OSP kaʻina o Papa PCB

1. In addition to the oil

The effect of oil removal directly affects the film forming quality. Poor oil removal, the film thickness is not uniform. On the one hand, the concentration can be controlled within the process range by analyzing the solution. On the other hand, also should often check whether the effect of oil removal is good, if the effect of oil removal is not good, it should be replaced in time in addition to oil.

2. Micro erosion

The purpose of microetching is to form a rough copper surface for easy film formation. The thickness of micro-etching directly affects the film forming rate, so it is very important to keep the stability of micro-etching thickness to form a stable film thickness. ʻO ka maʻamau, kūpono ke kāohi i ka mānoanoa microetching ma 1.0-1.5um. Before each shift, the micro-erosion rate can be measured, and the micro-erosion time can be determined according to the micro-erosion rate.

3. I loko o kahi kiʻiʻoniʻoni

DI water should be used for washing before film formation to prevent contamination of film forming liquid. Pono e hoʻohana ʻia ka wai DI no ka holoi ʻana ma hope o ka hoʻokumu ʻia ʻana o ke kiʻiʻoniʻoni, a pono e hoʻomalu ʻia ka waiwai PH ma waena o 4.0 a me 7.0 i mea e pale ai i ke kiʻiʻoniʻoni mai ka haumia a me ka pōʻino. The key of OSP process is to control the thickness of anti-oxidation film. He lahilahi loa ke kiʻiʻoniʻoni a maikaʻi ʻole ka hopena wela. I ka reflow welding, ʻaʻole hiki i ke kiʻiʻoniʻoni ke kū i ke kiʻekiʻe kiʻekiʻe (190-200 ° C), ka hopena hope loa i ka hana kuʻi. I ka laina hui uila, ʻaʻole hiki ke hoʻoheheʻe maikaʻi ʻia ke kiʻi e ka flux, e pili ana i ka hana kuʻi. The general control film thickness is more appropriate between 0.2-0.5um.