaya, a cikin tsarin bugawa, saboda firintar na iya fuskantar raunin raunin tawada, ya zama dole a cika tawada da alkalami na mai.

Ƙananan adadin samarwa yana da kyau, amma idan an canza wannan lahani zuwa masana’antar masana’antu, zai rage ƙimar samarwa sosai. Therefore, the factory generally adopts the way of photocopying, printing the PCB layout on the film. If it is a multi-layer PCB, the layout of each layer will be arranged in order.

Daga nan sai a dora fim ɗin da ramuka masu ƙima. Counterpoint holes are very important, and are then used to align materials on each layer of the PCB.

Core jirgin samar

Clean the copper clad plate, if dust may cause the final circuit short circuit or break.

The figure below is an illustration of an 8-layer PCB, which is actually made up of 3 copper-clad plates (core boards) plus 2 copper films and then glued together with semi-cured sheets. The production sequence starts from the core board (four or five layers of lines) in the middle, and is continuously stacked together before being fixed. An yi PCB-Layer 4 kamar haka, amma tare da farantin karfe ɗaya kawai da fina-finan jan ƙarfe guda biyu.

Transfer of inner PCB layout

Therefore, the two-layer circuit of the most central Core plate should be made first. After the copper-clad plate is cleaned, the surface is covered with a photosensitive film. Fim ɗin yana ƙarfafawa lokacin da aka fallasa shi zuwa haske, yana yin fim mai kariya a kan murfin tagulla na farantin da ke ɗauke da tagulla.

Insert two layers of PCB layout film and two layers of copper clad board, and finally insert the upper layer of PCB layout film to ensure that the upper and lower layers of PCB layout film stacking position is accurate.

Photosensitizer uses UV lamp to irradiate the photosensitive film on copper foil. The photosensitive film is solidified under the transparent film, and the photosensitive film is not solidified under the opaque film. The copper foil covered by solidified photosensitive film is the PCB layout line needed, equivalent to the role of laser printer ink of manual PCB. A cikin tsarin PCB na takarda na firintar laser na baya, an rufe bakar toner da takardar jan ƙarfe don a riƙe. In this case, the copper foil covered with black film will corrode away, while the transparent film will be preserved as the photosensitive film solidifies.

An wanke fim ɗin da ba a gyara ba tare da lye kuma an rufe murfin murfin jan ƙarfe da ake buƙata.

Inner core board etching

The unwanted copper foil is then etched away with a strong base, such as NaOH.

Tear off the cured photosensitive film to expose the copper foil needed for PCB layout circuit.

Core farantin hakowa da dubawa

An yi babban faranti cikin nasara. Then make the opposite hole in the core plate for easy alignment with other raw materials.

Once the core board is pressed with other layers of PCB, it cannot be modified, so it is very important to check. Injin zai kwatanta ta atomatik tare da zane -zane na PCB don bincika kurakurai.

An yi yadudduka biyu na farko na allon PCB

laminated

Anan muna buƙatar sabon kayan albarkatun ƙasa da ake kira takaddar warkar da warkarwa (Prepreg), wanda shine babban jirgi da babban jirgi (lambar Layer PCB & GT; 4), da mannewa tsakanin babban farantin karfe da murfin jan ƙarfe na waje, amma kuma yana taka rawa a rufi.

Ƙananan Layer na murfin jan ƙarfe da yadudduka biyu na takaddama mai ƙarfi sun kasance a gaba ta ramin sakawa da ƙaramin farantin ƙarfe madaidaicin matsayi, sannan kuma an saka farantin mai kyau kuma a cikin rami na sakawa, kuma a ƙarshe biyun biyun na takarda mai tsayayye mai ƙarfi, farantin farantin jan ƙarfe da farantin farantin aluminium da aka rufe akan babban farantin.

In order to improve work efficiency, the factory will stack three different PCB boards together and then fix them. The upper iron plate is magnetically attracted to facilitate counterpoint with the lower iron plate. Ta hanyar sanya allurar da aka yi amfani da ita, yadudduka biyu na faranti na ƙarfe sun yi nasara, injin har zuwa yiwu don damfara sarari tsakanin farantin ƙarfe, sannan a gyara shi da kusoshi.

PCB board clamped by iron plate is placed on the support, and then into the vacuum hot press for lamination. The heat in the vacuum hot press melts the epoxy resin in the semi-cured sheet, holding the core and copper foil together under pressure.

After laminating, remove the top iron plate that presses the PCB. Sannan an cire farantin aluminum da aka matsa. Har ila yau farantin aluminium yana taka rawa wajen ware PCBS daban -daban da kuma tabbatar da murƙushe murfin jan ƙarfe a saman saman PCB. Duk ɓangarorin PCB an rufe su da murfin murfin jan ƙarfe mai santsi.

hakowa

Ta yaya za ku haɗu da yadudduka huɗu waɗanda ba su taɓa taɓawa da murfin jan ƙarfe tare a cikin PCB? PCB an fara haƙa shi ta ramuka, sannan aka ƙera shi don gudanar da wutar lantarki.

Ana amfani da injin hakowa na X-ray don nemo babban allon Layer na ciki. Injin zai nemo ta atomatik kuma gano matsayin rami a kan babban jirgin, sannan sanya ramuka don PCB don tabbatar da cewa hakowa mai zuwa ta tsakiyar tsakiyar ramin.

Place a sheet of aluminum on the punch machine and then place the PCB on top. Kamar yadda hakowa ya kasance mai ɗan jinkirin aiwatarwa, don haɓaka ingantaccen aiki, za a haɗa allon 1 zuwa 3 na PCB tare don ɓarna gwargwadon adadin yadudduka na PCB. A ƙarshe, saman PCB an lulluɓe shi da farantin aluminium, saman da ƙasa na yadudduka na aluminium don haka lokacin da rami ya shiga ciki da waje, murfin jan ƙarfe akan PCB ba zai tsage ba.

The operator then only needs to select the correct drilling procedure and the drilling machine does the rest automatically. Haɗin ramin yana motsawa ta hanyar matsin lamba na iska, tare da matsakaicin juyi na juyi 150,000 a minti ɗaya, wanda ya isa ya tabbatar da bangon rami mai santsi.

Hakanan ana yin maye gurbin bitar rawar ta atomatik ta injin bisa ga shirin. The smallest drill can be 100 microns in diameter, while a human hair is 150 microns in diameter.

A cikin tsarin laminating na baya, an fitar da epoxy ɗin waje zuwa PCB, don haka ana buƙatar cire shi. Injin injin na mutu yana yanke gefen PCB gwargwadon daidaitattun haɗin gwiwar XY.

Ruwan sinadarin jan ƙarfe akan bangon rami

Tun da kusan duk ƙirar PCB suna amfani da ramuka don haɗa layuka daban -daban na layi, haɗin haɗi mai kyau yana buƙatar fim na jan ƙarfe micron 25 akan bangon rami. This thickness of copper film is achieved by electroplating, but the hole wall is made of non-conductive epoxy resin and fiberglass board. Sabili da haka, matakin farko shine tara kayan aiki mai gudana akan bangon rami, kuma samar da fim na jan ƙarfe 1-micron a duk faɗin PCB, gami da bangon rami, ta hanyar adana sinadarai. Dukan tsari, kamar jiyya da tsaftacewa, injina ne ke sarrafa su.

Kafaffen PCB

Tsaftace PCB

Delivery of PCB

Chemical precipitation of copper film

Transfer the layout of the outer PCB

Next, the layout of the outer PCB will be transferred to the copper foil. The process is similar to that of the PCB layout of the inner core board, which is transferred to the copper foil using photocopied film and photosensitive film. The only difference is that the positive plate will be used as the board.

The transfer of inner PCB layout introduced above adopts the subtraction method and adopts the negative plate as the board. PCB covered by solidified photosensitive film is circuit, clean the unsolidified photosensitive film, exposed copper foil is etched, PCB layout circuit is protected by solidified photosensitive film. The outer PCB layout is transferred by the normal method, and the positive plate is used as the board. The area covered by a cured film on a PCB is a non – line area. After cleaning the uncured film, electroplating is carried out. Babu wani fim da za a iya zaɓar electroplated, kuma babu wani fim, na farko jan ƙarfe sannan faranti. Bayan an cire fim ɗin, ana aiwatar da alkaline, kuma a ƙarshe an cire tin. The circuit pattern is left on the board because it is protected by tin.

Clean both sides of the copper foil PCB into the press, the press will be sensitive to the copper foil mold pressing.

Gyara fim ɗin shimfidar PCB na babba da ƙananan yadudduka na kwafi ta ramin sakawa, kuma sanya allon PCB a tsakiya. The photosensitive film under the transmittance film is then solidified by UV lamp irradiation, which is the line that needs to be preserved.

After cleaning the film that is not needed and has not been cured, inspect it.

Matsa PCB da electroplate jan ƙarfe. Kamar yadda aka ambata a baya, don tabbatar da cewa ramin yana da ingantacciyar wutar lantarki, fim ɗin jan ƙarfe da aka zaɓa akan bangon rami dole ne ya zama kauri na microns 25, don haka kwamfutarka za ta sarrafa dukkan tsarin ta atomatik don tabbatar da sahihancin sa.

Kafaffen PCB

Ikon sarrafa kwamfuta da electroplating jan ƙarfe

Bayan an zana fim ɗin jan ƙarfe, kwamfutar tana shirya yadda za a sake buga wani ɗan ƙaramin kwano.

Bayan saukar da allon PCB na kwanon rufi, duba don tabbatar da cewa kaurin jan ƙarfe da faranti faɗin daidai ne.

Tsarin PCB na waje

Na gaba, cikakken layin taro mai sarrafa kansa yana kammala aikin etching. Na farko, tsabtace fim ɗin da aka warke akan allon PCB.

Sannan ana amfani da alkali mai ƙarfi don tsaftace takardar jan ƙarfe da ba a so wanda ya rufe ta.

Sannan an cire murfin kwanon da ke kan takardar jan ƙarfe na tsarin PCB tare da maganin ɓarna na tin. After cleaning, 4 layers PCB layout is completed.