Ishicilelwe Circuit Board (PCB), eyaziwa nangokuthi Ibhodi Lesifunda Eliphrintiwe (PCB), isetshenziselwa ukuxhuma nokusebenzisa izingxenye ze-elekthronikhi futhi iyingxenye ebalulekile yomklamo wesekethe wamandla. Le ndatshana izokwethula imithetho eyisisekelo yokwakheka kwe-PCB nezintambo.

Imininingwane ngemithetho eyisisekelo yesakhiwo sebhodi le-PCB kanye nezintambo

Basic rules of component layout

1. According to the layout of circuit modules, the related circuit to achieve the same function is called a module, the components in the circuit module should adopt the principle of nearby concentration, and the digital circuit and analog circuit should be separated;

2. Izingxenye, amadivayisi nezikulufo ngeke zifakwe ngaphakathi kwe-3.5mm (ye-M2.5) ne-4mm (ye-M3) ezungeze izimbobo ezingafakwanga njengezimbobo zokubeka nezimbobo ezijwayelekile ngaphakathi kwe-1.27mm;

3. Horizontal resistance, inductor (plug-in), electrolytic capacitor and other components under the cloth hole, so as to avoid the wave soldering hole and component shell short circuit;

4. Ingxenye yangaphandle yengxenye iqhele ngo-5mm kusukela emaphethelweni epuleti;

5. Ibanga phakathi kohlangothi olungaphandle kwephedi lokufaka into nohlangothi olungaphandle lwento yokufaka eseduze likhulu kuno-2mm;

6. Izingxenye zegobolondo lensimbi nezingxenye zensimbi (amabhokisi okuvikela, njll.) azikwazi ukuthinta ezinye izingxenye, azikwazi ukusondela kumugqa ophrintiwe, iphedi, isikhala kufanele sibe sikhulu kuno-2mm. The size of positioning holes, fastener mounting holes, elliptic holes and other square holes in the plate is greater than 3mm from the plate side;

7. Izinto zokufudumeza akufanele zisondele ezintanjeni nasezintweni ezishisayo; Amadivayisi ashisa kakhulu kufanele asatshalaliswe ngokulinganayo;

8. Isokhethi kagesi kufanele ihlelwe ibhodi ephrintiwe ngangokunokwenzeka, futhi i-wiring terminal yesokhethi yamandla kanye nebhasi exhunywe kuyo kufanele ihlelwe ohlangothini olufanayo. Ikakhulu, ungafaki amasokhethi kagesi nezinye izixhumi zensimbi phakathi kwezixhumi ukwenza lula ukushisela kwalezi zinyawo nezixhumi kanye nokwakhiwa nokuxhunywa kwezintambo zikagesi. Isikhala samasokhethi kagesi kanye nezixhumi ze-welding kufanele kubhekwe ukwenza lula ukufakwa nokususwa kwamaplagi kagesi;

9. Ukwakheka kwezinye izingxenye:

All IC components should be aligned unilaterally, and polarity marks of polar components should be clear. Polarity marks on the same printed board should not be more than two directions. When two directions appear, the two directions should be perpendicular to each other.

10, the surface wiring should be properly dense, when the density difference is too large should be filled with mesh copper foil, the grid is greater than 8mil (or 0.2mm);

11, the patch pad can not have through holes, so as to avoid the loss of solder paste resulting in virtual welding components. Umugqa wesignali obalulekile awuvunyelwe ukudlula unyawo lwesokhethi;

I-12, i-patch unilateral ukuqondanisa, ukuqondiswa kwezinhlamvu okungaguquguquki, ukuqondiswa kokupakisha okungaguquguquki;

13. Izinsimbi zePolar kufanele zimakwe ngendlela efanayo ngangokunokwenzeka ebhodini elilodwa.

Okwesibili, imithetho ye-wiring yengxenye

1. Dweba indawo yezintambo ngaphakathi kwendawo ≤1mm kusuka onqenqemeni lwebhodi le-PCB, nangaphakathi kwe-1mm ezungeze imbobo ekhuphukayo, futhi unqabe izintambo;

2. Intambo kagesi ububanzi ngangokunokwenzeka, akufanele ibe ngaphansi kuka-18mil; Ububanzi bomugqa wesiginali akufanele ube ngaphansi kuka-12mil; CPU incoming and outgoing lines should not be less than 10mil (or 8mil); Line izikhala ezingekho ngaphansi kuka-10mil;

3. Imbobo evamile ayikho ngaphansi kuka-30mil;

4. Faka imigqa emibili: iphedi engu-60mil, indawo yokuvula engu-40mil;

1/4W ukumelana: 51 * 55mil (0805 ishidi); Ukufakwa okuqondile pad 62mil, ukuvula 42mil;

I-Non-polar capacitor: 51 * 55mil (ishidi le-0805); Ukufakwa okuqondile pad 50mil, ukuvula 28mil;

5. Qaphela ukuthi izintambo zikagesi nezintambo zomhlabathi kufanele zisabalale ngangokunokwenzeka, futhi izintambo zesiginali akufanele zivulwe.

Ungalithuthukisa kanjani ikhono lokulwa nokuphazamiseka nokuhambisana kwe-electromagnetic?

Ungalithuthukisa kanjani ikhono lokulwa nokuphazamiseka kanye nokuhambisana kwe-electromagnetic lapho uthuthukisa imikhiqizo ye-elekthronikhi ngeprosesa?

1. Ezinye zalezi zinhlelo ezilandelayo kufanele zinake kakhulu ukuphazanyiswa kwamandla kagesi:

(1) imvamisa yewashi le-microcontroller iphezulu kakhulu, umjikelezo webhasi uhlelo olusheshayo ikakhulukazi.

(2) Uhlelo luqukethe amandla aphezulu, isekethe yokushayela yamanje, njenge-spark generating relay, iswishi yamanje, njll.

(3) uhlelo olunesekethe yesiginali ye-analog ebuthakathaka nokunemba okuphezulu kwesifunda sokuguqula i-A / D.

2. Izinyathelo ezilandelayo zithathwa ukukhulisa amandla okuphazamisa ugesi ngohlelo:

(1) Khetha i-microcontroller enemvamisa ephansi:

I-microcontroller enezinga eliphansi lewashi langaphandle inganciphisa ngempumelelo umsindo futhi ithuthukise ikhono lokulwa nokuphazamiseka kohlelo. I-wave wave ne-sine wave enemvamisa efanayo, ingxenye ephezulu yemvamisa yesikwele wave ingaphezulu kakhulu kwe-sine wave. Nakuba i-amplitude yengxenye yemvamisa ephezulu yegagasi lesikwele incane kunaleyo yegagasi eliyisisekelo, uma iphakama imvamisa, kuba lula ukuyikhipha futhi ibe umthombo womsindo. Umsindo onemvamisa ephezulu kakhulu okhiqizwa yi-microcontroller ucishe ube kathathu kubuningi bewashi.

(2) Nciphisa ukuphazamiseka kokudluliswa kwesiginali

Ama-Microcontroller akhiqizwa ikakhulukazi ubuchwepheshe be-CMOS obunesivinini esikhulu. Static input current signal input at about 1 ma, around ten pf in the input capacitance, high input impedance, high speed CMOS circuit outputs are fairly on load capacity, namely the considerable output value, the output end of a door through a very long lead to the high input, the input impedance reflection problem is very serious, it will cause the signal distortion, Khulisa umsindo wesistimu. Lapho i-Tpd “Tr”, iba yinkinga yolayini wokudlulisa, kufanele icabangele ukukhonjiswa kwesiginali, ukufana kwe-impedance njalonjalo.

Isikhathi sokulibaziseka sesiginali ebhodini eliphrintiwe sihlobene nesici sokuvimbela ukuhola, okungukuthi, ku-dielectric constant of the printed board material. Amasignali cishe angabhekwa njengokuhamba phakathi kwe-1/3 kanye ne-1/2 isivinini sokukhanya ngaphezu kwemikhondo ye-PCB. I-Tr (isikhathi sokulibaziseka esivamile) sezinto zocingo ezinengqondo ezivame ukusetshenziswa kumasistimu enziwe ama-microcontroller iphakathi kuka-3 no-18ns.

Ebhodini lesifunda eliphrintiwe, isignali idlula kokumelana ne-7W kanye nokuhola okungu-25cm, nokubambezeleka okuku-inthanethi okungaba ngu-4 kuya ku-20ns. That is to say, the signal on the printed line lead as short as possible, the longest should not exceed 25cm. Futhi inani lemigodi kufanele libe lincane ngangokunokwenzeka, okungcono lingabi ngaphezu kuka-2.

Uma isikhathi sokukhuphuka kwesignali sishesha kunesikhathi sokulibaziseka kwesignali, kusetshenziswa ama-electronics asheshayo. Kuleli qophelo, ukufaniswa kwe-impedance kolayini wokuhambisa kufanele kubhekwe. Ngokudluliswa kwesignali phakathi kwamabhulokhi ahlanganisiwe ebhodini lesifunda PRINTED, i-Td Trd kufanele igwenywe. Ibhodi lesifunda eliphrintiwe likhulu, isistimu ayikwazi ukushesha kakhulu.