I. Common errors in schematic diagrams

(2) Component out of bounds: component is not created in the center of component library diagram paper.

(3) The created project file network table can only be partially loaded into PCB: Global ha ea ka ea khethoa ha lethathamo le hlahisoa.

(4) Le ka mohla u se ke ua sebelisa Annotate ha u sebelisa likarolo tse ngata tse iketselitseng.

Common errors in PCB

(1) When the network is loaded, it is reported that NODE is not found a. Components in the schematic diagram use packages that are not in the PCB library; B. Components in the schematic diagram use packages with different names in the PCB library; Likarolo tse litšoantšong tse hlophisitsoeng li sebelisa lipakana tse nang le linomoro tsa PIN tse sa lumellaneng laeboraring ea PCB. Mohlala, triode: linomoro tsa pin ho SCH ke e, b, c, le 1,2,3 ho PCB.

(2) Always cannot print to a page when printing

Laeborari ea PCB ha e simolohe ha e theoa; B. Ho na le litlhaku tse patehileng kantle ho meeli ea boto ea PCB kamora ho tsamaisa le ho potoloha likarolo bakeng sa makhetlo a mangata. Khetha bonts’a litlhaku tsohle tse patiloeng, fokotsa PCB, ebe u tsamaisa litlhaku kahare ho moeli.

(3) Marangrang a tlalehang DRC a arotsoe likarolo tse ‘maloa:

Sena se supa hore marang-rang ha A hokahane. Sheba faele ea tlaleho ebe u khetha KOPORI E HUMANITSOENG ho etsa lipatlisiso.

Haeba moralo o rarahaneng ho feta, leka ho se sebelise wiring e ikemetseng.

Common mistakes in PCB manufacturing process

(1) pad e kopana le a. Etsa mokoti o boima, ha o cheka ka lebaka la masoba a mangata ka sekoting a bakoang ke ho cheka le ho senyeha ha mokoti.

B. Ka lebokoseng le nang le mekhahlelo e mengata, ho na le li-disk tse kopanyang le li-disk tsa ho itšehla thajana boemong bo le bong, ‘me boto e itšoara joaloka • phoso ea ho itšehla thajana le ho hokahanya.

(2) Ts’ebeliso ea lera la lits’oants’o ha e ea lekanngoa. E tlola moralo o tloaelehileng, joalo ka moralo oa karolo ea karolo e ka tlase ea lera, mochini o kopanyang oa welding mokatong oa TOP, o baka ho se utloisisane.

B. There is a lot of design junk on each layer, such as broken lines, useless borders, annotations, etc.

(3) Unreasonable characters a. Characters cover SMD welds, which brings inconvenience to PCB on-off detection and component welding.

Litlhaku li nyane haholo, ho baka mathata a khatiso ea skrineng, litlhaku tse kholo haholo lia kopana, ho thata ho khetholla, fonte e akaretsang> 40 sekete

(4) Single-sided pads set aperture a. Single-sided pads generally do not drill holes, the aperture should be designed to be zero, otherwise in the production of drilling data, the location of the hole coordinates. Special instructions should be given for drilling holes.

B. Haeba pad e lehlakore le le leng e hloka ho cheka, empa lesoba ha lea etsoa, ​​software e tla tšoara pad joalo ka pad ea SMT ha e hlahisa data ea motlakase le ea sebopeho, mme lera le kahare le tla lahla sethala sa ho itšehla thajana.

(5) Draw the pad with a filling block

Ka tsela ena, leha e ka feta tlhahlobo ea DRC, e ke ke ea hlahisa tlhaiso-leseling ea solder nakong ea ts’ebetso, ‘me pad e koahetsoe ke ho hanyetsa ha solder ebile e ke ke ea ts’oaroa.

(6) The electric stratum is designed with both heat sink plate and signal line, and the positive and negative images are designed together, causing errors.

(7) Sebaka se seholo sa gridi ea sebaka se nyane haholo

Grid line spacing < 0.3mm, ts’ebetsong ea tlhahiso ea PCB, ts’ebetso ea phetiso e hlakileng e hlahisa filimi e robehileng kamora ho nts’etsapele, ho fella ka ho robeha ha terata. Ntlafatsa bothata ba ts’ebetso.

(8) The graph is too close to the outer frame

The spacing should be more than 0.2mm at least (more than 0.35mm at V-cut), otherwise the copper foil will warp and solder resist will fall off during the appearance processing. Affect the appearance quality (including the inner copper skin of the multilayer panel).

(9) The outline frame design is not clear

Likarolo tse ngata li entsoe ka liforeimi, tse sa tsamaellaneng, e leng ho thatafalletsang baetsi ba PCB ho tseba hore na ke mola ofe o lokelang ho theoa. Foreime e tloaelehileng e lokela ho etsoa mohatong oa mochini kapa lehong la BOARD, ‘me boemo ba ka hare bo koahetsoeng bo lokela ho hlaka.

(10) Moralo o sa tšoaneng oa litšoantšo

When the graph electroplating, the current distribution is uneven, affecting the coating uniform, even cause warpage.

(11) Mokoti o mokhutšoane

Bolelele / bophara ba lesoba le sebopeho se ikhethileng e lokela ho ba> 2: 1, bophara & gt; 1.0mm, otherwise CNC drilling machine can not process.

(12) No milling shape positioning hole is designed

Design at least 2 diameters in PCB if possible. Lesoba 1.5mm boemo.

(13) The aperture is not clearly marked

A. Aperture should be marked in metric system as far as possible and increase by 0.05. B. As far as possible to merge the aperture into a reservoir area. C. Whether the tolerance of metallized holes and special holes (such as crimping holes) is clearly marked.

(14) The inner layer of the multilayer is unreasonable

A. The heat dissipation pad is placed on the isolation belt. It may fail to connect after drilling. B. Moralo oa lebanta le itšehlang thajana ha oa ngoloa ebile ho bonolo ho utloisisoa. C. The isolation belt is too narrow to accurately judge the network

(15) Design of buried blind orifice plate

The significance of design of buried blind hole plate: a. Increase the density of multilayer board by more than 30%, reduce the number of layers of multilayer board and reduce the size of b. Ts’ebetso e ntlafalitsoeng ea PCB, haholo taolo ea tšebetso ea tšebetso ea motlakase (ho khutsufatsa terata, phokotso ea lesoba) c. Ntlafatsa tokoloho ea moralo oa PCB d. fokotsa thepa le litšenyehelo tse tala, tse loketseng ho sireletsa tikoloho. Ba bang ba re mathata ke mekhoa ea ho sebetsa, eo hangata e leng bothata ba motho.

Ho hloka moralo

As the saying goes, “If a man does not plan ahead, trouble will find him. “This certainly applies to PCB design as well. E ‘ngoe ea mehato e mengata e etsang hore moralo oa PCB o atlehe ke ho khetha sesebelisoa se nepahetseng. Today’s PCB design engineers can find many powerful and easy-to-use EDA suites on the market. E ‘ngoe le e’ ngoe e na le bokhoni ba eona bo ikhethang, matla le mefokolo. It should also be noted that no software is foolproof, so problems such as component packaging mismatches are bound to occur. Ho ka etsahala hore ebe ha ho sesebelisoa se le seng se tla fihlela litlhoko tsohle tsa hau, empa o ntse o tlameha ho etsa lipatlisiso tsa hau esale pele mme o leke ho tseba se loketseng litlhoko tsa hau. Lintlha tse ling tse fumanehang inthaneteng li ka u thusa ho qala kapele.

Puisano e mpe

While the practice of outsourcing PCB design to other vendors is becoming more common and often very cost-effective, it may not be appropriate for complex PCB designs where performance and reliability are critical. As design complexity increases, face-to-face communication between engineers and PCB designers becomes important in order to ensure accurate component layout and wiring in real time. This face-to-face communication can help save costly rework later.

Ho bohlokoa hape ho mema baetsi ba boto ea PCB pejana ts’ebetsong ea moralo. They can provide initial feedback on your design, and they can maximize efficiency based on their processes and procedures, which will save you considerable time and money in the long run. Ka ho ba tsebisa sepheo sa hau sa moralo le ho ba memela ho nka karolo mekhahlelong ea pele ea moralo oa PCB, o ka qoba mathata afe kapa afe a ka bang teng pele sehlahisoa se qala ho hlahisa le ho khutsufatsa nako ea ho se rekisa.

E hlolehile ho hlahloba ka botlalo mefuta ea khale

Meetso ea liboto e u lumella ho paka hore moralo oa hau o sebetsa ho latela litlhaloso tsa mantlha. Prototype testing allows you to verify the functionality and quality of a PCB and its performance prior to mass production. Successful prototyping takes a lot of time and experience, but a strong test plan and a clear set of goals can shorten evaluation time and also reduce the likelihood of production-related errors. If any problems are found during prototype testing, a second test is performed on the reconfigured board. Ka ho kenyelletsa mabaka a kotsi a maholo ts’ebetsong ea meralo, o tla una molemo ka makhetlo a mangata a liteko, ho supa mathata afe kapa afe a ka bang teng kapele, ho fokotsa likotsi, le ho netefatsa hore moralo o phetheloa ka nako.

Use inefficient layout techniques or incorrect components

Lisebelisoa tse nyane, tse potlakileng li lumella lienjineri tsa moralo oa PCB ho rala meralo e rarahaneng e sebelisang likaroloana tse nyane ho fokotsa leoto le ho li beha haufi. Using technologies such as embedded discrete devices on internal PCB layers, or ball Grid array (BGA) packages with less pin spacing, will help reduce board size, improve performance, and preserve space for rework if problems occur. Ha e sebelisoa le likarolo tse nang le palo e phahameng ea pini le sebaka se senyane, ho bohlokoa ho khetha mokhoa o nepahetseng oa sebopeho sa boto ka nako ea moralo ho qoba mathata hamorao le ho fokotsa litšenyehelo tsa tlhahiso. Hape, etsa bonnete ba hore u ithuta ka hloko mefuta le litšobotsi tsa tšebetso tsa mekhoa e meng eo u rerileng ho e sebelisa, esita le tse ngotsoeng e le tse nkeloang sebaka. A small change in the characteristics of a replacement component can be enough to screw up the performance of an entire design.

Lebala ho boloka data ea bohlokoa bakeng sa backup ea hau ea mosebetsi. Ke hloka ho u hopotsa? At the very least, you should back up your most important work and other hard-to-replace files. Le ha lik’hamphani tse ngata li boloka tlhaiso-leseling ea tsona letsatsi le letsatsi, lik’hamphani tse ling tse nyane li kanna tsa se etse sena, kapa leha o sebetsa o le hae. Today, it’s so easy and cheap to back up your data to the cloud that there’s no excuse not to back it up and store it in a secure location to protect it from theft, fire, and other local disasters.

Become a one-man island

Ha u ntse u ka nahana hore moralo oa hau ha o na sekoli mme ho etsa liphoso ha se setaele sa hau, hangata lithaka tsa hau li tla bona liphoso morerong oa hau tseo u sa li boneng. Ka linako tse ling, leha o tseba lintlha tse rarahaneng tsa moralo, batho ba sa o tsebeng habonolo ba ka khona ho boloka boits’oaro le ho fana ka leseli la bohlokoa. Regular review of your design with your peers can help spot unforeseen problems and keep your plan on track to stay within budget. Ke ‘nete hore liphoso li ke ke tsa qojoa, empa haeba u ithuta ho tsona, u ka etsa sehlahisoa se setle nakong e tlang.