I. Common errors in schematic diagrams

(2) Component out of bounds: component is not created in the center of component library diagram paper.

(3) The created project file network table can only be partially loaded into PCB: Ba a zaɓi Duniya ba lokacin da aka ƙirƙiri jerin yanar gizo.

(4) Never use Annotate when using self-created multipart components.

Common errors in PCB

(1) When the network is loaded, it is reported that NODE is not found a. Components in the schematic diagram use packages that are not in the PCB library; B. Components in the schematic diagram use packages with different names in the PCB library; C. Abubuwan da ke cikin zane -zane suna amfani da fakiti tare da lambobin PIN marasa daidaituwa a cikin ɗakin karatu na PCB. Misali, triode: lambobin fil a cikin SCH sune e, b, c, da 1,2,3 a PCB.

(2) Always cannot print to a page when printing

A. Labarin PCB ba asalinsa bane lokacin da aka halicce shi; B. Akwai ɓoyayyun haruffa a waje da iyakokin allon PCB bayan motsi da jujjuya abubuwa da yawa. Zaɓi nuna duk haruffan ɓoye, rage PCB, sannan matsar da haruffan a cikin iyaka.

(3) An rarraba cibiyar sadarwar DRC zuwa sassa da yawa:

Wannan yana nuna cewa ba a haɗa hanyar sadarwa ba. Duba fayil ɗin rahoton kuma zaɓi CONPPERED COPPER don bincika.

Idan ƙirar da ta fi rikitarwa, yi ƙoƙarin kada ku yi amfani da wayoyi na atomatik.

Common mistakes in PCB manufacturing process

(1) kushin rufewa a. Sanya rami mai nauyi, a cikin hakowa saboda ramuka da yawa a cikin ramin da lalacewar rami da lalacewar rami.

B. A cikin jirgi mai ɗimbin yawa, akwai duka faifan haɗi da diski na keɓewa a wuri ɗaya, kuma hukumar tana yin kamar • ɓacewar ɓarna da haɗi.

(2) Amfani da faifan hoto ba a daidaita shi ba a. Ya keta ƙirar al’ada, kamar ƙirar shimfidar wuri a cikin Ƙasan Layer, ƙirar walda a cikin TOP Layer, yana haifar da rashin fahimta.

B. There is a lot of design junk on each layer, such as broken lines, useless borders, annotations, etc.

(3) Unreasonable characters a. Characters cover SMD welds, which brings inconvenience to PCB on-off detection and component welding.

B. Haruffa sun yi ƙanƙanta, wanda ke haifar da wahalar buga allo, manyan haruffa sun haɗu da juna, yana da wuya a rarrabe, babban rubutu> 40 dubu

(4) Single-sided pads set aperture a. Single-sided pads generally do not drill holes, the aperture should be designed to be zero, otherwise in the production of drilling data, the location of the hole coordinates. Special instructions should be given for drilling holes.

B. Idan kushin mai gefe ɗaya yana buƙatar a huda, amma ba a ƙera ramin ba, software za ta bi da kushin a matsayin kushin SMT lokacin fitar da bayanan lantarki da samuwar, kuma Layer na ciki zai zubar da faɗan kadaici.

(5) Draw the pad with a filling block

Ta wannan hanyar, kodayake tana iya wuce binciken DRC, ba za ta iya samar da bayanan juriya na siyarwa kai tsaye yayin aiki ba, kuma an rufe kushin da juriya na siyarwa kuma ba za a iya walda shi ba.

(6) The electric stratum is designed with both heat sink plate and signal line, and the positive and negative images are designed together, causing errors.

(7) Large area grid spacing is too small

Grid line spacing < 0.3mm, yayin aiwatar da masana’antar PCB, tsarin canja wurin hoto yana samar da fim ɗin da ya karye bayan haɓakawa, wanda ke haifar da karyewar waya. Inganta wahalar sarrafawa.

(8) The graph is too close to the outer frame

The spacing should be more than 0.2mm at least (more than 0.35mm at V-cut), otherwise the copper foil will warp and solder resist will fall off during the appearance processing. Affect the appearance quality (including the inner copper skin of the multilayer panel).

(9) The outline frame design is not clear

An ƙera yadudduka da yawa tare da firam ɗin, waɗanda ba sa daidaita da juna, yana mai wahala masana’antun PCB su tantance wane layi yakamata a kafa. Yakamata a tsara madaidaicin firam ɗin a cikin ɗigon injin ko Layer na BOARD, kuma matsayinta na ciki ya zama bayyananne.

(10) Zane -zanen hoto mara daidaituwa

When the graph electroplating, the current distribution is uneven, affecting the coating uniform, even cause warpage.

(11) Ramin siffa mai siffa

Length/width of special-shaped hole should be > 2: 1, faɗi & gt; 1.0mm, otherwise CNC drilling machine can not process.

(12) No milling shape positioning hole is designed

Design at least 2 diameters in PCB if possible. Ramin matsayi na 1.5mm.

(13) The aperture is not clearly marked

A. Aperture should be marked in metric system as far as possible and increase by 0.05. B. As far as possible to merge the aperture into a reservoir area. C. Whether the tolerance of metallized holes and special holes (such as crimping holes) is clearly marked.

(14) The inner layer of the multilayer is unreasonable

A. The heat dissipation pad is placed on the isolation belt. It may fail to connect after drilling. B. An ƙera ƙamus ɗin keɓewa kuma yana da sauƙin fahimta. C. The isolation belt is too narrow to accurately judge the network

(15) Design of buried blind orifice plate

The significance of design of buried blind hole plate: a. Increase the density of multilayer board by more than 30%, reduce the number of layers of multilayer board and reduce the size of b. Ingantaccen aikin PCB, musamman kulawar rashin halayyar halayyar (raguwar waya, raguwar buɗe ido) c. Inganta ‘yancin ƙirar ƙirar PCB d. rage albarkatun kasa da farashi, mai dacewa da kare muhalli. Wasu kuma suna danganta matsalolin ga halayen aiki, wanda galibi matsalar mutum ce.

Rashin tsari

As the saying goes, “If a man does not plan ahead, trouble will find him. “This certainly applies to PCB design as well. Ofaya daga cikin matakai da yawa waɗanda ke sa ƙirar PCB ta yi nasara shine zaɓin kayan aikin da suka dace. Today’s PCB design engineers can find many powerful and easy-to-use EDA suites on the market. Kowannensu yana da nasa keɓaɓɓiyar damar, ƙarfi da iyakancewa. It should also be noted that no software is foolproof, so problems such as component packaging mismatches are bound to occur. Yana yiwuwa babu wani kayan aiki guda ɗaya da zai cika duk buƙatunku, amma har yanzu dole ne ku yi binciken ku kafin ku yi ƙoƙarin gano abin da ya fi dacewa da buƙatun ku. Wasu bayanai akan Intanet na iya taimaka muku farawa da sauri.

Rashin sadarwa

While the practice of outsourcing PCB design to other vendors is becoming more common and often very cost-effective, it may not be appropriate for complex PCB designs where performance and reliability are critical. As design complexity increases, face-to-face communication between engineers and PCB designers becomes important in order to ensure accurate component layout and wiring in real time. This face-to-face communication can help save costly rework later.

Hakanan yana da mahimmanci a gayyaci masana’antun hukumar PCB a farkon tsarin ƙira. They can provide initial feedback on your design, and they can maximize efficiency based on their processes and procedures, which will save you considerable time and money in the long run. Ta hanyar sanar da su makasudin ƙirar ku da gayyatar su don shiga cikin farkon matakan shimfidar PCB, zaku iya guje wa duk wata matsala kafin samfurin ya shiga samarwa kuma ya rage lokacin zuwa kasuwa.

Ba a yi nasarar gwada samfuran farkon ba

Allon allo yana ba ku damar tabbatar da cewa ƙirar ku tana aiki daidai da takamaiman asali. Prototype testing allows you to verify the functionality and quality of a PCB and its performance prior to mass production. Successful prototyping takes a lot of time and experience, but a strong test plan and a clear set of goals can shorten evaluation time and also reduce the likelihood of production-related errors. If any problems are found during prototype testing, a second test is performed on the reconfigured board. Ta hanyar haɗa abubuwan haɗari masu haɗari a farkon tsarin ƙira, za ku amfana daga maimaita gwaji da yawa, gano duk wata matsala da wuri, rage haɗarin, da tabbatar da cewa an kammala shirin akan lokaci.

Use inefficient layout techniques or incorrect components

Smaller, faster devices allow PCB design engineers to lay out complex designs that use smaller components to reduce footprint and place them closer together. Using technologies such as embedded discrete devices on internal PCB layers, or ball Grid array (BGA) packages with less pin spacing, will help reduce board size, improve performance, and preserve space for rework if problems occur. Lokacin amfani da abubuwan haɗin gwiwa tare da ƙidaya babban fil da ƙaramin tazara, yana da mahimmanci a zaɓi madaidaicin tsarin katako a lokacin ƙira don gujewa matsaloli daga baya kuma rage farashin ƙira. Also, be sure to carefully study the range and performance characteristics of the alternatives you plan to use, even those labeled as drop-in replacements. A small change in the characteristics of a replacement component can be enough to screw up the performance of an entire design.

Forget to back up important data for your work backup. Ina bukatan tunatar da ku? At the very least, you should back up your most important work and other hard-to-replace files. Yayinda yawancin kamfanoni ke adana duk bayanan su a kullun, wasu ƙananan kamfanoni na iya yin wannan, ko da kuna aiki daga gida. Today, it’s so easy and cheap to back up your data to the cloud that there’s no excuse not to back it up and store it in a secure location to protect it from theft, fire, and other local disasters.

Become a one-man island

Duk da kuna iya tunanin ƙirar ku ba ta da aibi kuma yin kuskure ba kawai salon ku ba ne, sau da yawa takwarorinku za su ga kurakurai a ƙirar ku waɗanda ba ku lura da su ba. Wani lokaci, koda kun san cikakkun bayanai na ƙira, mutanen da ba su da alaƙa da shi na iya iya riƙe haƙiƙanin haƙiƙa kuma su ba da fa’ida mai mahimmanci. Regular review of your design with your peers can help spot unforeseen problems and keep your plan on track to stay within budget. Tabbas, kurakurai babu makawa, amma idan kuka koya daga gare su, zaku iya tsara babban samfuri a gaba.