Inkqubo ye-OSP Ibhodi PCB

1. Ukongeza kwioli

Iziphumo zokususa ioyile zichaphazela ngokuthe ngqo umgangatho wokwenza ifilimu. Ukususwa kakubi kweoli, ubukhulu befilimu abufani. Ngakolunye uhlangothi, ugxininiso lunokulawulwa ngaphakathi kwinqanaba lenkqubo ngokuhlalutya isisombululo. Kwelinye icala, kwakhona kufuneka rhoqo ukujonga ukuba isiphumo ukususwa ioli ilungile, ukuba isiphumo ukususwa ioli akulunganga, kufuneka itshintshwe ngexesha ukongeza ioli.

2. Ukhukuliseko oluncinci

Injongo yokwenza i-microetching kukwenza umphezulu wobhedu obukhali ukuze kwenziwe ifilimu ngokulula. Ubukhulu be-micro-etching buchaphazela ngokuthe ngqo isantya sokwenza ifilimu, ngoko kubaluleke kakhulu ukugcina uzinzo lwe-micro-etching thickness ukwenza ifilimu ezinzileyo. Ngokubanzi, kufanelekile ukulawula ubukhulu be-microetching kwi-1.0-1.5um. Ngaphambi kwenguqu nganye, izinga lokunyuka kwe-micro-rosion linokulinganiswa, kwaye ixesha lokunyuka kwe-micro-rosion linokumiselwa ngokwezinga le-micro-rosion.

3. Kwifilimu

Amanzi e-DI kufuneka asetyenziselwe ukuhlamba phambi kokwenziwa kwefilimu ukuthintela ukungcoliseka kolwelo oluyifilim. Amanzi e-DI kufuneka asetyenziswe kwakhona ukuhlamba emva kokubunjwa kwefilimu, kwaye ixabiso le-PH kufuneka lilawulwe phakathi kwe-4.0 kunye ne-7.0 ukukhusela ifilimu ukuba ingangcoliswa kwaye yonakaliswe. Isitshixo senkqubo ye-OSP kukulawula ubukhulu befilimu ye-anti-oxidation. Ifilim ibhityile kakhulu kwaye inefuthe elibi lobushushu. Ekuvuseleleni ukuwelda, ifilimu ayinako ukumelana nobushushu obuphezulu (190-200 ° C), ethi ekugqibeleni ichaphazele ukusebenza kwe-welding. Kumgca wendibano ye-elektroniki, ifilimu ayinakuchithwa kakuhle kukuhamba, okuchaphazela ukusebenza kwe-welding. Ukulawula ubukhulu befilimu kufanelekile phakathi kwe-0.2-0.5um.