Habka OSP ee Guddiga PCB

1. Saliida ka sokow

Saamaynta ka -qaadista saliidda waxay si toos ah u saameysaa tayada sameynta filimka. Saliidda liidata, dhumucda filimku maaha mid la mid ah. Dhinaca kale, xoogga saarista waxaa lagu xakameyn karaa inta u dhaxaysa habka habka iyadoo la falanqeynayo xalka. Dhinaca kale, sidoo kale waa in inta badan la hubiyaa in saamaynta ka -saaridda saliiddu ay wanaagsan tahay, haddii saamaynta ka -saaridda saliiddu aysan fiicnayn, waa in lagu beddelaa waqtiga marka laga reebo saliidda.

2. Micro nabaad-guurka

Ujeedada microetching waa in la sameeyo dusha naxaasta qallafsan si loo sameeyo filim sahlan. Dhumucdiisuna waxay si toos ah u saameeyaa heerka samaynta filimka, sidaas darteed aad bay muhiim u tahay in la ilaaliyo xasilloonida dhumucda yar-yar si loo sameeyo dhumucda filimka xasilloon. Guud ahaan, way ku habboon tahay in la xakameeyo dhumucda microetching at 1.0-1.5um. Kahor isbeddel kasta, heerka nabaad-guurka-yar-yar waa la cabbiri karaa, iyo waqtiga nabaadguurka-yar-yar waxaa lagu go’aamin karaa iyadoo loo eegayo heerka nabaad-guurka-yar-yar.

3. Geli filim

Biyaha DI waa in lagu dhaqo ka hor sameynta filimka si looga hortago wasakheynta dareeraha sameynta filimka. Biyaha DI waa in sidoo kale loo isticmaalo dhaqidda ka dib sameynta filimka, iyo qiimaha PH waa in lagu xakameeyaa inta u dhaxaysa 4.0 iyo 7.0 si looga hortago in filimka uu wasakheeyo oo waxyeeloobo. Furaha habka OSP waa in la xakameeyo dhumucda filimka anti-oxidation. Filimku aad buu u dhuuban yahay wuxuuna leeyahay awood kulayleed liidata. In alxanka reflow, filimka uma adkeysan karo heerkulka sare (190-200 ° C), kaas oo ugu dambeyntii saameeya waxqabadka alxanka. Khadka elektaroonigga ah, filimku si fiican uma milmi karo qulqulka, kaas oo saameeya waxqabadka alxanka. Dhumucda filimka guud ee xakamaynta ayaa aad ugu habboon inta u dhaxaysa 0.2-0.5um.