Inqubo ye-OSP PCB ibhodi

1. Ngaphezu kukawoyela

Umphumela wokususwa kukawoyela uthinta ngqo ikhwalithi yokwakha ifilimu. Ukususwa kabi kukawoyela, ukushuba kwefilimu akufani. Ngakolunye uhlangothi, ukugxilisa ingqondo kungalawulwa ngaphakathi kohlu lwenqubo ngokuhlaziya isisombululo. Ngakolunye uhlangothi, futhi kufanele kuvame ukuhlola ukuthi umphumela wokususwa kwamafutha muhle, uma umphumela wokususwa kwamafutha ungalungile, kufanele ushintshwe ngesikhathi ngaphezu kwamafutha.

2. Ukuguguleka okuncane

Inhloso ye-microetching ukwenza indawo yethusi eqinile ukuze kube lula ukwakheka kwefilimu. Ugqinsi lwe-micro-etching luthinta ngqo izinga lokubunjwa kwefilimu, ngakho-ke kubaluleke kakhulu ukugcina ukuzinza kokuqina kwe-micro-etching ukuze kwakheke ukujiya kwefilimu okuzinzile. Ngokuvamile, kufanelekile ukulawula ubukhulu be-microetching ku-1.0-1.5um. Ngaphambi kokushintsha ngakunye, izinga lokuguguleka okuncane lingalinganiswa, futhi isikhathi sokuguguleka okuncane singanqunywa ngokwezinga lokuguguleka okuncane.

3. Ngefilimu

Amanzi e-DI kufanele asetshenziselwe ukugeza ngaphambi kokwakhiwa kwefilimu ukuvimbela ukungcoliswa koketshezi okwakha ifilimu. Amanzi we-DI kufanele futhi asetshenziselwe ukuwasha ngemuva kokwakhiwa kwefilimu, futhi inani le-PH kufanele lilawulwe phakathi kuka-4.0 no-7.0 ukuvikela ifilimu ukuthi ingangcoliswa futhi ilimale. Ukhiye wenqubo ye-OSP ukulawula ukushuba kwefilimu elwa ne-oxidation. Ifilimu mncane kakhulu futhi inekhono elibi lokushisa elishisayo. Ku-reflow welding, ifilimu ayikwazi ukumelana nokushisa okuphezulu (190-200 ° C), okuthinta ekugcineni ukusebenza kokushisela. Emgqeni womhlangano we-elekthronikhi, ifilimu ayikwazi ukuncibilikiswa kahle yi-flux, ethinta ukusebenza kwe-welding. Ubukhulu befilimu bokulawula bufaneleka kakhulu phakathi kuka-0.2-0.5um.