OSP tsarin Kwamitin PCB

1. Banda mai

Sakamakon cire man fetur kai tsaye yana rinjayar ingancin samar da fim. Rashin cire mai, kaurin fim ɗin ba iri ɗaya bane. A gefe guda, ana iya sarrafa ƙaddamarwa a cikin kewayon tsari ta hanyar nazarin mafita. A daya bangaren kuma, ya kamata a rika bincika ko tasirin cire mai yana da kyau, idan tasirin cire mai bai yi kyau ba, sai a canza shi cikin lokaci ban da mai.

2. Micro zaizayar kasa

Manufar microetching shine don samar da wani m jan karfe surface don sauƙi samuwar fim. Kauri na micro-etching kai tsaye yana rinjayar adadin samar da fim, don haka yana da matukar muhimmanci a kiyaye kwanciyar hankali na kauri mai kauri don samar da kauri mai tsayi. Gabaɗaya, ya dace don sarrafa kauri na microetching a 1.0-1.5um. Kafin kowane motsi, ana iya auna ma’auni na ƙananan ƙwayoyin cuta, kuma za’a iya ƙayyade lokacin ƙayyadaddun ƙayyadaddun ƙayyadaddun ƙwayar ƙwayar cuta.

3. A cikin fim

Ya kamata a yi amfani da ruwan DI don wankewa kafin ƙirƙirar fim don hana gurɓatar ruwa mai samar da fim. Hakanan ya kamata a yi amfani da ruwan DI don wankewa bayan ƙirƙirar fim, kuma yakamata a sarrafa ƙimar PH tsakanin 4.0 da 7.0 don hana fim ɗin daga gurbatawa da lalacewa. Makullin tsarin OSP shine don sarrafa kauri na fim din anti-oxidation. Fim ɗin yana da bakin ciki sosai kuma yana da ƙarancin tasirin zafi. A reflow waldi, fim ba zai iya jure high zafin jiki (190-200 ° C), wanda a ƙarshe ya shafi aikin walda. A cikin layin haɗin lantarki, fim ɗin ba za a iya narkar da shi da kyau ta hanyar juyi ba, wanda ke shafar aikin walda. Babban kauri na fim ɗin sarrafawa ya fi dacewa tsakanin 0.2-0.5um.