Gudiga Circuit daabacan (PCB), oo sidoo kale loo yaqaan Guddiga Wareegga Daabacan (PCB), waxaa loo isticmaalaa in lagu xiro oo lagu shaqeeyo qaybaha elektiroonigga ah waana qayb muhiim ah oo ka mid ah awoodda naqshadda Wareegga. Maqaalkani wuxuu soo bandhigi doonaa xeerarka aasaasiga ah ee qaabeynta PCB iyo fiilooyinka.

Faahfaahin xeerarka aasaasiga ah ee qaabeynta guddiga PCB iyo fiilooyinka

Basic rules of component layout

1. According to the layout of circuit modules, the related circuit to achieve the same function is called a module, the components in the circuit module should adopt the principle of nearby concentration, and the digital circuit and analog circuit should be separated;

2. Qaybaha, aaladaha iyo boolalku waa inaan lagu rakibin gudaha 3.5mm (loogu talagalay M2.5) iyo 4mm (loogu talagalay M3) agagaarka daloolada aan kor-u-qaadayn sida godadka meelaynta iyo godadka caadiga ah gudaha 1.27mm;

3. Horizontal resistance, inductor (plug-in), electrolytic capacitor and other components under the cloth hole, so as to avoid the wave soldering hole and component shell short circuit;

4. Qaybta sare ee qaybtu waxay 5mm u jirtaa cidhifka saxanka;

5. Masaafada u dhexaysa bannaanka suufka ah ee wax lagu dhejiyo iyo dhinaca sare ee walxaha gelinta ee ku dhow ayaa ka weyn 2mm;

6. Qaybaha qolofka birta ah iyo qaybaha biraha (sanduuqyada gaashaanka, iwm.) Ma taaban karaan qaybaha kale, kuma dhowaan karaan khadka daabacan, suufka, kala fogaanshuhu waa inuu ka weyn yahay 2mm. The size of positioning holes, fastener mounting holes, elliptic holes and other square holes in the plate is greater than 3mm from the plate side;

7. Qaybaha kululaynta waa inaysan u dhowaan fiilooyinka iyo walxaha kuleylka; Qalabka kuleylka sarreeya waa in si siman loo qaybiyo;

8. Godka korontada waa in lagu hagaajiyaa hareeraha looxyada daabacan intii suurtogal ah, iyo xarigga fiilooyinka ee godka korontada iyo barta baska ee ku xiran waa in lagu diyaariyo isla dhinac. Gaar ahaan, ha dhigin saldhigyada korontada iyo isku xirayaasha kale ee alxanka inta u dhexeysa isku xirayaasha si loo fududeeyo alxanka saldhigyadan iyo isku xirayaasha iyo naqshadeynta iyo fiilooyinka fiilooyinka korontada. Kala dheereynta godadka korontada iyo isku xirayaasha alxanka waa in la tixgeliyaa si loo fududeeyo gelinta iyo ka saaridda fiilooyinka korontada;

9. Qaabaynta qaybaha kale:

All IC components should be aligned unilaterally, and polarity marks of polar components should be clear. Polarity marks on the same printed board should not be more than two directions. When two directions appear, the two directions should be perpendicular to each other.

10, the surface wiring should be properly dense, when the density difference is too large should be filled with mesh copper foil, the grid is greater than 8mil (or 0.2mm);

11, the patch pad can not have through holes, so as to avoid the loss of solder paste resulting in virtual welding components. Laynka signalada ee muhiimka ah looma oggola inuu dhex maro cagta godka;

12, dhejinta isku -dhejinta hal dhinac ah, jihada dabeecadda ee is -waafaqsan, jihada baakadaha ee joogtada ah;

13. Polar devices should be marked in the same direction as far as possible on the same board.

Laba, xeerarka kaararka qayb

1. Ka soo jiido aagga xarriiqda aagga ≤1mm geeska guddiga PCB, iyo 1mm gudaha daloolka dhejinta, oo ka mamnuuc xarigga;

2. Qadka korontada sida ugu ballaaran ee suurtogalka ah, waa inuusan ka yaraan 18mil; Ballaca xariijinta calaamaddu waa inaysan ka yarayn 12mil; CPU incoming and outgoing lines should not be less than 10mil (or 8mil); Kala -dheereynta khadka aan ka yarayn 10mil;

3. Daloolka caadiga ah oo aan ka yarayn 30mil;

4. Gelinta xariiqa laba -laab: suuf 60mil, dalool 40mil;

1/4W iska caabin: 51*55mil (0805 xaashi); Suunka gelinta tooska ah 62mil, daloolka 42mil;

Awoodda aan dabaysha lahayn: 51*55mil (xaashi 0805); Suunka gelinta tooska ah 50mil, daloolka 28mil;

5. Xusuusnow in fiilooyinka korontada iyo fiilooyinka dhulka ay ahaadaan kuwo radial ah intii suurtogal ah, fiilooyinka signal -na aan la kala bixin.

Sidee loo hagaajiyaa awoodda ka-hortagga ka-hortagga iyo is-waafajinta elektromagnetigga?

Sidee loo hagaajiyaa awoodda ka-hortagga ka-hortagga iyo is-waafajinta elektromagnetic-ka marka la soo saarayo alaabada elektiroonigga ah ee leh processor?

1. Qaar ka mid ah hababka soo socda waa inay fiiro gaar ah siiyaan faragelinta ka hortagga korontada:

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(2) Nidaamku wuxuu ka kooban yahay awood aad u sarreeya, wareegga wadista-hadda-sare, sida dhimbiil dhalinta gudbinta, beddelka hadda jira, iwm.

(3) nidaamka leh wareegga signalada analog oo daciif ah iyo wareegga beddelka A/D ee sarreeya.

2. Tallaabooyinka soo socda ayaa la qaadaa si loo kordhiyo awoodda faragelinta ka-hortagga elektromagnetka ee nidaamka:

(1) Xulo microcontroller oo leh soo noqnoqosho hoose:

Xakamaynta microcontroller oo leh soo noqnoqoshada saacad dibadeed ayaa si wax ku ool ah u yareyn karta buuqa waxayna hagaajin kartaa awoodda ka-hortagga faragelinta ee nidaamka. Mowjadda labajibbaaran iyo mowjadda sine oo leh soo noqnoqosho isku mid ah, qaybta soo noqnoqoshada sare ee mowjadda laba jibbaaranku aad bay uga badan tahay mawjadda sine. In kasta oo baaxadda qaybta soo noqnoqoshada sare ee mawjadda laba jibbaaran ay ka yar tahay tan mawjada aasaasiga ah, inta jeer ee saraysa, way fududahay in la soo saaro oo la noqdo il buuq. Saameynta ugu badan ee saamaynta badan leh ee ay soo saarto microcontroller -ku waa qiyaastii 3 jeer inta jeer ee saacadda.

(2) Yaree dhalanrogidda gudbinta signalada

Microcontrollers waxaa inta badan soo saara farsamada CMOS ee xawaaraha sare leh. Static input current signal input at about 1 ma, around ten pf in the input capacitance, high input impedance, high speed CMOS circuit outputs are fairly on load capacity, namely the considerable output value, the output end of a door through a very long lead to the high input, the input impedance reflection problem is very serious, it will cause the signal distortion, Kordhi qaylada nidaamka. Marka Tpd “Tr”, ay noqoto dhibaato xariijinta gudbinta, waa inay tixgelisaa milicsiga signalada, isbarbar dhigga impedance iyo wixii la mid ah.

Waqtiga dib -u -dhigga ee calaamadda ku qoran sabuuradda daabacan waxay la xiriirtaa carqaladeynta dabeecadda ee macdanta, taas oo ah, joogteynta dielectric ee walxaha guddiga daabacan. Calaamadaha ayaa si qumman loo tixgelin karaa inay u safraan inta u dhexeysa 1/3 iyo 1/2 xawaaraha iftiinka ee PCB -ga. Tr (waqtiga dib -u -dhigista caadiga ah) ee walxaha taleefanka macquulka ah ee sida badan loo isticmaalo nidaamyada ka kooban microcontrollers wuxuu u dhexeeyaa 3 iyo 18ns.

Boodhka wareegga ee daabacan, signalada ayaa ka gudubta iska-caabbinta 7W iyo hoggaanka 25cm, iyada oo dib-u-dhac ku yimid khadka tooska ah qiyaastii 4 illaa 20ns. That is to say, the signal on the printed line lead as short as possible, the longest should not exceed 25cm. Iyo tirada godadka waa inay ahaadaan kuwa ugu yar ee suurtogalka ah, doorbidaya inaysan ka badnayn 2.

Marka waqtiga kor -u -kaca calaamaddu uu ka dhakhso badan yahay waqtiga dib -u -dhigga signalada, elektaroonigga degdegga ah ayaa la adeegsadaa. Waqtigan xaadirka ah, isbarbar dhigga isbarbar -dhigga ee khadka gudbinta waa in la tixgeliyaa. Isgaarsiinta signalada ee u dhexeysa baloogyo isku dhafan oo ku yaal guddiyada wareegga daabacan, Td Trd waa in laga fogaadaa. Marka la weyneeyo guddiga wareegga ee daabacan, si degdeg ah nidaamku ma noqon karo mid aad u degdeg badan.